{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-07-23T06:40:50.084Z","headline":"东方算芯展出全球首颗软件定义近存计算3D AI芯片DF1000，算力达520 TFLOPS","description":"东方算芯在WAIC 2026首次展出全球首颗软件定义近存计算3D AI芯片DF1000，并获2026 SAIL奖。该芯片基于全国产供应链，采用3D混合键合晶圆级堆叠，在14nm工艺下实现520 TFLOPS@BF16算力，通过软件定义芯片技术实现软硬件解耦与动态重构，旨在为AI产业提供国产算力底座。","url":"https://www.aioga.com/news/cmrprjoxj04s9bisris6ci96j/","mainEntityOfPage":"https://www.aioga.com/news/cmrprjoxj04s9bisris6ci96j/","datePublished":"2026-07-18T02:39:54.000Z","dateModified":"2026-07-18T02:39:54.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/978/368.htm","https://aihot.virxact.com/items/cmrprjoxj04s9bisris6ci96j"],"canonicalUrl":"https://www.aioga.com/news/cmrprjoxj04s9bisris6ci96j/","directAnswer":{"@type":"Answer","text":"Aioga 编辑摘要：东方算芯在WAIC 2026首次展出全球首颗软件定义近存计算3D AI芯片DF1000，并获2026 SAIL奖。 Aioga 将其归入「产品更新」方向，重点关注它对真实使用和行业竞争的影响。","url":"https://www.aioga.com/news/cmrprjoxj04s9bisris6ci96j/","dateCreated":"2026-07-18T02:39:54.000Z","author":{"@type":"Organization","@id":"https://www.aioga.com/authors/aioga-editorial/#editorial-team","name":"Aioga Editorial Team","url":"https://www.aioga.com/authors/aioga-editorial/"}},"evidence":[{"@type":"CreativeWork","name":"IT之家 source article","url":"https://www.ithome.com/0/978/368.htm","datePublished":"2026-07-18T02:39:54.000Z","provider":{"@type":"Organization","name":"IT之家","url":"https://www.ithome.com/0/978/368.htm"}},{"@type":"CreativeWork","name":"AIHot archive 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TFLOPS@BF16算力，通过软件定义芯片技术实现软硬件解耦与动态重构，旨在为AI产业提供国产算力底座。","source":"IT之家（RSS）","sourceUrl":"https://www.ithome.com/0/978/368.htm","aiHotUrl":"https://aihot.virxact.com/items/cmrprjoxj04s9bisris6ci96j","publishedAt":"2026-07-18T02:39:54.000Z","category":"产品更新","score":53,"selected":false,"articleBody":["IT之家：https://www.ithome.com/ 7 月 18 日消息，2026 世界人工智能大会（WAIC 2026）今天在上海举行。东方算芯在会上首次展出全球首颗软件定义近存计算 3D AI 芯片 ——DF1000， 并荣获 2026 SAIL 奖（卓越人工智能引领者奖） 。","据介绍，DF1000 依托全国产供应链打造， 通过空间并行与时分复用设计提升硬件利用率 ， 算力可达 520 TFLOPS 。采用 3D 混合键合技术实现晶圆级堆叠，有效提升访存带宽，降低供应链依赖，拥有自主编程框架和软件生态，可为 AI 产业提供稳定的国产算力底座。","同时，该产品以“软件定义＋3D 堆叠近存计算”的东方范式，破解了中国高端算力芯片发展面临的三大核心瓶颈。通过软件定义芯片技术实现软硬件解耦与动态重构，在 14nm 工艺节点下实现 520TFLOPS@BF16 的算力。","IT之家查询公开资料获悉，上海东方算芯科技有限公司成立于 2024 年 5 月 20 日，总部设于上海张江，在北京、南京、西安、成都、苏州、深圳等设有分部，目前团队规模超 500 人。","东方算芯宣称依托自主原创的软件定义芯片、近存计算两大核心技术，基于全国产化供应链体系，研发打造了高性能、高能效、高灵活性的大算力芯片产品，搭建自主可控的生态系统。公司产品包括软件定义超高性能近存计算芯片、基础软件与应用软件、高性能服务器和大规模集群系统解决方案等。","2026 世界人工智能大会专题：https://www.ithome.com/zt/waic2026/"],"articleImages":[{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/7/b438fd82-041a-4d51-adfe-cb2b800ca014.jpg?x-bce-process=image/format,f_auto","alt":"图片","afterParagraph":0,"url":"/media/articles/cmrprjoxj04s9bisris6ci96j/3dd57c5ceba40c56.webp"},{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/7/dce63b2c-808a-41c3-9f73-0d126f131db8.png?x-bce-process=image/auto-orient,o_1","alt":"","afterParagraph":2,"url":"/media/articles/cmrprjoxj04s9bisris6ci96j/5d7db33f7af5736d.png"}],"mediaStatus":"ok","articleBodyZh":[],"translationStatus":"","bodyOrigin":"source-page","editorial":{"summary":"Aioga 编辑摘要：东方算芯在WAIC 2026首次展出全球首颗软件定义近存计算3D AI芯片DF1000，并获2026 SAIL奖。 Aioga 将其归入「产品更新」方向，重点关注它对真实使用和行业竞争的影响。","background":"背景分析：产品与工具类动态的价值取决于它是否解决明确场景、能否进入工作流，以及交付、价格和数据安全是否可接受。","viewpoint":"Aioga 判断：这条动态更适合作为行业观察信号，当前信息足以建立线索，但不足以推导长期结论。","implications":"影响分析：对相关团队而言，短期应先核对来源、可用范围和实际成本，再判断是否值得接入或跟进。","nextStep":"后续观察：继续观察产品是否开放使用、用户反馈、定价、集成能力和后续版本更新。","evidenceRefs":["title","summary","articleBody"],"confidence":"medium","status":"published","aiGenerated":false,"autoApproved":true,"generatedBy":"rule-safe-fallback","generatedAt":"2026-07-23T06:49:19.161Z","sourceHash":"481408480715e94d","validation":{"passed":true,"mode":"rule-safe-fallback","checks":["schema","length","source-attribution","no-html"]}},"tags":["产品更新","IT之家（RSS）"],"translations":{"zh-CN":{"title":"东方算芯展出全球首颗软件定义近存计算3D AI芯片DF1000，算力达520 TFLOPS","summary":"东方算芯在WAIC 2026首次展出全球首颗软件定义近存计算3D AI芯片DF1000，并获2026 SAIL奖。该芯片基于全国产供应链，采用3D混合键合晶圆级堆叠，在14nm工艺下实现520 TFLOPS@BF16算力，通过软件定义芯片技术实现软硬件解耦与动态重构，旨在为AI产业提供国产算力底座。","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"东方算芯展出全球首颗软件定义近存计算3D AI芯片DF1000，算力达520 TFLOPS - Aioga AI资讯","description":"东方算芯在WAIC 2026首次展出全球首颗软件定义近存计算3D AI芯片DF1000，并获2026 SAIL奖。该芯片基于全国产供应链，采用3D混合键合晶圆级堆叠，在14nm工艺下实现520 TFLOPS@BF16算力，通过软件定义芯片技术实现软硬件解耦与动态重构，旨在为AI产业提供国产算力底座。","url":"https://www.aioga.com/news/cmrprjoxj04s9bisris6ci96j/"},"en":{"title":"Dongfang Suanxin showcases the world's first software-defined near-memory computing 3D AI chip DF1000, with a computing power of 520 TFLOPS","summary":"Dongfang Suanxin will debut the world's first software-defined near-memory computing 3D AI chip DF1000 at WAIC 2026 and receive the 2026 SAIL Award. The chip is based on a fully domestic supply chain and uses 3D hybrid bonded wafer-level stacking. It achieves 520 TFLOPS@BF16 computing power under a 14nm process. Through software-defined chip technology, it enables decoupling and dynamic reconfiguration of hardware and software, aiming to provide a domestic computing foundation for the AI industry.","category":"Products","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin showcases the world's first software-defined near-memory computing 3D AI chip DF1000, with a computing power of 520 TFLOPS - Aioga AI News","description":"Dongfang Suanxin will debut the world's first software-defined near-memory computing 3D AI chip DF1000 at WAIC 2026 and receive the 2026 SAIL Award. The chip is based on a fully do...","url":"https://www.aioga.com/en/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:00:08.519Z"},"ja":{"title":"東方算芯は、世界初のソフトウェア定義近接メモリ計算3D AIチップDF1000を展示し、計算能力は520 TFLOPSに達します","summary":"東方算芯はWAIC 2026で、世界初のソフトウェア定義の近接メモリ計算3D AIチップDF1000を初展示し、2026 SAIL賞を受賞した。このチップは完全国産のサプライチェーンに基づき、3Dハイブリッドボンディングのウエハーレベル積層技術を採用し、14nmプロセスで520 TFLOPS@BF16の演算能力を実現。ソフトウェア定義チップ技術により、ハードウェアとソフトウェアの分離と動的再構築を可能にし、AI産業に国産の算力基盤を提供することを目指している。","category":"製品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"東方算芯は、世界初のソフトウェア定義近接メモリ計算3D AIチップDF1000を展示し、計算能力は520 TFLOPSに達します - Aioga AIニュース","description":"東方算芯はWAIC 2026で、世界初のソフトウェア定義の近接メモリ計算3D AIチップDF1000を初展示し、2026 SAIL賞を受賞した。このチップは完全国産のサプライチェーンに基づき、3Dハイブリッドボンディングのウエハーレベル積層技術を採用し、14nmプロセスで520 TFLOPS@BF16の演算能力を実現。ソフトウェア定義チップ技術により、ハード...","url":"https://www.aioga.com/ja/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:00:20.745Z"},"ko":{"title":"동방순芯은 세계 최초의 소프트웨어 정의 근접 메모리 컴퓨팅 3D AI 칩 DF1000을 전시했으며, 연산 성능은 520 TFLOPS에 달합니다","summary":"동방산심은 WAIC 2026에서 글로벌 최초의 소프트웨어 정의 근거리 계산 3D AI 칩 DF1000을 처음 공개했으며, 2026 SAIL 상을 수상했습니다. 이 칩은 전면 국산 공급망을 기반으로 하여 3D 혼합 접합 웨이퍼 레벨 스택을 채택하고, 14nm 공정에서 520 TFLOPS@BF16 성능을 구현하며, 소프트웨어 정의 칩 기술을 통해 하드웨어와 소프트웨어의 분리 및 동적 재구성을 실현하여 AI 산업에 국산 연산 기반을 제공하는 것을 목표로 합니다.","category":"제품 업데이트","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"동방순芯은 세계 최초의 소프트웨어 정의 근접 메모리 컴퓨팅 3D AI 칩 DF1000을 전시했으며, 연산 성능은 520 TFLOPS에 달합니다 - Aioga AI 뉴스","description":"동방산심은 WAIC 2026에서 글로벌 최초의 소프트웨어 정의 근거리 계산 3D AI 칩 DF1000을 처음 공개했으며, 2026 SAIL 상을 수상했습니다. 이 칩은 전면 국산 공급망을 기반으로 하여 3D 혼합 접합 웨이퍼 레벨 스택을 채택하고, 14nm 공정에서 520 TFLOPS@BF16 성능을 구현하며, 소프트웨어...","url":"https://www.aioga.com/ko/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:01:09.688Z"},"es":{"title":"Dongfang Suanxin presenta el primer chip AI 3D de cálculo de memoria cercana definido por software del mundo DF1000, con una capacidad de cálculo de 520 TFLOPS","summary":"Dongfang Suanxin presentó por primera vez en WAIC 2026 el primer chip de IA 3D de computación cercana definido por software del mundo, DF1000, y recibió el Premio SAIL 2026. Este chip se basa en una cadena de suministro completamente nacional, utiliza apilamiento a nivel de oblea con unión híbrida 3D, y alcanza 520 TFLOPS@BF16 de capacidad de cómputo bajo un proceso de 14 nm. A través de la tecnología de chip definido por software, logra la separación y reconfiguración dinámica de hardware y software, con el objetivo de proporcionar a la industria de IA una base de capacidad de cómputo nacional.","category":"Productos","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin presenta el primer chip AI 3D de cálculo de memoria cercana definido por software del mundo DF1000, con una capacidad de cálculo de 520 TFLOPS - Aioga Noticias de IA","description":"Dongfang Suanxin presentó por primera vez en WAIC 2026 el primer chip de IA 3D de computación cercana definido por software del mundo, DF1000, y recibió el Premio SAIL 2026. Este c...","url":"https://www.aioga.com/es/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:01:03.761Z"},"fr":{"title":"Dongfang Suanxin présente la première puce d'IA 3D à calcul proche définie par logiciel au monde DF1000, avec une puissance de calcul de 520 TFLOPS","summary":"Dongfang Suanxin a présenté pour la première fois au WAIC 2026 la première puce AI 3D à calcul en mémoire proche définie par logiciel au monde, le DF1000, et a remporté le prix SAIL 2026. Cette puce repose sur une chaîne d'approvisionnement entièrement nationale, utilise un empilement de wafers au niveau 3D avec liaison hybride, atteint une performance de 520 TFLOPS@BF16 en technologie 14 nm, et grâce à la technologie de puce définie par logiciel, permet le découplage matériel-logiciel et la reconfiguration dynamique, visant à fournir une base de puissance de calcul nationale pour l'industrie de l'IA.","category":"Produits","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin présente la première puce d'IA 3D à calcul proche définie par logiciel au monde DF1000, avec une puissance de calcul de 520 TFLOPS - Aioga Actualités IA","description":"Dongfang Suanxin a présenté pour la première fois au WAIC 2026 la première puce AI 3D à calcul en mémoire proche définie par logiciel au monde, le DF1000, et a remporté le prix SAI...","url":"https://www.aioga.com/fr/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:01:53.487Z"},"de":{"title":"Dongfang Suanxin stellt den weltweit ersten softwaredefinierten Near-Memory-Computing-3D-AI-Chip DF1000 aus, mit einer Rechenleistung von 520 TFLOPS","summary":"Dongfang Suanxin stellt auf der WAIC 2026 erstmals den weltweit ersten softwaredefinierten Near-Memory-Computing-3D-AI-Chip DF1000 vor und erhält den SAIL Award 2026. Der Chip basiert auf einer vollständig inländischen Lieferkette und verwendet 3D-Hybrid-Bonding-Wafer-Stapelungen. In 14-nm-Technologie erreicht er eine Rechenleistung von 520 TFLOPS@BF16. Durch die softwaredefinierte Chipherstellung wird eine Entkopplung von Hard- und Software sowie eine dynamische Rekonfiguration ermöglicht, mit dem Ziel, der KI-Industrie eine inländische Rechenplattform bereitzustellen.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin stellt den weltweit ersten softwaredefinierten Near-Memory-Computing-3D-AI-Chip DF1000 aus, mit einer Rechenleistung von 520 TFLOPS - Aioga KI-News","description":"Dongfang Suanxin stellt auf der WAIC 2026 erstmals den weltweit ersten softwaredefinierten Near-Memory-Computing-3D-AI-Chip DF1000 vor und erhält den SAIL Award 2026. Der Chip basi...","url":"https://www.aioga.com/de/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:01:53.059Z"},"pt-BR":{"title":"A Dongfang Suanxin exibiu o primeiro chip de IA 3D de computação próxima definido por software do mundo, DF1000, com capacidade de 520 TFLOPS","summary":"A Dongfang Suanxin exibiu pela primeira vez na WAIC 2026 o primeiro chip 3D AI de computação em memória próxima definido por software do mundo, o DF1000, e recebeu o Prêmio SAIL 2026. Esse chip é baseado em uma cadeia de suprimentos totalmente nacional, utiliza empilhamento wafer-level com ligação híbrida 3D e atinge 520 TFLOPS@BF16 de desempenho sob o processo de 14nm. Por meio da tecnologia de chip definido por software, permite o desacoplamento entre hardware e software e a reconfiguração dinâmica, com o objetivo de fornecer uma base de capacidade computacional nacional para a indústria de IA.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"A Dongfang Suanxin exibiu o primeiro chip de IA 3D de computação próxima definido por software do mundo, DF1000, com capacidade de 520 TFLOPS - Aioga Notícias de IA","description":"A Dongfang Suanxin exibiu pela primeira vez na WAIC 2026 o primeiro chip 3D AI de computação em memória próxima definido por software do mundo, o DF1000, e recebeu o Prêmio SAIL 20...","url":"https://www.aioga.com/pt-BR/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:02:34.490Z"},"ru":{"title":"Восточная компания представила первый в мире программно-определяемый 3D AI чип для вычислений с близкой памятью DF1000, с вычислительной мощностью 520 TFLOPS","summary":"Компания Oriental Compute впервые представила на WAIC 2026 мировой первый 3D AI-чип DF1000 с вычислениями вблизи памяти, определяемый программно, и получила премию SAIL 2026. Этот чип основан на полностью отечественной цепочке поставок, использует 3D-гибридное связное на уровне планшета многослойное соединение, обеспечивает вычислительную мощность 520 TFLOPS@BF16 при технологии 14 нм и с помощью технологии программно определяемого чипа реализует разделение программного обеспечения и аппаратного обеспечения и динамическую реконфигурацию, с целью предоставления отечественной вычислительной платформы для индустрии ИИ.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Восточная компания представила первый в мире программно-определяемый 3D AI чип для вычислений с близкой памятью DF1000, с вычислительной мощностью 520 TFLOPS - Aioga Новости ИИ","description":"Компания Oriental Compute впервые представила на WAIC 2026 мировой первый 3D AI-чип DF1000 с вычислениями вблизи памяти, определяемый программно, и получила премию SAIL 2026. Этот...","url":"https://www.aioga.com/ru/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:02:36.586Z"},"ar":{"title":"عرضت Dongfang Suanxin أول شريحة AI ثلاثية الأبعاد للذاكرة القريبة المعرفة بالبرمجيات في العالم DF1000، بقوة حوسبة تصل إلى 520 تيرافلوب","summary":"عرضت شركة دونغفانغ سوكسين لأول مرة في WAIC 2026 أول رقاقة ذكاء اصطناعي ثلاثية الأبعاد قابلة للبرمجة بواسطة البرامج DF1000 في العالم، وحازت على جائزة SAIL 2026. تعتمد هذه الرقاقة على سلسلة توريد وطنية بالكامل، تستخدم تكديس رقائق متباين ثلاثي الأبعاد على مستوى الرقاقة، وتحقق قوة حسابية تبلغ 520 تيرافلوبس@BF16 تحت تقنية 14 نانومتر، ومن خلال تقنية الرقاقة المعرفة بالبرمجيات تحقق فصل البرامج عن الأجهزة وإعادة التكوين الديناميكي، وتهدف إلى توفير قاعدة قدرات حاسوبية وطنية لصناعة الذكاء الاصطناعي.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"عرضت Dongfang Suanxin أول شريحة AI ثلاثية الأبعاد للذاكرة القريبة المعرفة بالبرمجيات في العالم DF1000، بقوة حوسبة تصل إلى 520 تيرافلوب - Aioga أخبار الذكاء الاصطناعي","description":"عرضت شركة دونغفانغ سوكسين لأول مرة في WAIC 2026 أول رقاقة ذكاء اصطناعي ثلاثية الأبعاد قابلة للبرمجة بواسطة البرامج DF1000 في العالم، وحازت على جائزة SAIL 2026. تعتمد هذه الرقاقة عل...","url":"https://www.aioga.com/ar/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:03:19.179Z"},"hi":{"title":"डांगफ़ांग का सुयानचिप ने दुनिया का पहला सॉफ़्टवेयर-परिभाषित नज़दीकी मेमोरी कंप्यूटिंग 3D AI चिप DF1000 प्रदर्शित किया, जिसकी कंप्यूटिंग शक्ति 520 TFLOPS है","summary":"डोंगफांग सुआनसिन ने WAIC 2026 में पहली बार दुनिया का पहला सॉफ़्टवेयर-परिभाषित नज़दीकी मेमोरी कंप्यूटिंग 3D AI चिप DF1000 प्रदर्शित किया और 2026 SAIL पुरस्कार जीता। यह चिप पूरी तरह से घरेलू आपूर्ति श्रृंखला पर आधारित है और 3D हाइब्रिड बोंडिंग वेफर-लेवल स्टैकिंग का उपयोग करती है। 14nm प्रौद्योगिकी के तहत यह 520 TFLOPS@BF16 कंप्यूटिंग प्रदर्शन हासिल करती है। सॉफ़्टवेयर-परिभाषित चिप तकनीक के माध्यम से यह सॉफ़्टवेयर और हार्डवेयर को अलग करने और डायनामिक पुनर्गठन को सक्षम बनाती है, जिसका उद्देश्य AI उद्योग को घरेलू कंप्यूटिंग शक्ति का आधार प्रदान करना है।","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"डांगफ़ांग का सुयानचिप ने दुनिया का पहला सॉफ़्टवेयर-परिभाषित नज़दीकी मेमोरी कंप्यूटिंग 3D AI चिप DF1000 प्रदर्शित किया, जिसकी कंप्यूटिंग शक्ति 520 TFLOPS है - Aioga AI समाचार","description":"डोंगफांग सुआनसिन ने WAIC 2026 में पहली बार दुनिया का पहला सॉफ़्टवेयर-परिभाषित नज़दीकी मेमोरी कंप्यूटिंग 3D AI चिप DF1000 प्रदर्शित किया और 2026 SAIL पुरस्कार जीता। यह चिप पूरी तरह...","url":"https://www.aioga.com/hi/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:03:21.730Z"},"it":{"title":"Dongfang Suanxin ha presentato il primo chip AI 3D per il calcolo in memoria definito dal software al mondo DF1000, con una potenza di calcolo di 520 TFLOPS","summary":"Dongfang Suanxin ha presentato per la prima volta al WAIC 2026 il primo chip AI 3D per il calcolo in memoria definito dal software DF1000 al mondo, vincendo il premio SAIL 2026. Questo chip, basato su una catena di approvvigionamento completamente nazionale, utilizza l'impilamento a livello di wafer con legatura 3D, raggiungendo una potenza di calcolo di 520 TFLOPS@BF16 con tecnologia a 14 nm. Grazie alla tecnologia del chip definito dal software, realizza il disaccoppiamento tra hardware e software e la ricostruzione dinamica, con l'obiettivo di fornire una base di calcolo nazionale per l'industria dell'AI.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin ha presentato il primo chip AI 3D per il calcolo in memoria definito dal software al mondo DF1000, con una potenza di calcolo di 520 TFLOPS - Aioga Notizie IA","description":"Dongfang Suanxin ha presentato per la prima volta al WAIC 2026 il primo chip AI 3D per il calcolo in memoria definito dal software DF1000 al mondo, vincendo il premio SAIL 2026. Qu...","url":"https://www.aioga.com/it/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:04:06.296Z"},"nl":{"title":"Dongfang Suanxin toont 's werelds eerste software-gedefinieerde near-memory computing 3D AI-chip DF1000, met een rekenkracht van 520 TFLOPS","summary":"Dongfang Suanxin debuteerde op WAIC 2026 met 's werelds eerste softwaregedefinieerde near-memory computing 3D AI-chip DF1000 en won de 2026 SAIL-prijs. Deze chip is gebaseerd op een volledig binnenlandse toeleveringsketen en maakt gebruik van 3D hybride gebonden wafer-level stacking, bereikt 520 TFLOPS@BF16 rekenkracht op het 14nm-proces en realiseert software-hardware decoupling en dynamische herconfiguratie door softwaregedefinieerde chiptechnologie, met als doel een binnenlandse rekenkrachtbasis voor de AI-industrie te bieden.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin toont 's werelds eerste software-gedefinieerde near-memory computing 3D AI-chip DF1000, met een rekenkracht van 520 TFLOPS - Aioga AI-nieuws","description":"Dongfang Suanxin debuteerde op WAIC 2026 met 's werelds eerste softwaregedefinieerde near-memory computing 3D AI-chip DF1000 en won de 2026 SAIL-prijs. Deze chip is gebaseerd op ee...","url":"https://www.aioga.com/nl/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:04:11.585Z"},"tr":{"title":"Doğu Suanxin, dünya çapında ilk yazılım tanımlı yakın bellekli hesaplama 3D AI çipi DF1000'i sergiledi ve hesaplama gücü 520 TFLOPS'a ulaşıyor","summary":"Doğu Suanxin, WAIC 2026'da dünya çapında ilk yazılım tanımlı yakın bellek hesaplama 3D AI çipi DF1000'i ilk kez sergiledi ve 2026 SAIL Ödülü'nü kazandı. Bu çip, tamamen yerli tedarik zincirine dayanmakta, 3D hibrit bağlamalı wafer seviyesi yığılma teknolojisini kullanmakta ve 14nm süreçte 520 TFLOPS@BF16 hesaplama gücü elde etmektedir. Yazılım tanımlı çip teknolojisi sayesinde yazılım ve donanım ayrımı ile dinamik yeniden yapılandırmayı gerçekleştirmekte ve AI endüstrisine yerli hesaplama temeli sağlamayı amaçlamaktadır.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Doğu Suanxin, dünya çapında ilk yazılım tanımlı yakın bellekli hesaplama 3D AI çipi DF1000'i sergiledi ve hesaplama gücü 520 TFLOPS'a ulaşıyor - Aioga AI Haberleri","description":"Doğu Suanxin, WAIC 2026'da dünya çapında ilk yazılım tanımlı yakın bellek hesaplama 3D AI çipi DF1000'i ilk kez sergiledi ve 2026 SAIL Ödülü'nü kazandı. Bu çip, tamamen yerli tedar...","url":"https://www.aioga.com/tr/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:04:55.336Z"},"vi":{"title":"Đông Phương Suàn Xīn trưng bày chip AI 3D tính toán lưu trữ gần được định nghĩa bằng phần mềm đầu tiên trên thế giới DF1000, với sức mạnh tính toán đạt 520 TFLOPS","summary":"Đông Phương Toán Tâm lần đầu tiên trưng bày chip AI 3D tính toán gần bộ nhớ định nghĩa bằng phần mềm DF1000 tại WAIC 2026 và giành giải SAIL 2026. Chip này dựa trên chuỗi cung ứng hoàn toàn trong nước, sử dụng công nghệ xếp chồng dạng wafer bonding 3D, đạt 520 TFLOPS@BF16 với quy trình 14nm, và thông qua công nghệ chip định nghĩa bằng phần mềm một cách tách rời phần cứng và phần mềm cũng như tái cấu trúc động, nhằm cung cấp nền tảng tính toán trong nước cho ngành AI.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Đông Phương Suàn Xīn trưng bày chip AI 3D tính toán lưu trữ gần được định nghĩa bằng phần mềm đầu tiên trên thế giới DF1000, với sức mạnh tính toán đạt 520 TFLOPS - Tin tức AI Aioga","description":"Đông Phương Toán Tâm lần đầu tiên trưng bày chip AI 3D tính toán gần bộ nhớ định nghĩa bằng phần mềm DF1000 tại WAIC 2026 và giành giải SAIL 2026. Chip này dựa trên chuỗi cung ứng...","url":"https://www.aioga.com/vi/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:04:56.180Z"},"id":{"title":"Oriental Compute Chip memamerkan chip AI 3D komputasi memori dekat yang didefinisikan oleh perangkat lunak pertama di dunia DF1000, dengan daya komputasi mencapai 520 TFLOPS","summary":"Dongfang Suanxin akan menampilkan chip AI 3D komputasi memori terdekat yang didefinisikan perangkat lunak pertama di dunia DF1000 di WAIC 2026 untuk pertama kalinya, dan memenangkan Penghargaan SAIL 2026. Chip ini didasarkan pada rantai pasokan domestik sepenuhnya, menggunakan tumpukan wafer hybrid bonding 3D, mencapai 520 TFLOPS@BF16 pada teknologi 14nm, dan melalui teknologi chip yang didefinisikan perangkat lunak dapat mewujudkan pemisahan perangkat keras dan perangkat lunak serta rekonstruksi dinamis, dengan tujuan menyediakan landasan komputasi domestik untuk industri AI.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Oriental Compute Chip memamerkan chip AI 3D komputasi memori dekat yang didefinisikan oleh perangkat lunak pertama di dunia DF1000, dengan daya komputasi mencapai 520 TFLOPS - Berita AI Aioga","description":"Dongfang Suanxin akan menampilkan chip AI 3D komputasi memori terdekat yang didefinisikan perangkat lunak pertama di dunia DF1000 di WAIC 2026 untuk pertama kalinya, dan memenangka...","url":"https://www.aioga.com/id/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:05:39.600Z"},"th":{"title":"Dongfang Suanxin จัดแสดงชิป AI 3D สำหรับการคำนวณหน่วยความจำใกล้ตัวซอฟต์แวร์ตัวแรกของโลก DF1000 มีกำลังประมวลผลถึง 520 TFLOPS","summary":"Dongfang Suanxin เปิดตัวชิป AI 3 มิติ DF1000 ที่กำหนดการทำงานด้วยซอฟต์แวร์สำหรับการคำนวณหน่วยความจำใกล้ในงาน WAIC 2026 เป็นครั้งแรกของโลก และได้รับรางวัล SAIL 2026 ชิปนี้สร้างขึ้นบนห่วงโซ่อุปทานในประเทศทั้งหมด ใช้การซ้อนระดับเวเฟอร์แบบเชื่อมต่อผสม 3D บนเทคโนโลยี 14nm ให้กำลังคำนวณ 520 TFLOPS@BF16 ด้วยเทคโนโลยีชิปที่กำหนดด้วยซอฟต์แวร์เพื่อให้สามารถแยกการทำงานของฮาร์ดแวร์และซอฟต์แวร์และปรับโครงสร้างได้อย่างยืดหยุ่น มีเป้าหมายเพื่อให้ฐานกำลังคำนวณในประเทศสำหรับอุตสาหกรรม AI","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Dongfang Suanxin จัดแสดงชิป AI 3D สำหรับการคำนวณหน่วยความจำใกล้ตัวซอฟต์แวร์ตัวแรกของโลก DF1000 มีกำลังประมวลผลถึง 520 TFLOPS - ข่าว AI Aioga","description":"Dongfang Suanxin เปิดตัวชิป AI 3 มิติ DF1000 ที่กำหนดการทำงานด้วยซอฟต์แวร์สำหรับการคำนวณหน่วยความจำใกล้ในงาน WAIC 2026 เป็นครั้งแรกของโลก และได้รับรางวัล SAIL 2026 ชิปนี้สร้างขึ้นบ...","url":"https://www.aioga.com/th/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:05:42.811Z"},"pl":{"title":"Fangdong Suanxin wystawia na targach pierwszy na świecie programowo definiowany chip AI do obliczeń bliskiej pamięci 3D DF1000, o mocy obliczeniowej 520 TFLOPS","summary":"Dongfang Suanxin po raz pierwszy zaprezentował na WAIC 2026 pierwszą na świecie programowalną bliskopamięciową trójwymiarową chip AI DF1000 i zdobył nagrodę SAIL 2026. Ten chip oparty jest na w pełni krajowym łańcuchu dostaw, wykorzystuje trójwymiarowe hybrydowe łączenie na poziomie wafla i osiąga moc obliczeniową 520 TFLOPS@BF16 w procesie 14 nm. Dzięki technologii programowalnych chipów możliwe jest oddzielenie oprogramowania od sprzętu oraz dynamiczna rekonfiguracja, mające na celu dostarczenie krajowej bazy obliczeniowej dla przemysłu AI.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Fangdong Suanxin wystawia na targach pierwszy na świecie programowo definiowany chip AI do obliczeń bliskiej pamięci 3D DF1000, o mocy obliczeniowej 520 TFLOPS - Aioga Wiadomości AI","description":"Dongfang Suanxin po raz pierwszy zaprezentował na WAIC 2026 pierwszą na świecie programowalną bliskopamięciową trójwymiarową chip AI DF1000 i zdobył nagrodę SAIL 2026. Ten chip opa...","url":"https://www.aioga.com/pl/news/cmrprjoxj04s9bisris6ci96j/","contentTranslated":true,"sourceHash":"b48250554828b616","translatedAt":"2026-07-23T04:06:36.317Z"}}}}