{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-07-23T06:40:50.084Z","headline":"英伟达公开 Rubin GPU 细节：3360 亿晶体管，智能体 AI 性能较 Blackwell 提升 10 倍","description":"英伟达发布 Rubin GPU 架构细节，该芯片基于台积电 3nm 工艺，集成 3360 亿个晶体管，智能体 AI 工作负载的单位能耗吞吐量达到 Blackwell 的 10 倍。Rubin 搭载 8 个 HBM4 内存堆栈，总容量 288 GB，峰值带宽 22 TB/s，较 Blackwell 提升 1.8 倍。","url":"https://www.aioga.com/news/cmrvq2os2001vbi85k8jkdrwi/","mainEntityOfPage":"https://www.aioga.com/news/cmrvq2os2001vbi85k8jkdrwi/","datePublished":"2026-07-22T06:03:44.000Z","dateModified":"2026-07-22T06:03:44.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/980/010.htm","https://aihot.virxact.com/items/cmrvq2os2001vbi85k8jkdrwi"],"canonicalUrl":"https://www.aioga.com/news/cmrvq2os2001vbi85k8jkdrwi/","directAnswer":{"@type":"Answer","text":"Aioga 编辑摘要：英伟达发布 Rubin GPU 架构细节，该芯片基于台积电 3nm 工艺，集成 3360 亿个晶体管，智能体 AI 工作负载的单位能耗吞吐量达到 Blackwell 的 10 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Cores）支持扩展精度、全新 HBM4 内存子系统以及第三代 Transformer 引擎。","内存系统方面，Rubin 搭载 8 个 12-Hi 堆栈的 HBM4 内存，总容量 288 GB，单堆栈容量 36 GB， 峰值带宽达 22 TB/s，较 Blackwell 的 8 TB/s 提升了 1.8 倍。","该内存方案支持更大上下文窗口、更高并发量，并在逐令牌生成阶段确保模型权重与 KV 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GB，峰值带宽 22 TB/s，较 Blackwell 提升 1.8 倍。","category":"产品更新","source":"IT之家","aggregationSource":"IT之家（RSS）","pageTitle":"英伟达公开 Rubin GPU 细节：3360 亿晶体管，智能体 AI 性能较 Blackwell 提升 10 倍 - Aioga AI资讯","description":"英伟达发布 Rubin GPU 架构细节，该芯片基于台积电 3nm 工艺，集成 3360 亿个晶体管，智能体 AI 工作负载的单位能耗吞吐量达到 Blackwell 的 10 倍。Rubin 搭载 8 个 HBM4 内存堆栈，总容量 288 GB，峰值带宽 22 TB/s，较 Blackwell 提升 1.8 倍。","url":"https://www.aioga.com/news/cmrvq2os2001vbi85k8jkdrwi/"},"en":{"title":"NVIDIA reveals Rubin GPU details: 336 billion transistors, AI agent performance 10 times higher than Blackwell","summary":"NVIDIA released details of the Rubin GPU architecture. The chip is based on TSMC's 3nm process and integrates 336 billion transistors. Its energy efficiency throughput for intelligent AI workloads is ten times that of Blackwell. Rubin comes with 8 HBM4 memory stacks, totaling 288 GB, with a peak bandwidth of 22 TB/s, 1.8 times higher than Blackwell.","category":"Products","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA reveals Rubin GPU details: 336 billion transistors, AI agent performance 10 times higher than Blackwell - Aioga AI News","description":"NVIDIA released details of the Rubin GPU architecture. The chip is based on TSMC's 3nm process and integrates 336 billion transistors. Its energy efficiency throughput for intellig...","url":"https://www.aioga.com/en/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:02:45.738Z"},"ja":{"title":"NVIDIA、Rubin GPU の詳細を公開：3360 億個のトランジスタ、エージェントAI性能は Blackwell より10倍向上","summary":"NVIDIAはRubin GPUアーキテクチャの詳細を発表しました。このチップはTSMCの3nmプロセスに基づき、3,360億個のトランジスタを統合しており、AIワークロードにおける単位電力あたりのスループットはBlackwellの10倍に達します。Rubinは8つのHBM4メモリスタックを搭載しており、総容量は288GB、ピーク帯域幅は22TB/sであり、Blackwellに比べて1.8倍向上しています。","category":"製品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA、Rubin GPU の詳細を公開：3360 億個のトランジスタ、エージェントAI性能は Blackwell より10倍向上 - Aioga AIニュース","description":"NVIDIAはRubin GPUアーキテクチャの詳細を発表しました。このチップはTSMCの3nmプロセスに基づき、3,360億個のトランジスタを統合しており、AIワークロードにおける単位電力あたりのスループットはBlackwellの10倍に達します。Rubinは8つのHBM4メモリスタックを搭載しており、総容量は288GB、ピーク帯域幅は22TB/sであり、...","url":"https://www.aioga.com/ja/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:02:56.221Z"},"ko":{"title":"엔비디아, 루빈 GPU 세부 사항 공개: 3360억 개 트랜지스터, 에이전트 AI 성능 블랙웰 대비 10배 향상","summary":"엔비디아가 Rubin GPU 아키텍처 세부 사항을 발표했다. 이 칩은 TSMC 3nm 공정을 기반으로 하며, 3,360억 개의 트랜지스터를 통합하고, 지능형 AI 작업 부하의 단위 에너지 처리량이 Blackwell의 10배에 달한다. Rubin은 8개의 HBM4 메모리 스택을 탑재하고 있으며, 총 용량은 288GB, 최대 대역폭은 22TB/s로, Blackwell보다 1.8배 향상되었다.","category":"제품 업데이트","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"엔비디아, 루빈 GPU 세부 사항 공개: 3360억 개 트랜지스터, 에이전트 AI 성능 블랙웰 대비 10배 향상 - Aioga AI 뉴스","description":"엔비디아가 Rubin GPU 아키텍처 세부 사항을 발표했다. 이 칩은 TSMC 3nm 공정을 기반으로 하며, 3,360억 개의 트랜지스터를 통합하고, 지능형 AI 작업 부하의 단위 에너지 처리량이 Blackwell의 10배에 달한다. Rubin은 8개의 HBM4 메모리 스택을 탑재하고 있으며, 총 용량은 288GB, 최대...","url":"https://www.aioga.com/ko/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:03:38.985Z"},"es":{"title":"NVIDIA revela detalles de la GPU Rubin: 336.000 millones de transistores, el rendimiento de IA de agentes inteligentes es 10 veces superior al de Blackwell","summary":"NVIDIA ha publicado los detalles de la arquitectura de GPU Rubin, este chip se basa en el proceso de 3 nm de TSMC, integra 336 mil millones de transistores, y el rendimiento de energía por unidad para cargas de trabajo de IA inteligente alcanza 10 veces el de Blackwell. Rubin cuenta con 8 pilas de memoria HBM4, con una capacidad total de 288 GB y un ancho de banda máximo de 22 TB/s, lo que representa un aumento de 1,8 veces en comparación con Blackwell.","category":"Productos","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA revela detalles de la GPU Rubin: 336.000 millones de transistores, el rendimiento de IA de agentes inteligentes es 10 veces superior al de Blackwell - Aioga Noticias de IA","description":"NVIDIA ha publicado los detalles de la arquitectura de GPU Rubin, este chip se basa en el proceso de 3 nm de TSMC, integra 336 mil millones de transistores, y el rendimiento de ene...","url":"https://www.aioga.com/es/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:03:35.533Z"},"fr":{"title":"NVIDIA publie les détails du GPU Rubin : 336 milliards de transistors, les performances AI des agents intelligents sont 10 fois supérieures à Blackwell","summary":"NVIDIA a publié les détails de l'architecture GPU Rubin. Cette puce est basée sur le procédé 3 nm de TSMC et intègre 336 milliards de transistors. Le rendement énergétique par unité de charge de travail d'IA intelligente atteint dix fois celui de Blackwell. Rubin est équipé de 8 piles de mémoire HBM4, d'une capacité totale de 288 Go et d'une bande passante maximale de 22 To/s, soit une amélioration de 1,8 fois par rapport à Blackwell.","category":"Produits","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA publie les détails du GPU Rubin : 336 milliards de transistors, les performances AI des agents intelligents sont 10 fois supérieures à Blackwell - Aioga Actualités IA","description":"NVIDIA a publié les détails de l'architecture GPU Rubin. Cette puce est basée sur le procédé 3 nm de TSMC et intègre 336 milliards de transistors. Le rendement énergétique par unit...","url":"https://www.aioga.com/fr/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:04:18.870Z"},"de":{"title":"Nvidia veröffentlicht Details zur Rubin-GPU: 336 Milliarden Transistoren, KI-Leistung für Agenten um das 10-fache höher als bei Blackwell","summary":"NVIDIA veröffentlicht Details zur Rubin-GPU-Architektur. Der Chip basiert auf dem 3-nm-Prozess von TSMC und integriert 336 Milliarden Transistoren. Die Energieeffizienz pro Einheit für KI-Workloads erreicht das Zehnfache von Blackwell. Rubin ist mit 8 HBM4-Speicherstapeln ausgestattet, hat eine Gesamtkapazität von 288 GB und eine Spitzenbandbreite von 22 TB/s, was eine 1,8-fache Steigerung gegenüber Blackwell darstellt.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Nvidia veröffentlicht Details zur Rubin-GPU: 336 Milliarden Transistoren, KI-Leistung für Agenten um das 10-fache höher als bei Blackwell - Aioga KI-News","description":"NVIDIA veröffentlicht Details zur Rubin-GPU-Architektur. Der Chip basiert auf dem 3-nm-Prozess von TSMC und integriert 336 Milliarden Transistoren. Die Energieeffizienz pro Einheit...","url":"https://www.aioga.com/de/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:04:16.980Z"},"pt-BR":{"title":"NVIDIA divulga detalhes da GPU Rubin: 336 bilhões de transistores, desempenho de IA em agentes inteligentes 10 vezes superior ao Blackwell","summary":"A NVIDIA divulgou os detalhes da arquitetura de GPU Rubin. Este chip é baseado no processo de 3 nm da TSMC, integra 336 bilhões de transistores e o rendimento de energia por unidade de cargas de trabalho de IA inteligente é 10 vezes maior que o do Blackwell. O Rubin possui 8 pilhas de memória HBM4, com capacidade total de 288 GB e largura de banda máxima de 22 TB/s, um aumento de 1,8 vezes em comparação ao Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA divulga detalhes da GPU Rubin: 336 bilhões de transistores, desempenho de IA em agentes inteligentes 10 vezes superior ao Blackwell - Aioga Notícias de IA","description":"A NVIDIA divulgou os detalhes da arquitetura de GPU Rubin. Este chip é baseado no processo de 3 nm da TSMC, integra 336 bilhões de transistores e o rendimento de energia por unidad...","url":"https://www.aioga.com/pt-BR/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:04:56.843Z"},"ru":{"title":"NVIDIA раскрыла детали GPU Rubin: 336 миллиардов транзисторов, производительность AI-агентов в 10 раз выше, чем у Blackwell","summary":"NVIDIA выпустила подробности о архитектуре GPU Rubin. Этот чип основан на 3-нм техпроцессе TSMC, содержит 336 миллиардов транзисторов, а энергоэффективность при нагрузках AI на единицу превышает таковую у Blackwell в 10 раз. Rubin оснащён 8 стеками памяти HBM4 общей ёмкостью 288 ГБ и пиковой пропускной способностью 22 ТБ/с, что в 1,8 раза больше, чем у Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA раскрыла детали GPU Rubin: 336 миллиардов транзисторов, производительность AI-агентов в 10 раз выше, чем у Blackwell - Aioga Новости ИИ","description":"NVIDIA выпустила подробности о архитектуре GPU Rubin. Этот чип основан на 3-нм техпроцессе TSMC, содержит 336 миллиардов транзисторов, а энергоэффективность при нагрузках AI на еди...","url":"https://www.aioga.com/ru/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:04:58.197Z"},"ar":{"title":"نكشف شركة إنفيديا عن تفاصيل وحدة معالجة الرسوميات Rubin: 336 مليار ترانزستور، أداء الذكاء الاصطناعي للوكيل أعلى 10 مرات مقارنة بـ Blackwell","summary":"أعلنت نفيديا عن تفاصيل معمارية وحدة معالجة الرسومات Rubin، والتي تعتمد على عملية تصنيع TSMC بدقة 3 نانومتر، وتضم 336 مليار ترانزستور، حيث يصل معدل استهلاك الطاقة لكل وحدة لعبء عمل الذكاء الاصطناعي إلى 10 أضعاف معمارية Blackwell. تأتي Rubin مزودة بثمانية أكوام من ذاكرة HBM4 بسعة إجمالية 288 جيجابايت، وعرض نطاق ترددي أقصى يبلغ 22 تيرابايت/ثانية، بزيادة بمقدار 1.8 مرة مقارنة بـ Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"نكشف شركة إنفيديا عن تفاصيل وحدة معالجة الرسوميات Rubin: 336 مليار ترانزستور، أداء الذكاء الاصطناعي للوكيل أعلى 10 مرات مقارنة بـ Blackwell - Aioga أخبار الذكاء الاصطناعي","description":"أعلنت نفيديا عن تفاصيل معمارية وحدة معالجة الرسومات Rubin، والتي تعتمد على عملية تصنيع TSMC بدقة 3 نانومتر، وتضم 336 مليار ترانزستور، حيث يصل معدل استهلاك الطاقة لكل وحدة لعبء عمل...","url":"https://www.aioga.com/ar/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:05:38.977Z"},"hi":{"title":"एनवीडिया ने रूबिन GPU विवरण सार्वजनिक किए: 3360 बिलियन ट्रांजिस्टर, एजेंट AI प्रदर्शन ब्लैकवेल की तुलना में 10 गुना बढ़ा","summary":"एनवीडिया ने रूबिन GPU आर्किटेक्चर का विवरण जारी किया, यह चिप TSMC के 3nm प्रक्रिया पर आधारित है, इसमें 336 बिलियन ट्रांजिस्टर इंटीग्रेटेड हैं, और इंटेलिजेंट AI वर्कलोड की यूनिट ऊर्जा खपत थ्रूपुट ब्लैकवेल से 10 गुना तक है। रूबिन में 8 HBM4 मेमोरी स्टैक हैं, कुल क्षमता 288 GB है, पीक बैंडविड्थ 22 TB/s है, जो ब्लैकवेल की तुलना में 1.8 गुना अधिक है।","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"एनवीडिया ने रूबिन GPU विवरण सार्वजनिक किए: 3360 बिलियन ट्रांजिस्टर, एजेंट AI प्रदर्शन ब्लैकवेल की तुलना में 10 गुना बढ़ा - Aioga AI समाचार","description":"एनवीडिया ने रूबिन GPU आर्किटेक्चर का विवरण जारी किया, यह चिप TSMC के 3nm प्रक्रिया पर आधारित है, इसमें 336 बिलियन ट्रांजिस्टर इंटीग्रेटेड हैं, और इंटेलिजेंट AI वर्कलोड की यूनिट ऊर्...","url":"https://www.aioga.com/hi/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:05:41.186Z"},"it":{"title":"NVIDIA svela i dettagli della GPU Rubin: 336 miliardi di transistor, prestazioni AI degli agenti intelligenti dieci volte superiori a Blackwell","summary":"NVIDIA ha rilasciato i dettagli dell'architettura GPU Rubin. Il chip, basato sul processo a 3 nm di TSMC, integra 336 miliardi di transistor e la sua efficienza energetica per carichi di lavoro AI cognitivi raggiunge 10 volte quella di Blackwell. Rubin è dotato di 8 stack di memoria HBM4, per una capacità totale di 288 GB e una larghezza di banda di picco di 22 TB/s, con un aumento di 1,8 volte rispetto a Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA svela i dettagli della GPU Rubin: 336 miliardi di transistor, prestazioni AI degli agenti intelligenti dieci volte superiori a Blackwell - Aioga Notizie IA","description":"NVIDIA ha rilasciato i dettagli dell'architettura GPU Rubin. Il chip, basato sul processo a 3 nm di TSMC, integra 336 miliardi di transistor e la sua efficienza energetica per cari...","url":"https://www.aioga.com/it/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:06:29.609Z"},"nl":{"title":"Nvidia onthult details van de Rubin GPU: 336 miljard transistors, AI-prestaties voor agents 10 keer beter dan Blackwell","summary":"NVIDIA heeft details vrijgegeven van de Rubin GPU-architectuur. Deze chip is gebaseerd op TSMC's 3nm-proces en bevat 336 miljard transistors. Het energieverbruik per eenheid door AI-werkbelastingen van slimme agents is tien keer zo hoog als dat van Blackwell. Rubin is uitgerust met 8 HBM4-geheugenstapels, een totale capaciteit van 288 GB en een piekbandbreedte van 22 TB/s, wat 1,8 keer beter is dan Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Nvidia onthult details van de Rubin GPU: 336 miljard transistors, AI-prestaties voor agents 10 keer beter dan Blackwell - Aioga AI-nieuws","description":"NVIDIA heeft details vrijgegeven van de Rubin GPU-architectuur. Deze chip is gebaseerd op TSMC's 3nm-proces en bevat 336 miljard transistors. Het energieverbruik per eenheid door A...","url":"https://www.aioga.com/nl/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:06:20.694Z"},"tr":{"title":"NVIDIA Rubin GPU ayrıntılarını açıkladı: 336 milyar transistör, AI performansı Blackwell'e kıyasla 10 kat artırıldı","summary":"NVIDIA, Rubin GPU mimarisi detaylarını yayımladı; bu çip, TSMC'nin 3nm süreci ile üretilmiş olup 336 milyar transistöre sahip ve yapay zeka iş yüklerinde birim enerji verimliliği bakımından Blackwell'in 10 katına ulaşıyor. Rubin, toplam kapasitesi 288 GB olan 8 HBM4 bellek yığınına sahip ve tepe bant genişliği 22 TB/s ile Blackwell’e kıyasla 1,8 kat artış sağlıyor.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA Rubin GPU ayrıntılarını açıkladı: 336 milyar transistör, AI performansı Blackwell'e kıyasla 10 kat artırıldı - Aioga AI Haberleri","description":"NVIDIA, Rubin GPU mimarisi detaylarını yayımladı; bu çip, TSMC'nin 3nm süreci ile üretilmiş olup 336 milyar transistöre sahip ve yapay zeka iş yüklerinde birim enerji verimliliği b...","url":"https://www.aioga.com/tr/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:07:07.807Z"},"vi":{"title":"NVIDIA công bố chi tiết GPU Rubin: 336 tỷ bóng bán dẫn, hiệu năng AI của tác nhân thông minh tăng gấp 10 lần so với Blackwell","summary":"NVIDIA công bố chi tiết kiến trúc GPU Rubin, chip này dựa trên công nghệ 3nm của TSMC, tích hợp 336 tỷ bóng bán dẫn, thông lượng năng lượng trên mỗi đơn vị của khối lượng công việc AI thông minh đạt gấp 10 lần Blackwell. Rubin được trang bị 8 ngăn xếp bộ nhớ HBM4, tổng dung lượng 288 GB, băng thông đỉnh 22 TB/s, tăng 1,8 lần so với Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA công bố chi tiết GPU Rubin: 336 tỷ bóng bán dẫn, hiệu năng AI của tác nhân thông minh tăng gấp 10 lần so với Blackwell - Tin tức AI Aioga","description":"NVIDIA công bố chi tiết kiến trúc GPU Rubin, chip này dựa trên công nghệ 3nm của TSMC, tích hợp 336 tỷ bóng bán dẫn, thông lượng năng lượng trên mỗi đơn vị của khối lượng công việc...","url":"https://www.aioga.com/vi/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:07:07.615Z"},"id":{"title":"NVIDIA mengungkap detail GPU Rubin: 336 miliar transistor, kinerja AI agen cerdas meningkat 10 kali lipat dibanding Blackwell","summary":"Nvidia merilis detail arsitektur GPU Rubin, chip ini berbasis proses 3nm TSMC, mengintegrasikan 336 miliar transistor, dan throughput energi per unit untuk beban kerja AI cerdas mencapai 10 kali lipat dari Blackwell. Rubin dilengkapi dengan 8 tumpukan memori HBM4, dengan kapasitas total 288 GB, bandwidth puncak 22 TB/s, meningkat 1,8 kali dibandingkan Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA mengungkap detail GPU Rubin: 336 miliar transistor, kinerja AI agen cerdas meningkat 10 kali lipat dibanding Blackwell - Berita AI Aioga","description":"Nvidia merilis detail arsitektur GPU Rubin, chip ini berbasis proses 3nm TSMC, mengintegrasikan 336 miliar transistor, dan throughput energi per unit untuk beban kerja AI cerdas me...","url":"https://www.aioga.com/id/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:07:51.997Z"},"th":{"title":"NVIDIA เปิดเผยรายละเอียด GPU Rubin: 336 พันล้านทรานซิสเตอร์ ประสิทธิภาพ AI ของเอเย่นต์เพิ่มขึ้น 10 เท่าเมื่อเทียบกับ Blackwell","summary":"เอ็นวิเดียเปิดตัวรายละเอียดสถาปัตยกรรม GPU Rubin ชิปนี้สร้างขึ้นบนเทคโนโลยี 3nm ของ TSMC รวมทรานซิสเตอร์ 336 พันล้านตัว อัตราการใช้พลังงานต่อหน่วยงานในการประมวลผลงาน AI อัจฉริยะสูงกว่าของ Blackwell ถึง 10 เท่า Rubin มาพร้อมกับสแต็กหน่วยความจำ HBM4 จำนวน 8 สแต็ก ความจุรวม 288 GB แบนด์วิดธ์สูงสุด 22 TB/s เพิ่มขึ้น 1.8 เท่าเมื่อเทียบกับ Blackwell","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA เปิดเผยรายละเอียด GPU Rubin: 336 พันล้านทรานซิสเตอร์ ประสิทธิภาพ AI ของเอเย่นต์เพิ่มขึ้น 10 เท่าเมื่อเทียบกับ Blackwell - ข่าว AI Aioga","description":"เอ็นวิเดียเปิดตัวรายละเอียดสถาปัตยกรรม GPU Rubin ชิปนี้สร้างขึ้นบนเทคโนโลยี 3nm ของ TSMC รวมทรานซิสเตอร์ 336 พันล้านตัว อัตราการใช้พลังงานต่อหน่วยงานในการประมวลผลงาน AI อัจฉริยะสูง...","url":"https://www.aioga.com/th/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:07:52.498Z"},"pl":{"title":"NVIDIA ujawnia szczegóły GPU Rubin: 336 miliardów tranzystorów, wydajność AI dla agentów zwiększona 10-krotnie w porównaniu z Blackwell","summary":"NVIDIA opublikowała szczegóły architektury GPU Rubin. Chip oparty jest na procesie TSMC 3 nm, integruje 336 miliardów tranzystorów, a jednostkowa wydajność energetyczna dla obciążeń AI inteligentnych agentów osiąga 10-krotność Blackwell. Rubin wyposażony jest w 8 stosów pamięci HBM4 o łącznej pojemności 288 GB i maksymalnej przepustowości 22 TB/s, co stanowi 1,8-krotny wzrost w porównaniu do Blackwell.","category":"产品更新","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"NVIDIA ujawnia szczegóły GPU Rubin: 336 miliardów tranzystorów, wydajność AI dla agentów zwiększona 10-krotnie w porównaniu z Blackwell - Aioga Wiadomości AI","description":"NVIDIA opublikowała szczegóły architektury GPU Rubin. Chip oparty jest na procesie TSMC 3 nm, integruje 336 miliardów tranzystorów, a jednostkowa wydajność energetyczna dla obciąże...","url":"https://www.aioga.com/pl/news/cmrvq2os2001vbi85k8jkdrwi/","contentTranslated":true,"sourceHash":"4f39f1c39573eaf2","translatedAt":"2026-07-23T01:08:36.771Z"}}}}