{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-07-28T06:20:51.496Z","headline":"SK 海力士在美招募 DRAM-逻辑 3D 堆叠技术人才，面向设备内 AI 市场","description":"SK 海力士通过美国圣何塞子公司招募 DRAM-逻辑 3D 堆叠领域技术人才，旨在与美国客户合作领导 3D 堆叠 DRAM 逻辑芯片联合设计。该技术通过垂直堆叠 DRAM Die 与逻辑 Die 建立更多短距离 I/O 连接，以提升带宽、降低延迟、改进能效，满足大型端侧 AI 模型推理需求。","url":"https://www.aioga.com/news/cmryp9a2d03ltrolghccdsnel/","mainEntityOfPage":"https://www.aioga.com/news/cmryp9a2d03ltrolghccdsnel/","datePublished":"2026-07-24T08:10:43.000Z","dateModified":"2026-07-24T08:10:43.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/981/228.htm","https://aihot.virxact.com/items/cmryp9a2d03ltrolghccdsnel"],"canonicalUrl":"https://www.aioga.com/news/cmryp9a2d03ltrolghccdsnel/","directAnswer":{"@type":"Answer","text":"Aioga 编辑摘要：SK 海力士通过美国圣何塞子公司招募 DRAM-逻辑 3D 堆叠领域技术人才，旨在与美国客户合作领导 3D 堆叠 DRAM 逻辑芯片联合设计。 Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","url":"https://www.aioga.com/news/cmryp9a2d03ltrolghccdsnel/","dateCreated":"2026-07-24T08:10:43.000Z","author":{"@type":"Organization","@id":"https://www.aioga.com/authors/aioga-editorial/#editorial-team","name":"Aioga Editorial Team","url":"https://www.aioga.com/authors/aioga-editorial/"}},"evidence":[{"@type":"CreativeWork","name":"IT之家 source article","url":"https://www.ithome.com/0/981/228.htm","datePublished":"2026-07-24T08:10:43.000Z","provider":{"@type":"Organization","name":"IT之家","url":"https://www.ithome.com/0/981/228.htm"}},{"@type":"CreativeWork","name":"AIHot archive record","url":"https://aihot.virxact.com/items/cmryp9a2d03ltrolghccdsnel","datePublished":"2026-07-24T08:10:43.000Z","provider":{"@type":"Organization","name":"AIHot","url":"https://aihot.virxact.com/items/cmryp9a2d03ltrolghccdsnel"}}],"aggregationSource":"IT之家（RSS）","originalPublisher":{"name":"IT之家","url":"https://www.ithome.com/0/981/228.htm"},"article":{"id":"cmryp9a2d03ltrolghccdsnel","slug":"cmryp9a2d03ltrolghccdsnel","url":"https://www.aioga.com/news/cmryp9a2d03ltrolghccdsnel/","title":"SK 海力士在美招募 DRAM-逻辑 3D 堆叠技术人才，面向设备内 AI 市场","title_en":"消息称 SK 海力士在美招募 DRAM - 逻辑 3D 堆叠领域技术人才","summary":"SK 海力士通过美国圣何塞子公司招募 DRAM-逻辑 3D 堆叠领域技术人才，旨在与美国客户合作领导 3D 堆叠 DRAM 逻辑芯片联合设计。该技术通过垂直堆叠 DRAM Die 与逻辑 Die 建立更多短距离 I/O 连接，以提升带宽、降低延迟、改进能效，满足大型端侧 AI 模型推理需求。","source":"IT之家（RSS）","sourceUrl":"https://www.ithome.com/0/981/228.htm","aiHotUrl":"https://aihot.virxact.com/items/cmryp9a2d03ltrolghccdsnel","publishedAt":"2026-07-24T08:10:43.000Z","category":"行业动态","score":53,"selected":false,"articleBody":["IT之家：https://www.ithome.com/ 7 月 24 日消息，韩媒 ZDNET Korea 当地时间今日报道称，SK 海力士正通过其位于美国加利福尼亚州圣何塞的海外子公司 招募 DRAM - 逻辑 3D 堆叠领域技术人才 。","这一分支在招聘启事中表示 这项技术主要面向设备内 AI 市场 ，“我们正在寻找能够与美国客户紧密合作，领导 3D 堆叠 DRAM 逻辑芯片联合设计的优秀人才”，“我们的目标是提供满足不断变化的技术要求和市场需求的芯片设计解决方案”。","由于位宽相对有限，标准 LPDDR 并不能很好地承担大型端侧 AI 模型推理任务。而 3D 垂直堆叠 DRAM Die 与逻辑 Die 可在两者之间建立更多短距离 I/O 连接，从而提升带宽、降低延迟、改进能效 ，多家内存企业都在进行这一方面的探索。"],"articleImages":[{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/7/9a8cb8e8-3187-48ef-91bc-30e5c58a6991.jpg@s_2,w_820,h_461","alt":"","afterParagraph":1,"url":"/media/articles/cmryp9a2d03ltrolghccdsnel/e495412b3b81ed02.jpg"}],"mediaStatus":"ok","articleBodyZh":[],"translationStatus":"","bodyOrigin":"source-page","editorial":{"summary":"Aioga 编辑摘要：SK 海力士通过美国圣何塞子公司招募 DRAM-逻辑 3D 堆叠领域技术人才，旨在与美国客户合作领导 3D 堆叠 DRAM 逻辑芯片联合设计。 Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","background":"背景分析：公司与行业类动态需要放在竞争格局、商业化路径、资本信号和监管环境中观察，单条公告不能代表最终结果。","viewpoint":"Aioga 判断：这条动态更适合作为行业观察信号，当前信息足以建立线索，但不足以推导长期结论。","implications":"影响分析：对相关团队而言，短期应先核对来源、可用范围和实际成本，再判断是否值得接入或跟进。","nextStep":"后续观察：继续观察官方文件、合作落地、收入或用户信号、竞品动作和监管后续。","evidenceRefs":["title","summary","articleBody"],"confidence":"medium","status":"published","aiGenerated":false,"autoApproved":true,"generatedBy":"rule-safe-fallback","generatedAt":"2026-07-28T06:29:10.551Z","sourceHash":"13a187a2cd79ff56","validation":{"passed":true,"mode":"rule-safe-fallback","checks":["schema","length","source-attribution","no-html"]}},"tags":["行业动态","IT之家（RSS）"],"translations":{"zh-CN":{"title":"SK 海力士在美招募 DRAM-逻辑 3D 堆叠技术人才，面向设备内 AI 市场","summary":"SK 海力士通过美国圣何塞子公司招募 DRAM-逻辑 3D 堆叠领域技术人才，旨在与美国客户合作领导 3D 堆叠 DRAM 逻辑芯片联合设计。该技术通过垂直堆叠 DRAM Die 与逻辑 Die 建立更多短距离 I/O 连接，以提升带宽、降低延迟、改进能效，满足大型端侧 AI 模型推理需求。","category":"行业动态","source":"IT之家","aggregationSource":"IT之家（RSS）","pageTitle":"SK 海力士在美招募 DRAM-逻辑 3D 堆叠技术人才，面向设备内 AI 市场 - Aioga AI资讯","description":"SK 海力士通过美国圣何塞子公司招募 DRAM-逻辑 3D 堆叠领域技术人才，旨在与美国客户合作领导 3D 堆叠 DRAM 逻辑芯片联合设计。该技术通过垂直堆叠 DRAM Die 与逻辑 Die 建立更多短距离 I/O 连接，以提升带宽、降低延迟、改进能效，满足大型端侧 AI 模型推理需求。","url":"https://www.aioga.com/news/cmryp9a2d03ltrolghccdsnel/"},"en":{"title":"SK Hynix is recruiting DRAM-logic 3D stacking technology talents in the US, targeting the in-device AI market","summary":"SK Hynix is recruiting technical talent in the field of DRAM-logic 3D stacking through its subsidiary in San Jose, USA, aiming to lead the joint design of 3D stacked DRAM logic chips in collaboration with American customers. This technology establishes more short-distance I/O connections by vertically stacking DRAM Dies with logic Dies, in order to increase bandwidth, reduce latency, and improve energy efficiency, meeting the inference requirements of large-scale edge AI models.","category":"Industry","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix is recruiting DRAM-logic 3D stacking technology talents in the US, targeting the in-device AI market - Aioga AI News","description":"SK Hynix is recruiting technical talent in the field of DRAM-logic 3D stacking through its subsidiary in San Jose, USA, aiming to lead the joint design of 3D stacked DRAM logic chi...","url":"https://www.aioga.com/en/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:01:49.936Z"},"ja":{"title":"SKハイニックス、米国でDRAM-ロジック3D積層技術の人材を募集、デバイス内AI市場を対象","summary":"SKハイニックスはアメリカ・サンノゼの子会社を通じて、DRAM-ロジック3D積層分野の技術人材を採用し、アメリカの顧客と協力して3D積層DRAMロジックチップの共同設計をリードすることを目指しています。この技術は、垂直に積層されたDRAMダイとロジックダイを通じてより多くの短距離I/O接続を確立し、帯域幅を向上させ、遅延を低減し、エネルギー効率を改善することで、大規模なエッジAIモデルの推論ニーズを満たします。","category":"業界動向","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SKハイニックス、米国でDRAM-ロジック3D積層技術の人材を募集、デバイス内AI市場を対象 - Aioga AIニュース","description":"SKハイニックスはアメリカ・サンノゼの子会社を通じて、DRAM-ロジック3D積層分野の技術人材を採用し、アメリカの顧客と協力して3D積層DRAMロジックチップの共同設計をリードすることを目指しています。この技術は、垂直に積層されたDRAMダイとロジックダイを通じてより多くの短距離I/O接続を確立し、帯域幅を向上させ、遅延を低減し、エネルギー効率を改善すること...","url":"https://www.aioga.com/ja/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:02:06.521Z"},"ko":{"title":"SK 하이닉스, 미국에서 DRAM-논리 3D 적층 기술 인재 모집, 장치 내 AI 시장 대상","summary":"SK 하이닉스는 미국 산호세 자회사를 통해 DRAM-논리 3D 스택 분야 기술 인력을 모집하고 있으며, 미국 고객과 협력하여 3D 스택 DRAM 논리 칩 공동 설계를 주도하는 것을 목표로 하고 있습니다. 이 기술은 수직으로 쌓은 DRAM 다이와 논리 다이를 통해 더 많은 단거리 I/O 연결을 구축하여 대역폭을 향상시키고, 지연을 줄이며, 에너지 효율을 개선하여 대규모 엔드 AI 모델 추론 요구를 충족시킵니다.","category":"업계 동향","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK 하이닉스, 미국에서 DRAM-논리 3D 적층 기술 인재 모집, 장치 내 AI 시장 대상 - Aioga AI 뉴스","description":"SK 하이닉스는 미국 산호세 자회사를 통해 DRAM-논리 3D 스택 분야 기술 인력을 모집하고 있으며, 미국 고객과 협력하여 3D 스택 DRAM 논리 칩 공동 설계를 주도하는 것을 목표로 하고 있습니다. 이 기술은 수직으로 쌓은 DRAM 다이와 논리 다이를 통해 더 많은 단거리 I/O 연결을 구축하여 대역폭을 향상시키고,...","url":"https://www.aioga.com/ko/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:02:46.868Z"},"es":{"title":"SK Hynix está reclutando en Estados Unidos talento en tecnología de apilamiento 3D de DRAM-lógica, dirigido al mercado de IA en dispositivos","summary":"SK Hynix está reclutando talentos técnicos en el campo de DRAM-lógica apilada en 3D a través de su subsidiaria en San José, Estados Unidos, con el objetivo de colaborar con clientes estadounidenses para liderar el diseño conjunto de chips de lógica DRAM apilados en 3D. Esta tecnología establece más conexiones I/O de corta distancia mediante el apilamiento vertical de DRAM Die y lógica Die, con el fin de aumentar el ancho de banda, reducir la latencia, mejorar la eficiencia energética y satisfacer las necesidades de inferencia de modelos de inteligencia artificial a gran escala en el extremo.","category":"Industria","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix está reclutando en Estados Unidos talento en tecnología de apilamiento 3D de DRAM-lógica, dirigido al mercado de IA en dispositivos - Aioga Noticias de IA","description":"SK Hynix está reclutando talentos técnicos en el campo de DRAM-lógica apilada en 3D a través de su subsidiaria en San José, Estados Unidos, con el objetivo de colaborar con cliente...","url":"https://www.aioga.com/es/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:02:43.500Z"},"fr":{"title":"SK Hynix recrute aux États-Unis des talents en technologie d'empilement 3D DRAM-logique, ciblant le marché de l'IA intégrée aux appareils","summary":"SK Hynix recrute des talents techniques dans le domaine de l'empilement 3D DRAM-logique via sa filiale américaine à San José, dans le but de collaborer avec des clients américains pour diriger la co-conception de puces logiques DRAM empilées en 3D. Cette technologie établit davantage de connexions I/O à courte distance en empilant verticalement les dies DRAM et les dies logiques, afin d'améliorer la bande passante, de réduire la latence et d'optimiser l'efficacité énergétique, répondant aux besoins de l'inférence des grands modèles d'IA côté client.","category":"Industrie","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix recrute aux États-Unis des talents en technologie d'empilement 3D DRAM-logique, ciblant le marché de l'IA intégrée aux appareils - Aioga Actualités IA","description":"SK Hynix recrute des talents techniques dans le domaine de l'empilement 3D DRAM-logique via sa filiale américaine à San José, dans le but de collaborer avec des clients américains...","url":"https://www.aioga.com/fr/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:03:24.853Z"},"de":{"title":"SK Hynix rekrutiert in den USA Talente für DRAM-Logik-3D-Stacking-Technologie, ausgerichtet auf den AI-Markt innerhalb von Geräten","summary":"SK Hynix rekrutiert über seine Tochtergesellschaft in San Jose, USA, Fachkräfte im Bereich DRAM-Logik 3D-Stacking, mit dem Ziel, gemeinsam mit US-Kunden die gemeinsame Entwicklung von 3D-Stacked-DRAM-Logikchips zu leiten. Diese Technologie baut durch das vertikale Stapeln von DRAM-Die und Logik-Die mehr kurzstreckige I/O-Verbindungen auf, um die Bandbreite zu erhöhen, die Latenz zu verringern und die Energieeffizienz zu verbessern, um den Anforderungen großer AI-Modellinferenz auf der Edge-Seite gerecht zu werden.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix rekrutiert in den USA Talente für DRAM-Logik-3D-Stacking-Technologie, ausgerichtet auf den AI-Markt innerhalb von Geräten - Aioga KI-News","description":"SK Hynix rekrutiert über seine Tochtergesellschaft in San Jose, USA, Fachkräfte im Bereich DRAM-Logik 3D-Stacking, mit dem Ziel, gemeinsam mit US-Kunden die gemeinsame Entwicklung...","url":"https://www.aioga.com/de/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:03:22.603Z"},"pt-BR":{"title":"A SK Hynix está recrutando talentos em tecnologia de empilhamento 3D DRAM-lógica nos EUA, voltados para o mercado de IA em dispositivos","summary":"A SK Hynix está recrutando talentos na área de tecnologia de empilhamento 3D DRAM-lógica através de sua subsidiária em San José, nos Estados Unidos, com o objetivo de colaborar com clientes americanos na liderança do co-design de chips lógicos 3D empilhados de DRAM. Essa tecnologia estabelece mais conexões I/O de curta distância ao empilhar verticalmente os DRAM Dies com os Logic Dies, para aumentar a largura de banda, reduzir a latência, melhorar a eficiência energética e atender às necessidades de inferência de grandes modelos de IA no lado do dispositivo.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"A SK Hynix está recrutando talentos em tecnologia de empilhamento 3D DRAM-lógica nos EUA, voltados para o mercado de IA em dispositivos - Aioga Notícias de IA","description":"A SK Hynix está recrutando talentos na área de tecnologia de empilhamento 3D DRAM-lógica através de sua subsidiária em San José, nos Estados Unidos, com o objetivo de colaborar com...","url":"https://www.aioga.com/pt-BR/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:04:03.779Z"},"ru":{"title":"SK Hynix набирает специалистов по DRAM-логике и 3D-структурам в США для рынка встроенного ИИ","summary":"SK Hynix через свою дочернюю компанию в Сан-Хосе, США, нанимает специалистов в области технологий 3D-стековых DRAM-логических решений с целью совместного с американскими клиентами руководства совместным проектированием 3D-стековых DRAM-логических чипов. Эта технология обеспечивает больше коротких I/O соединений путем вертикального стаканирования DRAM-микросхем и логических микросхем для повышения пропускной способности, снижения задержек, улучшения энергоэффективности и удовлетворения требований крупных моделей AI для вывода на конечных устройствах.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix набирает специалистов по DRAM-логике и 3D-структурам в США для рынка встроенного ИИ - Aioga Новости ИИ","description":"SK Hynix через свою дочернюю компанию в Сан-Хосе, США, нанимает специалистов в области технологий 3D-стековых DRAM-логических решений с целью совместного с американскими клиентами...","url":"https://www.aioga.com/ru/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:04:03.256Z"},"ar":{"title":"تقوم SK هايبليكس بالتوظيف في الولايات المتحدة لمواهب تقنية التكديس الثلاثي الأبعاد للذاكرة الديناميكية DRAM-المنطق، موجهة إلى سوق الذكاء الاصطناعي داخل الأجهزة","summary":"تقوم شركة SK Hynix عبر فرعها في سان خوسيه بالولايات المتحدة بتوظيف مواهب تقنية في مجال DRAM-المنطق المكدس ثلاثي الأبعاد، بهدف التعاون مع العملاء الأمريكيين لقيادة التصميم المشترك لشريحة المنطق DRAM المكدسة ثلاثية الأبعاد. تعتمد هذه التقنية على تكديس شرائح DRAM بشكل عمودي مع شرائح المنطق لإنشاء مزيد من الاتصالات القصيرة المدى I/O، وذلك لزيادة عرض النطاق الترددي، وتقليل التأخير، وتحسين كفاءة الطاقة، لتلبية احتياجات الاستنتاج لنماذج الذكاء الاصطناعي الكبيرة على الطرف.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"تقوم SK هايبليكس بالتوظيف في الولايات المتحدة لمواهب تقنية التكديس الثلاثي الأبعاد للذاكرة الديناميكية DRAM-المنطق، موجهة إلى سوق الذكاء الاصطناعي داخل الأجهزة - Aioga أخبار الذكاء الاصطناعي","description":"تقوم شركة SK Hynix عبر فرعها في سان خوسيه بالولايات المتحدة بتوظيف مواهب تقنية في مجال DRAM-المنطق المكدس ثلاثي الأبعاد، بهدف التعاون مع العملاء الأمريكيين لقيادة التصميم المشترك ل...","url":"https://www.aioga.com/ar/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:04:44.987Z"},"hi":{"title":"SK हायनिक्स अमेरिका में DRAM-लॉजिक 3D स्टैकिंग तकनीक के पेशेवरों की भर्ती कर रहा है, डिवाइस-इन एआई मार्केट को लक्षित करते हुए","summary":"SK Hynix अपने अमेरिका के सैन जोस सहायक कंपनी के माध्यम से DRAM-लॉजिक 3D स्टैकिंग क्षेत्र में तकनीकी प्रतिभाओं की भर्ती कर रहा है, जिसका उद्देश्य अमेरिकी ग्राहकों के साथ मिलकर 3D स्टैकिंग DRAM लॉजिक चिप्स के संयुक्त डिज़ाइन का नेतृत्व करना है। यह तकनीक, DRAM डाई और लॉजिक डाई को ऊर्ध्वाधर रूप से स्टैक करके और अधिक छोटे दूरी वाले I/O कनेक्शन स्थापित कर के, बैंडविड्थ बढ़ाने, विलंबता घटाने और ऊर्जा दक्षता में सुधार करने में सक्षम है, जिससे बड़े एंड-साइड AI मॉडल इंसाइनिंग आवश्यकताओं को पूरा किया जा सके।","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK हायनिक्स अमेरिका में DRAM-लॉजिक 3D स्टैकिंग तकनीक के पेशेवरों की भर्ती कर रहा है, डिवाइस-इन एआई मार्केट को लक्षित करते हुए - Aioga AI समाचार","description":"SK Hynix अपने अमेरिका के सैन जोस सहायक कंपनी के माध्यम से DRAM-लॉजिक 3D स्टैकिंग क्षेत्र में तकनीकी प्रतिभाओं की भर्ती कर रहा है, जिसका उद्देश्य अमेरिकी ग्राहकों के साथ मिलकर 3D स्...","url":"https://www.aioga.com/hi/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:04:55.010Z"},"it":{"title":"SK Hynix recluta negli Stati Uniti talenti per la tecnologia di impilamento 3D DRAM-Logica, rivolti al mercato AI nei dispositivi","summary":"SK Hynix sta reclutando talenti tecnologici nel campo del DRAM-logica 3D stacking attraverso la sua filiale americana a San Jose, con l'obiettivo di collaborare con i clienti statunitensi nella progettazione congiunta di chip logici DRAM 3D stacked. Questa tecnologia crea più connessioni I/O a breve distanza tramite l'impilamento verticale dei DRAM Die e dei Logica Die, al fine di aumentare la larghezza di banda, ridurre la latenza e migliorare l'efficienza energetica, soddisfacendo le esigenze di inferenza dei modelli AI di grandi dimensioni lato client.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix recluta negli Stati Uniti talenti per la tecnologia di impilamento 3D DRAM-Logica, rivolti al mercato AI nei dispositivi - Aioga Notizie IA","description":"SK Hynix sta reclutando talenti tecnologici nel campo del DRAM-logica 3D stacking attraverso la sua filiale americana a San Jose, con l'obiettivo di collaborare con i clienti statu...","url":"https://www.aioga.com/it/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:05:32.950Z"},"nl":{"title":"SK Hynix werft in de VS talent voor DRAM-logica en 3D-stapelingstechnologie, gericht op de AI-markt in apparaten","summary":"SK Hynix werft via zijn Amerikaanse dochteronderneming in San Jose technisch talent op het gebied van DRAM-logica 3D-stapeling, met als doel samen te werken met Amerikaanse klanten aan het gezamenlijke ontwerp van 3D-stapeling DRAM-logische chips. Deze technologie creëert door verticale stapeling van DRAM- en logica-chips meer korteafstands I/O-verbindingen, om de bandbreedte te verhogen, de latentie te verlagen en de energie-efficiëntie te verbeteren, en te voldoen aan de behoefte van grote AI-model inferenties aan de kant van de gebruiker.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix werft in de VS talent voor DRAM-logica en 3D-stapelingstechnologie, gericht op de AI-markt in apparaten - Aioga AI-nieuws","description":"SK Hynix werft via zijn Amerikaanse dochteronderneming in San Jose technisch talent op het gebied van DRAM-logica 3D-stapeling, met als doel samen te werken met Amerikaanse klanten...","url":"https://www.aioga.com/nl/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:05:33.446Z"},"tr":{"title":"SK Hynix, ABD'de DRAM-Logic 3D yığınlama teknolojisi yetenekleri için işe alım yapıyor, cihaz içi AI pazarı hedefleniyor","summary":"SK Hynix, ABD'nin San Jose şubesi aracılığıyla DRAM-logic 3D yığın alanında teknik yetenekler işe alıyor ve ABD müşterileri ile iş birliği yaparak 3D yığılmış DRAM mantık çiplerinin ortak tasarımını liderlik etmeyi hedefliyor. Bu teknoloji, DRAM Die ile mantık Die'i dikey olarak yığarak daha fazla kısa mesafeli I/O bağlantısı kurarak bant genişliğini arttırır, gecikmeyi azaltır, enerji verimliliğini iyileştirir ve büyük ölçekli uç taraf AI model çıkarım gereksinimlerini karşılar.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix, ABD'de DRAM-Logic 3D yığınlama teknolojisi yetenekleri için işe alım yapıyor, cihaz içi AI pazarı hedefleniyor - Aioga AI Haberleri","description":"SK Hynix, ABD'nin San Jose şubesi aracılığıyla DRAM-logic 3D yığın alanında teknik yetenekler işe alıyor ve ABD müşterileri ile iş birliği yaparak 3D yığılmış DRAM mantık çiplerini...","url":"https://www.aioga.com/tr/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:06:14.580Z"},"vi":{"title":"SK Hynix tuyển dụng nhân tài công nghệ xếp chồng 3D DRAM-logic tại Mỹ, hướng tới thị trường AI trong thiết bị","summary":"SK Hynix thông qua chi nhánh tại San Jose, Mỹ tuyển dụng nhân tài trong lĩnh vực DRAM-logic 3D stacking, nhằm hợp tác với khách hàng Mỹ để dẫn đầu thiết kế hợp tác chip logic DRAM 3D stacking. Công nghệ này thiết lập nhiều kết nối I/O cự ly ngắn hơn bằng cách xếp chồng DRAM Die và logic Die theo chiều dọc, để nâng cao băng thông, giảm độ trễ, cải thiện hiệu quả năng lượng, đáp ứng nhu cầu suy luận mô hình AI lớn ở phía thiết bị.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix tuyển dụng nhân tài công nghệ xếp chồng 3D DRAM-logic tại Mỹ, hướng tới thị trường AI trong thiết bị - Tin tức AI Aioga","description":"SK Hynix thông qua chi nhánh tại San Jose, Mỹ tuyển dụng nhân tài trong lĩnh vực DRAM-logic 3D stacking, nhằm hợp tác với khách hàng Mỹ để dẫn đầu thiết kế hợp tác chip logic DRAM...","url":"https://www.aioga.com/vi/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:06:14.146Z"},"id":{"title":"SK Hynix merekrut talenta teknologi tumpukan 3D DRAM-logika di AS, ditujukan untuk pasar AI dalam perangkat","summary":"SK Hynix merekrut talenta teknologi di bidang DRAM-logika 3D stacking melalui anak perusahaannya di San Jose, Amerika Serikat, dengan tujuan bekerjasama dengan pelanggan di AS untuk memimpin desain bersama chip logika DRAM 3D stacking. Teknologi ini menciptakan lebih banyak koneksi I/O jarak pendek melalui penumpukan vertikal DRAM Die dengan logika Die, untuk meningkatkan bandwidth, mengurangi latensi, dan memperbaiki efisiensi energi, guna memenuhi kebutuhan inferensi model AI skala besar di sisi terminal.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix merekrut talenta teknologi tumpukan 3D DRAM-logika di AS, ditujukan untuk pasar AI dalam perangkat - Berita AI Aioga","description":"SK Hynix merekrut talenta teknologi di bidang DRAM-logika 3D stacking melalui anak perusahaannya di San Jose, Amerika Serikat, dengan tujuan bekerjasama dengan pelanggan di AS untu...","url":"https://www.aioga.com/id/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:06:51.709Z"},"th":{"title":"SK Hynix กำลังรับสมัครบุคลากรด้านเทคโนโลยีการซ้อน 3D ของ DRAM-Logic ในสหรัฐอเมริกา สำหรับตลาด AI ภายในอุปกรณ์","summary":"SK Hynix ผ่านบริษัทลูกในซานโฮเซ่ ประเทศสหรัฐอเมริกา กำลังสรรหาบุคลากรทางเทคนิคด้าน DRAM-ลอจิกในสาขาการซ้อน 3D โดยมีจุดมุ่งหมายเพื่อร่วมมือกับลูกค้าในสหรัฐอเมริกาในการเป็นผู้นำด้านการออกแบบร่วมชิป DRAM ลอจิกแบบซ้อน 3D เทคโนโลยีนี้สร้างการเชื่อมต่อ I/O ระยะสั้นมากขึ้นโดยการซ้อน DRAM Die กับ Logic Die ในแนวตั้ง เพื่อเพิ่มแบนด์วิดท์ ลดความหน่วง ปรับปรุงประสิทธิภาพการใช้พลังงาน และตอบสนองความต้องการของการอนุมานโมเดล AI ขนาดใหญ่ฝั่งปลายทาง","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix กำลังรับสมัครบุคลากรด้านเทคโนโลยีการซ้อน 3D ของ DRAM-Logic ในสหรัฐอเมริกา สำหรับตลาด AI ภายในอุปกรณ์ - ข่าว AI Aioga","description":"SK Hynix ผ่านบริษัทลูกในซานโฮเซ่ ประเทศสหรัฐอเมริกา กำลังสรรหาบุคลากรทางเทคนิคด้าน DRAM-ลอจิกในสาขาการซ้อน 3D โดยมีจุดมุ่งหมายเพื่อร่วมมือกับลูกค้าในสหรัฐอเมริกาในการเป็นผู้นำด้านก...","url":"https://www.aioga.com/th/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:07:00.391Z"},"pl":{"title":"SK Hynix rekrutuje w USA specjalistów od technologii DRAM-logic 3D stacked, skierowanych na rynek AI w urządzeniach","summary":"SK Hynix rekrutuje specjalistów technologii DRAM-logika 3D stacking poprzez swoją spółkę zależną w San Jose w USA, mając na celu współpracę z amerykańskimi klientami w prowadzeniu wspólnego projektowania 3D-stakowanych chipów DRAM logicznych. Technologia ta tworzy więcej krótkodystansowych połączeń I/O poprzez pionowe układanie warstw DRAM Die i Logic Die, aby zwiększyć przepustowość, zmniejszyć opóźnienia, poprawić efektywność energetyczną i sprostać wymaganiom dużych modeli AI po stronie końcowej.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"SK Hynix rekrutuje w USA specjalistów od technologii DRAM-logic 3D stacked, skierowanych na rynek AI w urządzeniach - Aioga Wiadomości AI","description":"SK Hynix rekrutuje specjalistów technologii DRAM-logika 3D stacking poprzez swoją spółkę zależną w San Jose w USA, mając na celu współpracę z amerykańskimi klientami w prowadzeniu...","url":"https://www.aioga.com/pl/news/cmryp9a2d03ltrolghccdsnel/","contentTranslated":true,"sourceHash":"cc42661c5dd06e1f","translatedAt":"2026-07-26T21:07:48.741Z"}}}}