{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-07-28T06:20:51.496Z","headline":"三星电子与博通签署 2000 亿美元合作备忘录，聚焦 HBM 及 2nm 制程","description":"三星电子与博通在 AI 峰会上签署谅解备忘录，预计截至 2030 年双方在存储器和晶圆代工领域的合作规模将超过 2000 亿美元。合作内容包括为博通下一代 AI 加速器提供 HBM 等存储器解决方案，以及三星为博通无线宽带通信产品提供 2nm 及以下制程技术，并扩展至基于 2nm 的 2.3D/2.5D 先进封装。","url":"https://www.aioga.com/news/cms2mqllz02eyro3fcakd7y9k/","mainEntityOfPage":"https://www.aioga.com/news/cms2mqllz02eyro3fcakd7y9k/","datePublished":"2026-07-27T02:15:26.000Z","dateModified":"2026-07-27T02:15:26.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/981/853.htm","https://aihot.virxact.com/items/cms2mqllz02eyro3fcakd7y9k"],"canonicalUrl":"https://www.aioga.com/news/cms2mqllz02eyro3fcakd7y9k/","directAnswer":{"@type":"Answer","text":"Aioga 编辑摘要：三星电子与博通在 AI 峰会上签署谅解备忘录，预计截至 2030 年双方在存储器和晶圆代工领域的合作规模将超过 2000 亿美元。 Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","url":"https://www.aioga.com/news/cms2mqllz02eyro3fcakd7y9k/","dateCreated":"2026-07-27T02:15:26.000Z","author":{"@type":"Organization","@id":"https://www.aioga.com/authors/aioga-editorial/#editorial-team","name":"Aioga Editorial Team","url":"https://www.aioga.com/authors/aioga-editorial/"}},"evidence":[{"@type":"CreativeWork","name":"IT之家 source article","url":"https://www.ithome.com/0/981/853.htm","datePublished":"2026-07-27T02:15:26.000Z","provider":{"@type":"Organization","name":"IT之家","url":"https://www.ithome.com/0/981/853.htm"}},{"@type":"CreativeWork","name":"AIHot archive record","url":"https://aihot.virxact.com/items/cms2mqllz02eyro3fcakd7y9k","datePublished":"2026-07-27T02:15:26.000Z","provider":{"@type":"Organization","name":"AIHot","url":"https://aihot.virxact.com/items/cms2mqllz02eyro3fcakd7y9k"}}],"aggregationSource":"IT之家（RSS）","originalPublisher":{"name":"IT之家","url":"https://www.ithome.com/0/981/853.htm"},"article":{"id":"cms2mqllz02eyro3fcakd7y9k","slug":"cms2mqllz02eyro3fcakd7y9k","url":"https://www.aioga.com/news/cms2mqllz02eyro3fcakd7y9k/","title":"三星电子与博通签署 2000 亿美元合作备忘录，聚焦 HBM 及 2nm 制程","title_en":"三星电子与博通 5 年 2000 亿美元合作将围绕 HBM、2nm 及以下先进制程等展开","summary":"三星电子与博通在 AI 峰会上签署谅解备忘录，预计截至 2030 年双方在存储器和晶圆代工领域的合作规模将超过 2000 亿美元。合作内容包括为博通下一代 AI 加速器提供 HBM 等存储器解决方案，以及三星为博通无线宽带通信产品提供 2nm 及以下制程技术，并扩展至基于 2nm 的 2.3D/2.5D 先进封装。","source":"IT之家（RSS）","sourceUrl":"https://www.ithome.com/0/981/853.htm","aiHotUrl":"https://aihot.virxact.com/items/cms2mqllz02eyro3fcakd7y9k","publishedAt":"2026-07-27T02:15:26.000Z","category":"行业动态","score":50,"selected":false,"articleBody":["IT之家：https://www.ithome.com/ 7 月 27 日消息，三星电子与博通当地时间 25 日在美国加利福尼亚州旧金山举行的 AI 峰会上签署了一份谅解备忘录。","两家企业预计双方在截至 2030 年的五年内在存储器和晶圆代工领域的合作规模将 超过 2000 亿美元 （IT之家注：现汇率约合 1.36 万亿元人民币）。","在存储器方面，三星和博通计划开展战略合作， 提供包括 HBM 在内的业界领先存储器解决方案 ，以支持博通的下一代人工智能加速器。","而在晶圆代工领域，双方的合作重点在于 三星为博通无线宽带通信 (WBC) 等产品提供的 2nm 及以下制程技术 。该项合作范围 预计还将扩展至基于三星 2nm 的 2.3D / 2.5D 先进封装技术 ，以提升人工智能和网络芯片的性能与能效。","人工智能正在推动对涵盖存储器、逻辑和先进封装等高度集成半导体技术前所未有的需求。通过扩大与博通在这些关键技术领域的合作，我们期待在为客户创造更大价值的同时，推进未来人工智能基础设施的发展。"],"articleImages":[{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/7/80dab426-1eea-4948-9a27-f9a2f5021207.jpg?x-bce-process=image/format,f_auto","alt":"","afterParagraph":3,"url":"/media/articles/cms2mqllz02eyro3fcakd7y9k/18cc05ee5226c8f5.jpg"}],"mediaStatus":"ok","articleBodyZh":[],"translationStatus":"","bodyOrigin":"source-page","editorial":{"summary":"Aioga 编辑摘要：三星电子与博通在 AI 峰会上签署谅解备忘录，预计截至 2030 年双方在存储器和晶圆代工领域的合作规模将超过 2000 亿美元。 Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","background":"背景分析：公司与行业类动态需要放在竞争格局、商业化路径、资本信号和监管环境中观察，单条公告不能代表最终结果。","viewpoint":"Aioga 判断：这条动态更适合作为行业观察信号，当前信息足以建立线索，但不足以推导长期结论。","implications":"影响分析：对相关团队而言，短期应先核对来源、可用范围和实际成本，再判断是否值得接入或跟进。","nextStep":"后续观察：继续观察官方文件、合作落地、收入或用户信号、竞品动作和监管后续。","evidenceRefs":["title","summary","articleBody"],"confidence":"medium","status":"published","aiGenerated":false,"autoApproved":true,"generatedBy":"rule-safe-fallback","generatedAt":"2026-07-28T06:29:10.479Z","sourceHash":"3eea497139977197","validation":{"passed":true,"mode":"rule-safe-fallback","checks":["schema","length","source-attribution","no-html"]}},"tags":["行业动态","IT之家（RSS）"],"translations":{"zh-CN":{"title":"三星电子与博通签署 2000 亿美元合作备忘录，聚焦 HBM 及 2nm 制程","summary":"三星电子与博通在 AI 峰会上签署谅解备忘录，预计截至 2030 年双方在存储器和晶圆代工领域的合作规模将超过 2000 亿美元。合作内容包括为博通下一代 AI 加速器提供 HBM 等存储器解决方案，以及三星为博通无线宽带通信产品提供 2nm 及以下制程技术，并扩展至基于 2nm 的 2.3D/2.5D 先进封装。","category":"行业动态","source":"IT之家","aggregationSource":"IT之家（RSS）","pageTitle":"三星电子与博通签署 2000 亿美元合作备忘录，聚焦 HBM 及 2nm 制程 - Aioga AI资讯","description":"三星电子与博通在 AI 峰会上签署谅解备忘录，预计截至 2030 年双方在存储器和晶圆代工领域的合作规模将超过 2000 亿美元。合作内容包括为博通下一代 AI 加速器提供 HBM 等存储器解决方案，以及三星为博通无线宽带通信产品提供 2nm 及以下制程技术，并扩展至基于 2nm 的 2.3D/2.5D 先进封装。","url":"https://www.aioga.com/news/cms2mqllz02eyro3fcakd7y9k/"},"en":{"title":"Samsung Electronics and Broadcom sign a $200 billion memorandum of understanding for cooperation, focusing on HBM and 2nm process","summary":"Samsung Electronics and Broadcom signed a memorandum of understanding at the AI Summit, and it is expected that by 2030, the scale of cooperation between the two parties in the fields of memory and wafer foundry will exceed 200 billion USD. The cooperation includes providing memory solutions such as HBM for Broadcom's next-generation AI accelerators, and Samsung providing 2nm and below process technology for Broadcom's wireless broadband communication products, expanding to 2.3D/2.5D advanced packaging based on 2nm technology.","category":"Industry","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics and Broadcom sign a $200 billion memorandum of understanding for cooperation, focusing on HBM and 2nm process - Aioga AI News","description":"Samsung Electronics and Broadcom signed a memorandum of understanding at the AI Summit, and it is expected that by 2030, the scale of cooperation between the two parties in the fie...","url":"https://www.aioga.com/en/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:02:35.769Z"},"ja":{"title":"サムスン電子とブロードコムが2000億ドルの協力覚書に署名、高帯域幅メモリ（HBM）および2nmプロセスに注力","summary":"サムスン電子とブロードコムはAIサミットで覚書を締結し、2030年までに両社はメモリおよびウェハーファウンドリ分野での協力規模が2000億ドルを超えると見込んでいる。協力内容には、ブロードコムの次世代AIアクセラレータ向けにHBMなどのメモリソリューションを提供することや、サムスンがブロードコムの無線ブロードバンド通信製品向けに2nmおよびそれ以下のプロセス技術を提供し、2nmベースの2.3D/2.5D先進パッケージングまで拡大することが含まれる。","category":"業界動向","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"サムスン電子とブロードコムが2000億ドルの協力覚書に署名、高帯域幅メモリ（HBM）および2nmプロセスに注力 - Aioga AIニュース","description":"サムスン電子とブロードコムはAIサミットで覚書を締結し、2030年までに両社はメモリおよびウェハーファウンドリ分野での協力規模が2000億ドルを超えると見込んでいる。協力内容には、ブロードコムの次世代AIアクセラレータ向けにHBMなどのメモリソリューションを提供することや、サムスンがブロードコムの無線ブロードバンド通信製品向けに2nmおよびそれ以下のプロセス...","url":"https://www.aioga.com/ja/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:02:44.984Z"},"ko":{"title":"삼성전자와 브로드컴, 2000억 달러 협력 양해각서 체결, HBM 및 2nm 공정 집중","summary":"삼성전자와 브로드컴은 AI 정상회담에서 양해각서(MOU)를 체결했으며, 양측은 2030년까지 메모리와 웨이퍼 파운드리 분야에서의 협력 규모가 2천억 달러를 초과할 것으로 예상하고 있습니다. 협력 내용에는 브로드컴의 차세대 AI 가속기를 위한 HBM 등 메모리 솔루션 제공과 삼성전자가 브로드컴의 무선 광대역 통신 제품에 2nm 이하 공정 기술을 제공하고, 2nm 기반 2.3D/2.5D 첨단 패키징으로 확장하는 것이 포함됩니다.","category":"업계 동향","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"삼성전자와 브로드컴, 2000억 달러 협력 양해각서 체결, HBM 및 2nm 공정 집중 - Aioga AI 뉴스","description":"삼성전자와 브로드컴은 AI 정상회담에서 양해각서(MOU)를 체결했으며, 양측은 2030년까지 메모리와 웨이퍼 파운드리 분야에서의 협력 규모가 2천억 달러를 초과할 것으로 예상하고 있습니다. 협력 내용에는 브로드컴의 차세대 AI 가속기를 위한 HBM 등 메모리 솔루션 제공과 삼성전자가 브로드컴의 무선 광대역 통신 제품에 2...","url":"https://www.aioga.com/ko/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:03:35.611Z"},"es":{"title":"Samsung Electronics y Broadcom firman un memorando de cooperación de 200 mil millones de dólares, centrado en HBM y el proceso de 2 nm","summary":"Samsung Electronics y Broadcom firmaron un memorando de entendimiento en la cumbre de IA, y se espera que para 2030 la escala de cooperación entre ambas partes en los campos de memoria y fabricación de obleas supere los 200 mil millones de dólares. El contenido de la cooperación incluye proporcionar a la próxima generación de aceleradores de IA de Broadcom soluciones de memoria como HBM, así como que Samsung suministre a los productos de comunicación inalámbrica de banda ancha de Broadcom tecnología de proceso de 2 nm y menores, y se amplíe a empaquetado avanzado 2.3D/2.5D basado en 2 nm.","category":"Industria","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics y Broadcom firman un memorando de cooperación de 200 mil millones de dólares, centrado en HBM y el proceso de 2 nm - Aioga Noticias de IA","description":"Samsung Electronics y Broadcom firmaron un memorando de entendimiento en la cumbre de IA, y se espera que para 2030 la escala de cooperación entre ambas partes en los campos de mem...","url":"https://www.aioga.com/es/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:03:32.888Z"},"fr":{"title":"Samsung Electronics et Broadcom signent un protocole d'accord de 200 milliards de dollars, axé sur la HBM et le procédé 2 nm","summary":"Samsung Electronics et Broadcom ont signé un protocole d'accord lors du sommet sur l'IA, et il est prévu qu'à l'horizon 2030, l'échelle de leur coopération dans les domaines de la mémoire et de la fonderie dépassera 200 milliards de dollars. Le contenu de la coopération comprend la fourniture par Samsung de solutions de mémoire telles que HBM pour les accélérateurs IA de prochaine génération de Broadcom, ainsi que la fourniture par Samsung à Broadcom de technologies de processus de 2 nm et moins pour les produits de communication sans fil à large bande, et l'extension aux emballages avancés 2.3D/2.5D basés sur 2 nm.","category":"Industrie","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics et Broadcom signent un protocole d'accord de 200 milliards de dollars, axé sur la HBM et le procédé 2 nm - Aioga Actualités IA","description":"Samsung Electronics et Broadcom ont signé un protocole d'accord lors du sommet sur l'IA, et il est prévu qu'à l'horizon 2030, l'échelle de leur coopération dans les domaines de la...","url":"https://www.aioga.com/fr/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:04:18.822Z"},"de":{"title":"Samsung Electronics unterzeichnet mit Broadcom ein 200-Milliarden-Dollar-Kooperationsmemorandum, mit Fokus auf HBM und 2-nm-Fertigung","summary":"Samsung Electronics und Broadcom haben auf dem AI-Gipfel ein Memorandum of Understanding unterzeichnet. Es wird erwartet, dass das Ausmaß der Zusammenarbeit der beiden Unternehmen im Bereich Speicher und Wafer-Fertigung bis 2030 200 Milliarden US-Dollar übersteigen wird. Der Kooperationsinhalt umfasst die Bereitstellung von Speicherlösungen wie HBM für Broadcoms nächste Generation von AI-Beschleunigern sowie Samsung die Bereitstellung von 2-nm- und darunter liegenden Fertigungstechnologien für Broadcoms drahtlose Breitbandkommunikationsprodukte und die Erweiterung auf fortschrittliche 2.3D/2.5D-Verpackungen auf Basis von 2 nm.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics unterzeichnet mit Broadcom ein 200-Milliarden-Dollar-Kooperationsmemorandum, mit Fokus auf HBM und 2-nm-Fertigung - Aioga KI-News","description":"Samsung Electronics und Broadcom haben auf dem AI-Gipfel ein Memorandum of Understanding unterzeichnet. Es wird erwartet, dass das Ausmaß der Zusammenarbeit der beiden Unternehmen...","url":"https://www.aioga.com/de/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:04:12.076Z"},"pt-BR":{"title":"A Samsung Electronics assinou um memorando de cooperação de 200 bilhões de dólares com a Broadcom, focando em HBM e processos de 2nm","summary":"A Samsung Electronics e a Broadcom assinaram um memorando de entendimento na Cúpula de IA, com a expectativa de que, até 2030, a escala de colaboração entre as duas empresas nos campos de memória e foundry de wafers supere 200 bilhões de dólares. O conteúdo da colaboração inclui fornecer soluções de memória, como HBM, para o próximo acelerador de IA da Broadcom, bem como a Samsung fornecer tecnologia de processo de 2nm e inferior para produtos de comunicação de banda larga sem fio da Broadcom, e expandir para embalagens avançadas baseadas em 2nm de 2.3D/2.5D.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"A Samsung Electronics assinou um memorando de cooperação de 200 bilhões de dólares com a Broadcom, focando em HBM e processos de 2nm - Aioga Notícias de IA","description":"A Samsung Electronics e a Broadcom assinaram um memorando de entendimento na Cúpula de IA, com a expectativa de que, até 2030, a escala de colaboração entre as duas empresas nos ca...","url":"https://www.aioga.com/pt-BR/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:04:55.477Z"},"ru":{"title":"Samsung Electronics и Broadcom подписали меморандум о сотрудничестве на 200 миллиардов долларов, сосредоточенный на HBM и 2-нм техпроцессе","summary":"Samsung Electronics и Broadcom подписали меморандум о взаимопонимании на AI-саммите, и ожидается, что к 2030 году масштаб сотрудничества в области памяти и контрактного производства микросхем превысит 200 миллиардов долларов. Содержание сотрудничества включает предоставление Broadcom решений по памяти, таких как HBM, для следующего поколения AI-ускорителей, а также предоставление Samsung технологий производства 2 нм и ниже для беспроводных широкополосных продуктов Broadcom с расширением до передовой упаковки 2.3D/2.5D на основе 2 нм.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics и Broadcom подписали меморандум о сотрудничестве на 200 миллиардов долларов, сосредоточенный на HBM и 2-нм техпроцессе - Aioga Новости ИИ","description":"Samsung Electronics и Broadcom подписали меморандум о взаимопонимании на AI-саммите, и ожидается, что к 2030 году масштаб сотрудничества в области памяти и контрактного производств...","url":"https://www.aioga.com/ru/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:05:04.363Z"},"ar":{"title":"وقعت شركة سامسونج للإلكترونيات مع شركة برودكوم مذكرة تعاون بقيمة 200 مليار دولار، تركز على HBM وتقنية التصنيع 2 نانومتر","summary":"وقعت شركة سامسونج للإلكترونيات وشركة برودكوم مذكرة تفاهم في قمة الذكاء الاصطناعي، ومن المتوقع أن يتجاوز حجم التعاون بين الطرفين في مجالي الذاكرة وتصنيع الرقائق بحلول عام 2030 ما قيمته 200 مليار دولار. يشمل محتوى التعاون تقديم حلول ذاكرة مثل HBM لمسرعات الذكاء الاصطناعي من الجيل القادم لشركة برودكوم، كما ستوفر سامسونج لتطبيقات برودكوم للاتصالات اللاسلكية عالية النطاق تكنولوجيا التصنيع بدقة 2 نانومتر وما دون، وتوسع التعاون ليشمل التغليف المتقدم القائم على دقة 2 نانومتر 2.3D/2.5D.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"وقعت شركة سامسونج للإلكترونيات مع شركة برودكوم مذكرة تعاون بقيمة 200 مليار دولار، تركز على HBM وتقنية التصنيع 2 نانومتر - Aioga أخبار الذكاء الاصطناعي","description":"وقعت شركة سامسونج للإلكترونيات وشركة برودكوم مذكرة تفاهم في قمة الذكاء الاصطناعي، ومن المتوقع أن يتجاوز حجم التعاون بين الطرفين في مجالي الذاكرة وتصنيع الرقائق بحلول عام 2030 ما قي...","url":"https://www.aioga.com/ar/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:05:50.210Z"},"hi":{"title":"सैमसंग इलेक्ट्रॉनिक्स और ब्रॉडकॉम ने 200 बिलियन अमेरिकी डॉलर के सहयोग समझौते पर हस्ताक्षर किए, HBM और 2nm प्रोसेस पर ध्यान केंद्रित","summary":"सैमसंग इलेक्ट्रॉनिक्स और ब्रॉडकॉम ने AI शिखर सम्मेलन में समझौता ज्ञापन पर हस्ताक्षर किए, और 2030 तक दोनों पक्षों के मेमोरी और वेफर फैब्रिकेशन क्षेत्रों में सहयोग का दायरा 200 अरब डॉलर से अधिक होने की उम्मीद है। सहयोग की सामग्री में ब्रॉडकॉम के अगले जनरेशन AI एक्सीलेरेटर के लिए HBM जैसी मेमोरी समाधान प्रदान करना शामिल है, और सैमसंग ब्रॉडकॉम के वायरलेस ब्रॉडबैंड संचार उत्पादों के लिए 2nm और उससे नीचे की प्रौद्योगिकी प्रदान करेगा, और 2nm आधारित 2.3D/2.5D उन्नत पैकेजिंग तक विस्तार करेगा।","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"सैमसंग इलेक्ट्रॉनिक्स और ब्रॉडकॉम ने 200 बिलियन अमेरिकी डॉलर के सहयोग समझौते पर हस्ताक्षर किए, HBM और 2nm प्रोसेस पर ध्यान केंद्रित - Aioga AI समाचार","description":"सैमसंग इलेक्ट्रॉनिक्स और ब्रॉडकॉम ने AI शिखर सम्मेलन में समझौता ज्ञापन पर हस्ताक्षर किए, और 2030 तक दोनों पक्षों के मेमोरी और वेफर फैब्रिकेशन क्षेत्रों में सहयोग का दायरा 200 अरब ड...","url":"https://www.aioga.com/hi/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:05:55.337Z"},"it":{"title":"Samsung Electronics e Broadcom firmano un memorandum di cooperazione da 200 miliardi di dollari, focalizzandosi su HBM e processo a 2 nm","summary":"Samsung Electronics e Broadcom hanno firmato un memorandum d'intesa al Summit sull'IA, prevedendo che entro il 2030 la scala della collaborazione tra le due parti nei settori della memoria e del foundry supererà i 200 miliardi di dollari. Il contenuto della collaborazione include la fornitura, da parte di Samsung, di soluzioni di memoria come HBM per il prossimo acceleratore AI di Broadcom, nonché la fornitura da parte di Samsung di tecnologie di processo a 2 nm e inferiori per i prodotti di comunicazione a banda larga wireless di Broadcom, estendendosi inoltre all'assemblaggio avanzato basato su 2 nm 2.3D/2.5D.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics e Broadcom firmano un memorandum di cooperazione da 200 miliardi di dollari, focalizzandosi su HBM e processo a 2 nm - Aioga Notizie IA","description":"Samsung Electronics e Broadcom hanno firmato un memorandum d'intesa al Summit sull'IA, prevedendo che entro il 2030 la scala della collaborazione tra le due parti nei settori della...","url":"https://www.aioga.com/it/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:06:35.359Z"},"nl":{"title":"Samsung Electronics en Broadcom ondertekenen memorandum van samenwerking ter waarde van 200 miljard dollar, met focus op HBM en 2nm-proces","summary":"Samsung Electronics en Broadcom hebben tijdens de AI-top een memorandum van overeenstemming ondertekend, waarbij verwacht wordt dat de samenwerking tussen de twee partijen op het gebied van geheugen en wafer foundry tegen 2030 een schaal van meer dan 200 miljard dollar zal bereiken. De samenwerking omvat het leveren van geheugenoplossingen zoals HBM voor Broadcoms volgende generatie AI-versnellers, evenals dat Samsung 2nm- en lager productieprocessen zal bieden voor Broadcoms draadloze breedbandcommunicatieproducten, en dit zal uitbreiden naar geavanceerde verpakkingen gebaseerd op 2nm zoals 2.3D/2.5D.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics en Broadcom ondertekenen memorandum van samenwerking ter waarde van 200 miljard dollar, met focus op HBM en 2nm-proces - Aioga AI-nieuws","description":"Samsung Electronics en Broadcom hebben tijdens de AI-top een memorandum van overeenstemming ondertekend, waarbij verwacht wordt dat de samenwerking tussen de twee partijen op het g...","url":"https://www.aioga.com/nl/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:06:35.441Z"},"tr":{"title":"Samsung Electronics, Broadcom ile 200 milyar dolarlık işbirliği mutabakatı imzaladı, HBM ve 2nm süreçlerine odaklanacak","summary":"Samsung Electronics ile Broadcom, AI zirvesinde bir niyet mektubu imzaladı ve 2030 yılına kadar her iki tarafın bellek ve yonga üretimi alanındaki işbirliği ölçeğinin 200 milyar doları aşması bekleniyor. İşbirliği içeriği, Broadcom'un bir sonraki nesil AI hızlandırıcıları için HBM gibi bellek çözümleri sağlamayı ve Samsung'un Broadcom'un kablosuz genişbant iletişim ürünleri için 2nm ve altı üretim teknolojisi sağlamasını ve bunu 2nm tabanlı 2.3D/2.5D ileri paketlemeye genişletmeyi kapsıyor.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics, Broadcom ile 200 milyar dolarlık işbirliği mutabakatı imzaladı, HBM ve 2nm süreçlerine odaklanacak - Aioga AI Haberleri","description":"Samsung Electronics ile Broadcom, AI zirvesinde bir niyet mektubu imzaladı ve 2030 yılına kadar her iki tarafın bellek ve yonga üretimi alanındaki işbirliği ölçeğinin 200 milyar do...","url":"https://www.aioga.com/tr/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:07:18.367Z"},"vi":{"title":"Samsung Electronics và Broadcom ký biên bản ghi nhớ hợp tác trị giá 200 tỷ USD, tập trung vào HBM và quy trình 2nm","summary":"Samsung Electronics và Broadcom đã ký biên bản ghi nhớ (MoU) tại Hội nghị thượng đỉnh AI, dự kiến đến năm 2030 quy mô hợp tác giữa hai bên trong lĩnh vực bộ nhớ và gia công wafer sẽ vượt quá 200 tỷ USD. Nội dung hợp tác bao gồm cung cấp các giải pháp bộ nhớ như HBM cho bộ tăng tốc AI thế hệ tiếp theo của Broadcom, cũng như Samsung sẽ cung cấp công nghệ chế tạo 2nm trở xuống cho các sản phẩm truyền thông băng thông rộng không dây của Broadcom, đồng thời mở rộng sang đóng gói tiên tiến 2.3D/2.5D dựa trên công nghệ 2nm.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics và Broadcom ký biên bản ghi nhớ hợp tác trị giá 200 tỷ USD, tập trung vào HBM và quy trình 2nm - Tin tức AI Aioga","description":"Samsung Electronics và Broadcom đã ký biên bản ghi nhớ (MoU) tại Hội nghị thượng đỉnh AI, dự kiến đến năm 2030 quy mô hợp tác giữa hai bên trong lĩnh vực bộ nhớ và gia công wafer s...","url":"https://www.aioga.com/vi/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:07:17.634Z"},"id":{"title":"Samsung Electronics menandatangani nota kesepahaman senilai 200 miliar dolar AS dengan Broadcom, fokus pada HBM dan proses 2nm","summary":"Samsung Electronics dan Broadcom menandatangani nota kesepahaman di KTT AI, dengan perkiraan hingga 2030 skala kerja sama kedua belah pihak di bidang memori dan foundry chip akan melebihi 200 miliar dolar AS. Isi kerja sama termasuk menyediakan solusi memori seperti HBM untuk akselerator AI generasi berikutnya dari Broadcom, serta Samsung menyediakan teknologi proses 2nm dan di bawahnya untuk produk komunikasi nirkabel lebar dari Broadcom, dan memperluas ke kemasan lanjut berbasis 2nm 2.3D/2.5D.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics menandatangani nota kesepahaman senilai 200 miliar dolar AS dengan Broadcom, fokus pada HBM dan proses 2nm - Berita AI Aioga","description":"Samsung Electronics dan Broadcom menandatangani nota kesepahaman di KTT AI, dengan perkiraan hingga 2030 skala kerja sama kedua belah pihak di bidang memori dan foundry chip akan m...","url":"https://www.aioga.com/id/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:07:54.916Z"},"th":{"title":"ซัมซุงอิเล็กทรอนิกส์และบโรดคอมลงนามบันทึกความเข้าใจมูลค่า 200 พันล้านดอลลาร์ มุ่งเน้น HBM และกระบวนการผลิตขนาด 2 นาโนเมตร","summary":"ซัมซุงอิเล็กทรอนิกส์และบรูดคอมได้ลงนามบันทึกความเข้าใจที่งาน AI Summit คาดว่าจนถึงปี 2030 ขนาดความร่วมมือระหว่างทั้งสองฝ่ายในด้านหน่วยความจำและการผลิตชิปจะเกิน 200 พันล้านดอลลาร์ สหรัฐ เนื้อหาความร่วมมือรวมถึงการให้โซลูชันหน่วยความจำ เช่น HBM แก่ตัวเร่ง AI รุ่นต่อไปของบรูดคอม และซัมซุงจะให้เทคโนโลยีการผลิตที่ 2 นาโนเมตรและต่ำกว่าสำหรับผลิตภัณฑ์สื่อสารไร้สายความกว้างแบนด์ของบรูดคอม และขยายสู่การแพ็กเกจขั้นสูง 2.3D/2.5D บนพื้นฐานของ 2 นาโนเมตร","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"ซัมซุงอิเล็กทรอนิกส์และบโรดคอมลงนามบันทึกความเข้าใจมูลค่า 200 พันล้านดอลลาร์ มุ่งเน้น HBM และกระบวนการผลิตขนาด 2 นาโนเมตร - ข่าว AI Aioga","description":"ซัมซุงอิเล็กทรอนิกส์และบรูดคอมได้ลงนามบันทึกความเข้าใจที่งาน AI Summit คาดว่าจนถึงปี 2030 ขนาดความร่วมมือระหว่างทั้งสองฝ่ายในด้านหน่วยความจำและการผลิตชิปจะเกิน 200 พันล้านดอลลาร์ ส...","url":"https://www.aioga.com/th/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:08:11.905Z"},"pl":{"title":"Samsung Electronics i Broadcom podpisały memorandum o współpracy warte 200 miliardów dolarów, koncentrując się na HBM i procesie 2 nm","summary":"Samsung Electronics i Broadcom podpisały memorandum o porozumieniu na szczycie AI, przewidując, że do 2030 roku skala współpracy obu stron w dziedzinie pamięci i usług produkcji wafli przekroczy 200 miliardów dolarów. Zakres współpracy obejmuje dostarczanie przez Samsung rozwiązań pamięciowych, takich jak HBM, dla następnej generacji akceleratorów AI firmy Broadcom, a także udostępnienie przez Samsung technologii procesowej 2 nm i niższej dla produktów Broadcom w zakresie bezprzewodowej komunikacji szerokopasmowej oraz rozszerzenie współpracy na zaawansowane pakowanie oparte na technologii 2 nm w wersjach 2.3D/2.5D.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Samsung Electronics i Broadcom podpisały memorandum o współpracy warte 200 miliardów dolarów, koncentrując się na HBM i procesie 2 nm - Aioga Wiadomości AI","description":"Samsung Electronics i Broadcom podpisały memorandum o porozumieniu na szczycie AI, przewidując, że do 2030 roku skala współpracy obu stron w dziedzinie pamięci i usług produkcji wa...","url":"https://www.aioga.com/pl/news/cms2mqllz02eyro3fcakd7y9k/","contentTranslated":true,"sourceHash":"979d10e79de5c49f","translatedAt":"2026-07-27T03:08:56.980Z"}}}}