{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-08-11T09:21:12.743Z","headline":"台积电扩大 CoW 封装外包规模，以缓解英伟达等公司 AI 芯片需求压力","description":"台积电计划扩大 CoWoS 封装工艺中 CoW 环节的外包规模，委托日月光等 OSAT 厂商完成相关工序，以缓解 AI 芯片制造瓶颈。台积电估计占据全球 AI 芯片制造市场约 90% 份额，此举旨在应对英伟达、AMD 和博通等公司飙升的 AI 加速器需求。同时，台积电 2nm 制程目标在 2026 年底达到月产 100，000 片晶圆，当前月产能为 20，000 片。","url":"https://www.aioga.com/news/cmsfe0m8t1ozpro2etwlpt9wc/","mainEntityOfPage":"https://www.aioga.com/news/cmsfe0m8t1ozpro2etwlpt9wc/","datePublished":"2026-08-05T01:02:12.000Z","dateModified":"2026-08-05T01:02:12.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/985/780.htm","https://aihot.virxact.com/items/cmsfe0m8t1ozpro2etwlpt9wc"],"canonicalUrl":"https://www.aioga.com/news/cmsfe0m8t1ozpro2etwlpt9wc/","directAnswer":{"@type":"Answer","text":"材料称，台积电计划扩大CoWoS封装中CoW环节的外包规模，由日月光等OSAT厂商承接部分工序，以缓解英伟达、AMD和博通等客户的AI加速器需求压力。","url":"https://www.aioga.com/news/cmsfe0m8t1ozpro2etwlpt9wc/","dateCreated":"2026-08-05T01:02:12.000Z","author":{"@type":"Organization","@id":"https://www.aioga.com/authors/aioga-editorial/#editorial-team","name":"Aioga Editorial Team","url":"https://www.aioga.com/authors/aioga-editorial/"}},"evidence":[{"@type":"CreativeWork","name":"IT之家 source 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制程目标在 2026 年底达到月产 100，000 片晶圆，当前月产能为 20，000 片。","source":"IT之家（RSS）","sourceUrl":"https://www.ithome.com/0/985/780.htm","aiHotUrl":"https://aihot.virxact.com/items/cmsfe0m8t1ozpro2etwlpt9wc","publishedAt":"2026-08-05T01:02:12.000Z","category":"行业动态","score":53,"selected":false,"articleBody":["IT之家：https://www.ithome.com/ 8 月 5 日消息，科技媒体 biggo 昨日（8 月 4 日）发布博文，报道称台积电为了缓解 CoWoS 封装产能压力，计划把部分封装步骤外包给日月光等供应商，从而提高 AI 芯片产能。","IT之家注：CoWoS 全称为 Chip-on-Wafer-on-Substrate，是台积电的一种先进封装技术，将处理器与高带宽内存整合在同一个中间层上，再连接到基板。该技术能有效提升 AI 芯片的数据传输带宽与运算效率，是当前制造高性能 AI 加速器的关键环节。","消息称台积电为了缓解 AI 芯片制造瓶颈， 计划扩大 CoWoS 封装工艺中的 CoW（Chip-on-Wafer，芯片封装）外包规模，委托日月光等半导体封装测试（OSAT）完成相关工序。","报道指出台积电估计占据全球 AI 芯片制造市场约 90% 的份额，仅靠内部产能已无法满足激增的市场需求，因此为了应对英伟达、AMD 和博通等公司持续飙升的 AI 加速器需求，台积电正在积极扩展外包规模。","为承接新增订单，各大 OSAT 公司正订购设备建设新产线，并据称与韩国材料、零部件和设备供应商洽谈采购事宜。","在扩大封装外包的同时，台积电正加速提升先进制程产能。据《经济日报》报道，受客户需求驱动，台积电 2nm 制程目标在 2026 年底达到月产 100,000 片晶圆，当前月产能为 20,000 片。","3nm 制程预计提前至 2026 年第四季度前达到月产 180,000 片晶圆。2nm 工艺已贡献台积电 2026 年第三季度营收的 3%，且流片数量达到同阶段 3nm 工艺的 4 倍。"],"articleImages":[{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/8/146b7780-c7a6-47d6-9c8b-18f96a5cec00.png?x-bce-process=image/format,f_auto","alt":"","afterParagraph":1,"url":"/media/articles/cmsfe0m8t1ozpro2etwlpt9wc/c7bf9a82e9defbf2.webp"},{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/8/89711d04-b2f7-4f8f-ae74-56a8b7e9b4a8.png?x-bce-process=image/format,f_auto","alt":"","afterParagraph":2,"url":"/media/articles/cmsfe0m8t1ozpro2etwlpt9wc/2c85c51d7ef2fd4a.webp"}],"mediaStatus":"ok","articleBodyZh":["台积电扩大 CoW 封装外包规模，以缓解英伟达等公司 AI 芯片需求压力 这条更新来自 ithome.com，发布时间为 2026-08-05，Aioga 保留原文入口以便核验。","摘要：台积电计划扩大 CoWoS 封装工艺中 CoW 环节的外包规模，委托日月光等 OSAT 厂商完成相关工序，以缓解 AI 芯片制造瓶颈。台积电估计占据全球 AI 芯片制造市场约 90% 份额，此举旨在应对英伟达、AMD 和博通等公司飙升的 AI 加速器需求。同时，台积电 2nm 制程目标在 2026 年底达到月产 100，000 片晶圆，当前月产能为 20，000 片。","背景：CoWoS通过中间层整合处理器与高带宽内存，再连接至基板，是高性能AI加速器的重要封装环节。材料称，台积电估计其占全球AI芯片制造市场约90%，内部产能面临需求压力。","Aioga 观察：Aioga判断，此次调整反映先进封装已成为AI芯片供给的重要约束，扩大CoW外包可能提升产能调度弹性，但材料尚未披露具体外包数量、合作期限及实际增产幅度。","影响与后续：若外包计划推进，日月光等OSAT厂商及相关设备、材料和零部件供应商可能获得新增订单机会。值得关注的是，外包能否有效缓解瓶颈，仍取决于新产线建设与工序衔接情况。 后续应关注台积电是否公布CoW外包规模、供应商分工和产能进展，并核对材料所述2nm在2026年底达到月产10万片、3nm达到月产18万片等目标是否按计划落实。"],"translationStatus":"","bodyOrigin":"source-page","editorial":{"summary":"材料称，台积电计划扩大CoWoS封装中CoW环节的外包规模，由日月光等OSAT厂商承接部分工序，以缓解英伟达、AMD和博通等客户的AI加速器需求压力。","background":"CoWoS通过中间层整合处理器与高带宽内存，再连接至基板，是高性能AI加速器的重要封装环节。材料称，台积电估计其占全球AI芯片制造市场约90%，内部产能面临需求压力。","viewpoint":"Aioga判断，此次调整反映先进封装已成为AI芯片供给的重要约束，扩大CoW外包可能提升产能调度弹性，但材料尚未披露具体外包数量、合作期限及实际增产幅度。","implications":"若外包计划推进，日月光等OSAT厂商及相关设备、材料和零部件供应商可能获得新增订单机会。值得关注的是，外包能否有效缓解瓶颈，仍取决于新产线建设与工序衔接情况。","nextStep":"后续应关注台积电是否公布CoW外包规模、供应商分工和产能进展，并核对材料所述2nm在2026年底达到月产10万片、3nm达到月产18万片等目标是否按计划落实。","evidenceRefs":["title","summary","articleBody","source"],"status":"published","aiGenerated":true,"autoApproved":true,"generatedBy":"aioga-editorial:gpt-5.6-sol","reviewedBy":"aioga-editorial-review:gpt-5.6-sol","generatedAt":"2026-08-05T01:25:00.079Z","sourceHash":"4ef9505998e3e713","review":{"approved":true,"groundedness":94,"clarity":95,"duplicationRisk":18,"blockingIssues":[],"notes":["“先进封装已成为AI芯片供给的重要约束”及“扩大CoW外包可能提升产能调度弹性”属于基于材料的分析判断，已明确归入 viewpoint，未冒充来源事实。","“日月光等OSAT厂商及相关设备、材料和零部件供应商可能获得新增订单机会”是基于材料所述扩产、采购和建设新产线的合理推断，使用“可能”限定，风险较低。","文中2nm月产10万片、3nm月产18万片等目标均可在来源摘要或正文中找到依据。"]},"validation":{"passed":true,"mode":"ai-auto","revisions":0,"checks":["schema","length","source-attribution","low-source-overlap","no-html","independent-ai-review"]}},"tags":["行业动态","IT之家（RSS）"],"translations":{"zh-CN":{"title":"台积电扩大 CoW 封装外包规模，以缓解英伟达等公司 AI 芯片需求压力","summary":"台积电计划扩大 CoWoS 封装工艺中 CoW 环节的外包规模，委托日月光等 OSAT 厂商完成相关工序，以缓解 AI 芯片制造瓶颈。台积电估计占据全球 AI 芯片制造市场约 90% 份额，此举旨在应对英伟达、AMD 和博通等公司飙升的 AI 加速器需求。同时，台积电 2nm 制程目标在 2026 年底达到月产 100，000 片晶圆，当前月产能为 20，000 片。","category":"行业动态","source":"IT之家","aggregationSource":"IT之家（RSS）","pageTitle":"台积电扩大 CoW 封装外包规模，以缓解英伟达等公司 AI 芯片需求压力 - Aioga AI资讯","description":"台积电计划扩大 CoWoS 封装工艺中 CoW 环节的外包规模，委托日月光等 OSAT 厂商完成相关工序，以缓解 AI 芯片制造瓶颈。台积电估计占据全球 AI 芯片制造市场约 90% 份额，此举旨在应对英伟达、AMD 和博通等公司飙升的 AI 加速器需求。同时，台积电 2nm 制程目标在 2026 年底达到月产 100，000 片晶圆，当前月产能为 20，0...","url":"https://www.aioga.com/news/cmsfe0m8t1ozpro2etwlpt9wc/","articleBody":["台积电扩大 CoW 封装外包规模，以缓解英伟达等公司 AI 芯片需求压力 这条更新来自 ithome.com，发布时间为 2026-08-05，Aioga 保留原文入口以便核验。","摘要：台积电计划扩大 CoWoS 封装工艺中 CoW 环节的外包规模，委托日月光等 OSAT 厂商完成相关工序，以缓解 AI 芯片制造瓶颈。台积电估计占据全球 AI 芯片制造市场约 90% 份额，此举旨在应对英伟达、AMD 和博通等公司飙升的 AI 加速器需求。同时，台积电 2nm 制程目标在 2026 年底达到月产 100，000 片晶圆，当前月产能为 20，000 片。","背景：CoWoS通过中间层整合处理器与高带宽内存，再连接至基板，是高性能AI加速器的重要封装环节。材料称，台积电估计其占全球AI芯片制造市场约90%，内部产能面临需求压力。","Aioga 观察：Aioga判断，此次调整反映先进封装已成为AI芯片供给的重要约束，扩大CoW外包可能提升产能调度弹性，但材料尚未披露具体外包数量、合作期限及实际增产幅度。","影响与后续：若外包计划推进，日月光等OSAT厂商及相关设备、材料和零部件供应商可能获得新增订单机会。值得关注的是，外包能否有效缓解瓶颈，仍取决于新产线建设与工序衔接情况。 后续应关注台积电是否公布CoW外包规模、供应商分工和产能进展，并核对材料所述2nm在2026年底达到月产10万片、3nm达到月产18万片等目标是否按计划落实。"]},"en":{"title":"TSMC is expanding CoW packaging outsourcing to ease the pressure on AI chip demand from companies like Nvidia","summary":"TSMC plans to expand the outsourcing scale of the CoW segment in CoWoS packaging processes, commissioning OSAT manufacturers such as ASE to complete related steps to alleviate bottlenecks in AI chip manufacturing. TSMC is estimated to hold about 90% of the global AI chip manufacturing market, a move aimed at responding to the surging demand for AI accelerators from companies like Nvidia, AMD, and Broadcom. Meanwhile, TSMC's 2nm process aims to reach a monthly output of 100,000 wafers by the end of 2026, with current monthly capacity at 20,000 wafers.","category":"Industry","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC is expanding CoW packaging outsourcing to ease the pressure on AI chip demand from companies like Nvidia - Aioga AI News","description":"TSMC plans to expand the outsourcing scale of the CoW segment in CoWoS packaging processes, commissioning OSAT manufacturers such as ASE to complete related steps to alleviate bott...","url":"https://www.aioga.com/en/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:22:34.836Z"},"ja":{"title":"TSMCは、Nvidiaのような企業からのAIチップ需要への圧力を緩和するため、CoWパッケージングアウトソーシングを拡大しています","summary":"TSMCはCoWoSパッケージングプロセスにおけるCoWセグメントのアウトソーシング規模を拡大し、ASEなどのOSATメーカーにAIチップ製造のボトルネック緩和のための関連ステップを委託する計画です。 TSMCは世界のAI半導体製造市場の約90%を保持すると推定されており、これはNvidia、AMD、Broadcomなどの企業によるAI加速器の急増に応えるための動きです。 一方、TSMCの2nmプロセスは2026年末までに月間10万本のウェハー生産を目指しており、現在の月間生産能力は2万本です。","category":"業界動向","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMCは、Nvidiaのような企業からのAIチップ需要への圧力を緩和するため、CoWパッケージングアウトソーシングを拡大しています - Aioga AIニュース","description":"TSMCはCoWoSパッケージングプロセスにおけるCoWセグメントのアウトソーシング規模を拡大し、ASEなどのOSATメーカーにAIチップ製造のボトルネック緩和のための関連ステップを委託する計画です。 TSMCは世界のAI半導体製造市場の約90%を保持すると推定されており、これはNvidia、AMD、Broadcomなどの企業によるAI加速器の急増に応えるた...","url":"https://www.aioga.com/ja/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:22:36.312Z"},"ko":{"title":"TSMC는 엔비디아와 같은 기업들의 AI 반도 수요 압박을 완화하기 위해 CoW 포장 아웃소싱을 확대하고 있습니다","summary":"TSMC는 CoWoS 패키징 공정에서 CoW 부문의 아웃소싱 규모를 확대할 계획이며, ASE와 같은 OSAT 제조업체에 AI 칩 제조 병목 현상 완화를 위한 관련 단계를 완료하도록 위탁할 예정입니다. TSMC는 엔비디아, AMD, 브로드컴 등 기업들의 AI 가속기 수요 급증에 대응하기 위해 글로벌 AI 반도체 제조 시장의 약 90%를 보유할 것으로 추정됩니다. 한편, TSMC의 2nm 공정은 2026년 말까지 월간 100,000 웨이퍼 생산량을 목표로 하며, 현재 월 생산 능력은 20,000 웨이퍼입니다.","category":"업계 동향","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC는 엔비디아와 같은 기업들의 AI 반도 수요 압박을 완화하기 위해 CoW 포장 아웃소싱을 확대하고 있습니다 - Aioga AI 뉴스","description":"TSMC는 CoWoS 패키징 공정에서 CoW 부문의 아웃소싱 규모를 확대할 계획이며, ASE와 같은 OSAT 제조업체에 AI 칩 제조 병목 현상 완화를 위한 관련 단계를 완료하도록 위탁할 예정입니다. TSMC는 엔비디아, AMD, 브로드컴 등 기업들의 AI 가속기 수요 급증에 대응하기 위해 글로벌 AI 반도체 제조 시장의...","url":"https://www.aioga.com/ko/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:22:44.968Z"},"es":{"title":"TSMC está ampliando la externalización del empaquetado de CoW para aliviar la presión sobre la demanda de chips de IA por parte de empresas como Nvidia","summary":"TSMC planea ampliar la escala de externalización del segmento CoW en los procesos de envasado de CoWoS, encargando a fabricantes de OSAT como ASE que realicen pasos relacionados para aliviar los cuellos de botella en la fabricación de chips de IA. Se estima que TSMC posee alrededor del 90% del mercado global de fabricación de chips de IA, una medida destinada a responder a la creciente demanda de aceleradores de IA por parte de empresas como Nvidia, AMD y Broadcom. Mientras tanto, el proceso de 2 nm de TSMC aspira a alcanzar una producción mensual de 100.000 obleas para finales de 2026, con una capacidad mensual actual de 20.000 obleas.","category":"Industria","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC está ampliando la externalización del empaquetado de CoW para aliviar la presión sobre la demanda de chips de IA por parte de empresas como Nvidia - Aioga Noticias de IA","description":"TSMC planea ampliar la escala de externalización del segmento CoW en los procesos de envasado de CoWoS, encargando a fabricantes de OSAT como ASE que realicen pasos relacionados pa...","url":"https://www.aioga.com/es/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:22:45.082Z"},"fr":{"title":"TSMC étend l’externalisation de l’emballage CoW afin d’alléger la pression sur la demande de puces IA de la part d’entreprises comme Nvidia","summary":"TSMC prévoit d’élargir l’échelle d’externalisation du segment CoW dans les processus d’emballage CoWoS, en chargeant des fabricants d’OSAT tels qu’ASE d’effectuer des étapes connexes pour atténuer les goulets d’étranglement dans la fabrication de puces IA. On estime que TSMC détient environ 90 % du marché mondial de la fabrication de puces IA, une initiative visant à répondre à la demande croissante d’accélérateurs d’IA de la part d’entreprises telles que Nvidia, AMD et Broadcom. Par le temps, le procédé 2 nm de TSMC vise à atteindre une production mensuelle de 100 000 plaquettes d’ici la fin 2026, avec une capacité mensuelle actuelle de 20 000 plaquettes.","category":"Industrie","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC étend l’externalisation de l’emballage CoW afin d’alléger la pression sur la demande de puces IA de la part d’entreprises comme Nvidia - Aioga Actualités IA","description":"TSMC prévoit d’élargir l’échelle d’externalisation du segment CoW dans les processus d’emballage CoWoS, en chargeant des fabricants d’OSAT tels qu’ASE d’effectuer des étapes connex...","url":"https://www.aioga.com/fr/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:22:53.729Z"},"de":{"title":"TSMC erweitert das Outsourcing von CoW-Verpackungen, um den Druck auf die Nachfrage nach KI-Chips durch Unternehmen wie Nvidia zu verringern","summary":"TSMC plant, den Outsourcing-Umfang des CoW-Segments in CoWoS-Verpackungsprozessen auszuweiten und OSAT-Hersteller wie ASE damit zu beauftragt, entsprechende Schritte zur Beseitigung von Engpässen in der KI-Chipfertigung durchzuführen. TSMC wird geschätzt, etwa 90 % des globalen Marktes für die Herstellung von KI-Chips zu halten, ein Schritt, der darauf abzielt, auf die stark steigende Nachfrage nach KI-Beschleunigern von Unternehmen wie Nvidia, AMD und Broadcom zu reagieren. Unterdessen zielt der 2nm-Prozess von TSMC darauf ab, bis Ende 2026 eine monatliche Produktion von 100.000 Wafern zu erreichen, mit einer aktuellen monatlichen Kapazität von 20.000 Wafern.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC erweitert das Outsourcing von CoW-Verpackungen, um den Druck auf die Nachfrage nach KI-Chips durch Unternehmen wie Nvidia zu verringern - Aioga KI-News","description":"TSMC plant, den Outsourcing-Umfang des CoW-Segments in CoWoS-Verpackungsprozessen auszuweiten und OSAT-Hersteller wie ASE damit zu beauftragt, entsprechende Schritte zur Beseitigun...","url":"https://www.aioga.com/de/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:22:53.041Z"},"pt-BR":{"title":"A TSMC está expandindo a terceirização de empacotamento do CoW para aliviar a pressão sobre a demanda por chips de IA por empresas como a Nvidia","summary":"A TSMC planeja expandir a escala de terceirização do segmento CoW nos processos de embalagem do CoWoS, contratando fabricantes de OSAT, como a ASE, para completar etapas relacionadas para aliviar gargalos na fabricação de chips de IA. Estima-se que a TSMC detenha cerca de 90% do mercado global de fabricação de chips de IA, uma medida voltada para responder à crescente demanda por aceleradores de IA de empresas como Nvidia, AMD e Broadcom. Enquanto isso, o processo de 2nm da TSMC visa atingir uma produção mensal de 100.000 pastilhas até o final de 2026, com capacidade mensal atual de 20.000 pastilhas.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"A TSMC está expandindo a terceirização de empacotamento do CoW para aliviar a pressão sobre a demanda por chips de IA por empresas como a Nvidia - Aioga Notícias de IA","description":"A TSMC planeja expandir a escala de terceirização do segmento CoW nos processos de embalagem do CoWoS, contratando fabricantes de OSAT, como a ASE, para completar etapas relacionad...","url":"https://www.aioga.com/pt-BR/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:02.537Z"},"ru":{"title":"TSMC расширяет аутсорсинг упаковки CoW, чтобы снизить давление на спрос на чипы ИИ со стороны таких компаний, как Nvidia","summary":"TSMC планирует расширить масштаб аутсорсинга сегмента CoW в процессах упаковки CoWoS, поручая производителям OSAT, таким как ASE, выполнить соответствующие шаги по устранению узких мест в производстве чипов на базе ИИ. По оценкам, TSMC занимает около 90% мирового рынка производства чипов на базе ИИ, что направлено на ответ на растущий спрос на ускорители искусственного интеллекта со стороны таких компаний, как Nvidia, AMD и Broadcom. Тем временем 2нм процесс TSMC нацелен на ежемесячное производство 100 000 пластин к концу 2026 года, при текущей ежемесячной мощности 20 000 пластин.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC расширяет аутсорсинг упаковки CoW, чтобы снизить давление на спрос на чипы ИИ со стороны таких компаний, как Nvidia - Aioga Новости ИИ","description":"TSMC планирует расширить масштаб аутсорсинга сегмента CoW в процессах упаковки CoWoS, поручая производителям OSAT, таким как ASE, выполнить соответствующие шаги по устранению узких...","url":"https://www.aioga.com/ru/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:01.510Z"},"ar":{"title":"تقوم TSMC بتوسيع الاستعانة بمصادر خارجية لتغليف CoW لتخفيف الضغط على الطلب على رقائق الذكاء الاصطناعي من شركات مثل Nvidia","summary":"تخطط TSMC لتوسيع نطاق الاستعانة بمصادر خارجية لقطاع CoW في عمليات تغليف CoWoS، مع تكليف مصنعي OSAT مثل ASE بإكمال الخطوات ذات الصلة لتخفيف عنق الاختناقات في تصنيع رقائق الذكاء الاصطناعي. يقدر أن TSMC تمتلك حوالي 90٪ من سوق تصنيع رقائق الذكاء الاصطناعي العالمي، وهو خطوة تهدف إلى الاستجابة للطلب المتزايد على مسرعات الذكاء الاصطناعي من شركات مثل Nvidia وAMD وBroadcom. وفي الوقت نفسه، تهدف عملية 2 نانومتر التابعة ل TSMC إلى إنتاج شهري يبلغ 100,000 ويفر بحلول نهاية عام 2026، مع السعة الشهرية الحالية التي تبلغ 20,000 ويفر.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"تقوم TSMC بتوسيع الاستعانة بمصادر خارجية لتغليف CoW لتخفيف الضغط على الطلب على رقائق الذكاء الاصطناعي من شركات مثل Nvidia - Aioga أخبار الذكاء الاصطناعي","description":"تخطط TSMC لتوسيع نطاق الاستعانة بمصادر خارجية لقطاع CoW في عمليات تغليف CoWoS، مع تكليف مصنعي OSAT مثل ASE بإكمال الخطوات ذات الصلة لتخفيف عنق الاختناقات في تصنيع رقائق الذكاء الاص...","url":"https://www.aioga.com/ar/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:11.268Z"},"hi":{"title":"TSMC Nvidia जैसी कंपनियों से AI चिप की मांग पर दबाव को कम करने के लिए CoW पैकेजिंग आउटसोर्सिंग का विस्तार कर रहा है","summary":"TSMC ने CoWoS पैकेजिंग प्रक्रियाओं में CoW सेगमेंट के आउटसोर्सिंग पैमाने का विस्तार करने की योजना बनाई है, AI चिप निर्माण में बाधाओं को कम करने के लिए संबंधित चरणों को पूरा करने के लिए ASE जैसे OSAT निर्माताओं को कमीशन किया है। TSMC के पास वैश्विक AI चिप निर्माण बाजार का लगभग 90% हिस्सा होने का अनुमान है, जिसका उद्देश्य Nvidia, AMD और Broadcom जैसी कंपनियों से AI एक्सेलेरेटर की बढ़ती मांग का जवाब देना है। इस बीच, TSMC की 2nm प्रक्रिया का लक्ष्य 2026 के अंत तक 100,000 वेफर्स के मासिक उत्पादन तक पहुंचना है, जिसकी वर्तमान मासिक क्षमता 20,000 वेफर्स है।","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC Nvidia जैसी कंपनियों से AI चिप की मांग पर दबाव को कम करने के लिए CoW पैकेजिंग आउटसोर्सिंग का विस्तार कर रहा है - Aioga AI समाचार","description":"TSMC ने CoWoS पैकेजिंग प्रक्रियाओं में CoW सेगमेंट के आउटसोर्सिंग पैमाने का विस्तार करने की योजना बनाई है, AI चिप निर्माण में बाधाओं को कम करने के लिए संबंधित चरणों को पूरा करने के...","url":"https://www.aioga.com/hi/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:11.377Z"},"it":{"title":"TSMC sta espandendo l'outsourcing del packaging CoW per alleviare la pressione sulla domanda di chip AI da parte di aziende come Nvidia","summary":"TSMC prevede di espandere la scala di outsourcing del segmento CoW nei processi di confezionamento CoWoS, incaricando produttori OSAT come ASE di completare passaggi correlati per alleviare i colli di bottiglia nella produzione di chip AI. Si stima che TSMC detenga circa il 90% del mercato globale della produzione di chip per l'IA, una mossa volta a rispondere alla crescente domanda di acceleratori AI da parte di aziende come Nvidia, AMD e Broadcom. Nel frattempo, il processo a 2nm di TSMC mira a raggiungere una produzione mensile di 100.000 wafer entro la fine del 2026, con una capacità mensile attuale di 20.000 wafer.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC sta espandendo l'outsourcing del packaging CoW per alleviare la pressione sulla domanda di chip AI da parte di aziende come Nvidia - Aioga Notizie IA","description":"TSMC prevede di espandere la scala di outsourcing del segmento CoW nei processi di confezionamento CoWoS, incaricando produttori OSAT come ASE di completare passaggi correlati per...","url":"https://www.aioga.com/it/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:20.054Z"},"nl":{"title":"TSMC breidt de uitbesteding van CoW-verpakkingen uit om de druk op de vraag naar AI-chips van bedrijven als Nvidia te verlichten","summary":"TSMC is van plan de uitbesteding van het CoW-segment in CoWoS-verpakkingsprocessen uit te breiden en OSAT-fabrikanten zoals ASE in opdracht te brengen om gerelateerde stappen te ondernemen om knelpunten in de productie van AI-chips te verminderen. TSMC wordt geschat ongeveer 90% van de wereldwijde markt voor AI-chipproductie te bezitten, een stap die gericht is op de sterk stijgende vraag naar AI-accelerators van bedrijven als Nvidia, AMD en Broadcom. Ondertussen streeft het 2nm-proces van TSMC ernaar om tegen het einde van 2026 een maandelijkse productie van 100.000 wafers te bereiken, met een huidige maandelijkse capaciteit van 20.000 wafers.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC breidt de uitbesteding van CoW-verpakkingen uit om de druk op de vraag naar AI-chips van bedrijven als Nvidia te verlichten - Aioga AI-nieuws","description":"TSMC is van plan de uitbesteding van het CoW-segment in CoWoS-verpakkingsprocessen uit te breiden en OSAT-fabrikanten zoals ASE in opdracht te brengen om gerelateerde stappen te on...","url":"https://www.aioga.com/nl/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:19.882Z"},"tr":{"title":"TSMC, Nvidia gibi şirketlerin yapay zeka çip talebindeki baskıyı hafifletmek için CoW ambalaj dış kaynak kullanımını genişletiyor","summary":"TSMC, CoWoS ambalaj süreçlerinde CoW segmentinin dış kaynak ölçeğini genişletmeyi planlıyor ve ASE gibi OSAT üreticilerini, yapay zeka çip üretimindeki darboğazları hafifletmek için ilgili adımları tamamlamaları için görevlendiriyor. TSMC'nin küresel yapay zeka çip üretim pazarının yaklaşık %90'ına sahip olduğu tahmin ediliyor; bu, Nvidia, AMD ve Broadcom gibi şirketlerden gelen yapay zeka hızlandırıcılarına olan artan talebe yanıt vermek amacıyla yapılıyor. Bu arada, TSMC'nin 2nm süreci, 2026 sonuna kadar aylık 100.000 wafer üretimine ulaşmayı hedefliyor ve mevcut aylık kapasite 20.000 waferdir.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC, Nvidia gibi şirketlerin yapay zeka çip talebindeki baskıyı hafifletmek için CoW ambalaj dış kaynak kullanımını genişletiyor - Aioga AI Haberleri","description":"TSMC, CoWoS ambalaj süreçlerinde CoW segmentinin dış kaynak ölçeğini genişletmeyi planlıyor ve ASE gibi OSAT üreticilerini, yapay zeka çip üretimindeki darboğazları hafifletmek içi...","url":"https://www.aioga.com/tr/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:29.607Z"},"vi":{"title":"TSMC đang mở rộng dịch vụ thuê ngoài bao bì CoW để giảm áp lực lên nhu cầu chip AI từ các công ty như Nvidia","summary":"TSMC dự định mở rộng quy mô thuê ngoài của phân khúc CoW trong quy trình đóng gói CoWoS, giao cho các nhà sản xuất OSAT như ASE thực hiện các bước liên quan nhằm khắc phục nút thắt cổ chai trong sản xuất chip AI. TSMC được ước tính chiếm khoảng 90% thị phần sản xuất chip AI toàn cầu, một bước đi nhằm đáp ứng nhu cầu tăng mạnh về các bộ tăng tốc AI từ các công ty như Nvidia, AMD và Broadcom. Trong khi đó, quy trình 2nm của TSMC đặt mục tiêu đạt sản lượng hàng tháng là 100.000 tấm wafer vào cuối năm 2026, với công suất hàng tháng hiện tại là 20.000 tấm wafer.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC đang mở rộng dịch vụ thuê ngoài bao bì CoW để giảm áp lực lên nhu cầu chip AI từ các công ty như Nvidia - Tin tức AI Aioga","description":"TSMC dự định mở rộng quy mô thuê ngoài của phân khúc CoW trong quy trình đóng gói CoWoS, giao cho các nhà sản xuất OSAT như ASE thực hiện các bước liên quan nhằm khắc phục nút thắt...","url":"https://www.aioga.com/vi/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:28.761Z"},"id":{"title":"TSMC memperluas outsourcing kemasan CoW untuk mengurangi tekanan permintaan chip AI dari perusahaan seperti Nvidia","summary":"TSMC berencana memperluas skala outsourcing segmen CoW dalam proses kemasan CoWoS, menugaskan produsen OSAT seperti ASE untuk menyelesaikan langkah-langkah terkait guna mengurangi hambatan dalam manufaktur chip AI. TSMC diperkirakan menguasai sekitar 90% pasar manufaktur chip AI global, sebuah langkah yang bertujuan merespons permintaan akselerator AI yang meningkat dari perusahaan seperti Nvidia, AMD, dan Broadcom. Sementara itu, proses 2nm TSMC bertujuan mencapai produksi bulanan sebesar 100.000 wafer pada akhir 2026, dengan kapasitas bulanan saat ini sebesar 20.000 wafer.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC memperluas outsourcing kemasan CoW untuk mengurangi tekanan permintaan chip AI dari perusahaan seperti Nvidia - Berita AI Aioga","description":"TSMC berencana memperluas skala outsourcing segmen CoW dalam proses kemasan CoWoS, menugaskan produsen OSAT seperti ASE untuk menyelesaikan langkah-langkah terkait guna mengurangi...","url":"https://www.aioga.com/id/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:37.444Z"},"th":{"title":"TSMC กําลังขยายการจ้างงานภายนอกบรรจุภัณฑ์ของ CoW เพื่อบรรเทาแรงกดดันต่อความต้องการชิป AI จากบริษัทอย่าง Nvidia","summary":"TSMC มีแผนขยายขนาดการเอาท์ซอร์สของกลุ่ม CoW ในกระบวนการบรรจุภัณฑ์ CoWoS โดยมอบหมายให้ผู้ผลิต OSAT เช่น ASE ดําเนินการขั้นตอนที่เกี่ยวข้องเพื่อบรรเทาคอขวดในการผลิตชิป AI TSMC คาดว่าจะครองตลาดการผลิตชิป AI ทั่วโลกประมาณ 90% ซึ่งเป็นการเคลื่อนไหวเพื่อตอบสนองความต้องการที่เพิ่มขึ้นอย่างรวดเร็วสําหรับเครื่องเร่ง AI จากบริษัทอย่าง Nvidia, AMD และ Broadcom ขณะเดียวกัน กระบวนการผลิต 2nm ของ TSMC ตั้งเป้าที่จะผลิตแผ่นเวเฟอร์ได้ถึง 100,000 แผ่นต่อเดือนภายในสิ้นปี 2026 โดยมีกําลังการผลิตปัจจุบันต่อเดือนที่ 20,000 แผ่น","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC กําลังขยายการจ้างงานภายนอกบรรจุภัณฑ์ของ CoW เพื่อบรรเทาแรงกดดันต่อความต้องการชิป AI จากบริษัทอย่าง Nvidia - ข่าว AI Aioga","description":"TSMC มีแผนขยายขนาดการเอาท์ซอร์สของกลุ่ม CoW ในกระบวนการบรรจุภัณฑ์ CoWoS โดยมอบหมายให้ผู้ผลิต OSAT เช่น ASE ดําเนินการขั้นตอนที่เกี่ยวข้องเพื่อบรรเทาคอขวดในการผลิตชิป AI TSMC คาดว่า...","url":"https://www.aioga.com/th/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:38.413Z"},"pl":{"title":"TSMC rozszerza outsourcing opakowań CoW, aby zmniejszyć presję na popyt na układy AI ze strony firm takich jak Nvidia","summary":"TSMC planuje rozszerzyć skalę outsourcingu segmentu CoW w procesach pakowania CoWoS, zlecając producentom OSAT, takim jak ASE, wykonanie powiązanych kroków mających na celu zmniejszenie wąskich gardeł w produkcji układów AI. Szacuje się, że TSMC posiada około 90% globalnego rynku produkcji układów AI, co ma na celu odpowiedź na rosnący popyt na akceleratory AI ze strony firm takich jak Nvidia, AMD i Broadcom. Tymczasem proces 2nm TSMC ma na celu osiągnięcie miesięcznej produkcji 100 000 wafli do końca 2026 roku, z obecną miesięczną mocą 20 000 wafli.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"TSMC rozszerza outsourcing opakowań CoW, aby zmniejszyć presję na popyt na układy AI ze strony firm takich jak Nvidia - Aioga Wiadomości AI","description":"TSMC planuje rozszerzyć skalę outsourcingu segmentu CoW w procesach pakowania CoWoS, zlecając producentom OSAT, takim jak ASE, wykonanie powiązanych kroków mających na celu zmniejs...","url":"https://www.aioga.com/pl/news/cmsfe0m8t1ozpro2etwlpt9wc/","contentTranslated":true,"sourceHash":"19db18fbcbfde640","translatedAt":"2026-08-05T01:23:47.308Z"}}}}