{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-09-21T09:00:48.663Z","headline":"合见工软发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer","description":"合见工软在 2026 IDAS 设计自动化产业峰会期间发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer，宣称专为国产先进工艺节点打造，适配逻辑折叠与韬定律技术路线。","url":"https://www.aioga.com/news/cmtjpusa201z1ro4dviqu3utw/","mainEntityOfPage":"https://www.aioga.com/news/cmtjpusa201z1ro4dviqu3utw/","datePublished":"2026-09-02T05:49:14.000Z","dateModified":"2026-09-02T05:49:14.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/997/403.htm","https://aihot.virxact.com/items/cmtjpusa201z1ro4dviqu3utw"],"canonicalUrl":"https://www.aioga.com/news/cmtjpusa201z1ro4dviqu3utw/","directAnswer":{"@type":"Answer","text":"合见工软在2026 IDAS设计自动化产业峰会期间发布UniVista 3DIC Designer，称其为国内首款三维芯片物理设计工具，面向国产先进工艺节点，并适配逻辑折叠与相关技术路线。","url":"https://www.aioga.com/news/cmtjpusa201z1ro4dviqu3utw/","dateCreated":"2026-09-02T05:49:14.000Z","author":{"@type":"Organization","@id":"https://www.aioga.com/authors/aioga-editorial/#editorial-team","name":"Aioga Editorial Team","url":"https://www.aioga.com/authors/aioga-editorial/"}},"evidence":[{"@type":"CreativeWork","name":"IT之家 source article","url":"https://www.ithome.com/0/997/403.htm","datePublished":"2026-09-02T05:49:14.000Z","provider":{"@type":"Organization","name":"IT之家","url":"https://www.ithome.com/0/997/403.htm"}},{"@type":"CreativeWork","name":"AIHot archive record","url":"https://aihot.virxact.com/items/cmtjpusa201z1ro4dviqu3utw","datePublished":"2026-09-02T05:49:14.000Z","provider":{"@type":"Organization","name":"AIHot","url":"https://aihot.virxact.com/items/cmtjpusa201z1ro4dviqu3utw"}}],"aggregationSource":"IT之家（RSS）","originalPublisher":{"name":"IT之家","url":"https://www.ithome.com/0/997/403.htm"},"geoDeepAnswer":null,"article":{"id":"cmtjpusa201z1ro4dviqu3utw","slug":"cmtjpusa201z1ro4dviqu3utw","url":"https://www.aioga.com/news/cmtjpusa201z1ro4dviqu3utw/","title":"合见工软发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer","title_en":"","summary":"合见工软在 2026 IDAS 设计自动化产业峰会期间发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer，宣称专为国产先进工艺节点打造，适配逻辑折叠与韬定律技术路线。","source":"IT之家（RSS）","sourceUrl":"https://www.ithome.com/0/997/403.htm","aiHotUrl":"https://aihot.virxact.com/items/cmtjpusa201z1ro4dviqu3utw","publishedAt":"2026-09-02T05:49:14.000Z","category":"行业动态","score":58,"selected":false,"articleBody":["IT之家：https://www.ithome.com/ 9 月 2 日消息，国内数字 EDA / IP 企业上海合见工业软件集团股份有限公司（简称“合见工软”）9 月 1 日在 2026 IDAS 设计自动化产业峰会期间，发布多款突破性 EDA 自研新品和成果， 填补国产 EDA 在商用级 3DIC 物理设计及多款 EDA 智能体等方面的空白 ，包括：","合见工软推出国内首款三维芯片物理设计工具 UniVista 3DIC Designer， 宣称专为国产先进工艺节点打造，可全面适配逻辑折叠与韬定律技术路线 ，并凭借底层自研真三维布局算法，打开全新的性能和密度提升空间。","该工具的推出打破了国内商用级 3DIC 物理设计工具空白，为 AI 等算力芯片提供自主可控的三维设计底座。","UniVista 3DIC Designer 聚焦电路逻辑空间折叠实现，打破了传统 2D 芯片设计在性能、功耗、面积上的物理限制， 聚焦于 2-die/3-die 逻辑折叠、多裸片异构堆叠等前沿架构 。","该平台融合了自动化智能分区、跨 Die 多目标优化驱动，物理场感知放置、CPU / GPU 异构并行加速技术，帮助设计团队在超短周期内实现时序（Performance）、功耗（Power）、面积（Area）、热分布（Thermal）的全局平衡，完成从 RTL / 网表输入到相应最优 3DIC 架构的无缝闭环交付， 缩短先进封装与三维芯片的上市周期 。","当前主流的 3D 封装 EDA 解决方案均为针对 2.5D 的传统平面工具扩展而来，仅能完成粗粒度芯粒分层堆叠，主要面向芯粒、中介层、硅桥、HBM 集成，面向逻辑折叠所需要的单元级原生 3D 全局协同工具仍处于早期原型阶段。","合见工软此次推出的 UniVista 3DIC Designer，宣称是国内首款自主知识产权的基于原生三维重构的创新 EDA 工具，为释放逻辑折叠技术潜力提供工具支撑。","UniVista 3DIC Designer 的底层架构专为逻辑折叠、混合键合（Hybrid Bonding）场景重构，打破了传统 3D 分层割裂的设计范式，依托原生真三维布局架构与 GPU 并行加速技术，解决了超大容量网表处理卡顿、跨裸片时序 / 布线 / 热密度多维度无法同步收敛、垂直 HBV 互连约束难以平衡、多层堆叠易出现局部热点、上下裸片面积失衡、总线长过高拖累 PPA 指标等工程难题， 让依托成熟产线的逻辑折叠技术规模化落地 ，填补了国产高端算力芯片开发缺少自主可控三维物理设计底座的技术空白。","据合见工软官方介绍，UniVista 3DIC Designer 具备五大差异化核心优势：","智能架构探索与自动化分区 ：可面向 10 亿门级超大规模设计开展模块级、标准器件级混合自动网表分区，支持最小可行面积与最优堆叠方案的设计空间探索，同时兼顾 intra-Die 以及 inter-Die 可布线性，规避后期布线拥塞问题。","自动化跨 Die 物理设计与对齐 ：能够完成 TSV、HBV 高密度互连资源的自动分配与放置，支撑跨 Die 电压域自动对齐，并开展供电网络协同规划，保障多层裸片互连供电方案的完整性与合理性。","目标驱动优化与 3D 协同放置 ：围绕拥塞、线长、时序、面积、热功耗多维度并行优化，动态消除局部布线拥塞，探索全局最小化跨 Die 互连线总长，优先缩短关键路径跨 Die 距离，均衡各层裸片资源占用，结合功耗密度与热感知策略防止出现局部热点。","自动化 3D 时序闭合 ：可自动生成跨 Die 时序约束与时序预算，一键输出复杂场景跨 Die SDC 文件，搭建稳定可靠的跨 Die 时序边界，实现多 Die 之间时序协同收敛，解决三维集成时序收敛难题。","突破传统 CPU 引擎计算性能与设计 TAT ：打破传统单核 CPU 算力瓶颈，有效缩短项目交付周期。采用深度调优的 CPU+GPU 异构并行计算架构，兼容分布式集群多任务调度机制，大幅提升超大规模三维芯片设计的运算处理效率。","IT之家获悉，合见工软还发布了国产先进工艺节点收敛工具 UniVista NodeClosure， 该产品补齐国产数字 EDA 后端 ECO（工程指令变更，Engineering Change Order）核心能力 ，面向先进工艺设计提供一站式敏捷设计收敛平台。","该产品围绕人工智能、HPC 等高性能芯片的严苛需求，采用物理感知增量优化架构，打破传统工具瓶颈、减少迭代次数，既能帮助设计团队在紧凑周期内完成设计收敛， 还可赋能国产晶圆厂，落地各类定制化设计规则，提升芯片量产良率 。","ECO 是数字芯片后端物理设计的核心环节，也是流片交付必不可少的工具。在布局布线完成、时序与版图基本收敛、临近流片时，它无需重启综合、布局布线完整流程，采用局部微创方式修复时序违例、逻辑缺陷、物理规则问题，以短周期、低改动风险完成芯片收尾优化，避免全流程返工造成时间与成本损失，保障版图达到流片要求。"],"articleImages":[{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/9/0794d982-c1eb-4acf-b575-d036649109bb.jpg@s_2,w_820,h_402","alt":"图片","afterParagraph":6,"url":"/media/articles/cmtjpusa201z1ro4dviqu3utw/a5f89639b44153be.jpg"}],"mediaStatus":"ok","articleBodyZh":["合见工软发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer 这条更新来自 ithome.com，发布时间为 2026-09-02，Aioga 保留原文入口以便核验。","摘要：合见工软在 2026 IDAS 设计自动化产业峰会期间发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer，宣称专为国产先进工艺节点打造，适配逻辑折叠与韬定律技术路线。","背景：据IT之家，UniVista 3DIC Designer聚焦2-die/3-die逻辑折叠和多裸片异构堆叠，支持从RTL或网表输入到三维架构设计的流程，并针对时序、功耗、面积和热分布进行协同优化。","Aioga 观察：Aioga 判断：该产品的公开信息突出原生三维布局、跨裸片协同与GPU并行加速等设计方向，但当前材料主要是厂商发布内容，工具实际性能、客户采用情况及商业化进展仍需更多证据验证。","影响与后续：可能影响：若相关能力经实际项目验证，国产三维芯片物理设计工具供给可能增加；但发布信息不足以证明其已全面解决大规模网表、热管理、布线和工艺适配问题，产业影响仍需观察。 后续观察：应关注UniVista 3DIC Designer的正式可用范围、适配工艺与封装条件、第三方或客户验证，以及在真实设计项目中的时序、功耗、面积和热分布表现。"],"translationStatus":"","bodyOrigin":"source-page","editorial":{"summary":"合见工软在2026 IDAS设计自动化产业峰会期间发布UniVista 3DIC Designer，称其为国内首款三维芯片物理设计工具，面向国产先进工艺节点，并适配逻辑折叠与相关技术路线。","background":"据IT之家，UniVista 3DIC Designer聚焦2-die/3-die逻辑折叠和多裸片异构堆叠，支持从RTL或网表输入到三维架构设计的流程，并针对时序、功耗、面积和热分布进行协同优化。","viewpoint":"Aioga 判断：该产品的公开信息突出原生三维布局、跨裸片协同与GPU并行加速等设计方向，但当前材料主要是厂商发布内容，工具实际性能、客户采用情况及商业化进展仍需更多证据验证。","implications":"可能影响：若相关能力经实际项目验证，国产三维芯片物理设计工具供给可能增加；但发布信息不足以证明其已全面解决大规模网表、热管理、布线和工艺适配问题，产业影响仍需观察。","nextStep":"后续观察：应关注UniVista 3DIC Designer的正式可用范围、适配工艺与封装条件、第三方或客户验证，以及在真实设计项目中的时序、功耗、面积和热分布表现。","evidenceRefs":["title","summary","articleBody","source"],"status":"published","aiGenerated":true,"autoApproved":true,"generatedBy":"aioga-editorial:gpt-5.6-sol","reviewedBy":"aioga-editorial-review:gpt-5.6-sol","generatedAt":"2026-09-02T06:47:48.379Z","sourceHash":"768a9e447dd5a51c","review":{"approved":true,"groundedness":94,"clarity":90,"duplicationRisk":10,"blockingIssues":[],"notes":["“相关技术路线”较为笼统，可考虑明确对应来源中的“韬定律技术路线”，但不影响事实准确性。","“支持从RTL或网表输入到三维架构设计的流程”属于对来源“从RTL/网表输入到相应最优3DIC架构无缝闭环交付”的概括，若需更严谨可保留“宣称”或“据称”。"]},"validation":{"passed":true,"mode":"ai-auto","revisions":0,"checks":["schema","length","source-attribution","editorial-labels","inference-boundary","low-source-overlap","no-html","independent-ai-review"]}},"tags":["行业动态","IT之家（RSS）"],"translations":{"zh-CN":{"title":"合见工软发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer","summary":"合见工软在 2026 IDAS 设计自动化产业峰会期间发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer，宣称专为国产先进工艺节点打造，适配逻辑折叠与韬定律技术路线。","category":"行业动态","source":"IT之家","aggregationSource":"IT之家（RSS）","pageTitle":"合见工软发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer - Aioga AI资讯","description":"合见工软在 2026 IDAS 设计自动化产业峰会期间发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer，宣称专为国产先进工艺节点打造，适配逻辑折叠与韬定律技术路线。","url":"https://www.aioga.com/news/cmtjpusa201z1ro4dviqu3utw/","articleBody":["合见工软发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer 这条更新来自 ithome.com，发布时间为 2026-09-02，Aioga 保留原文入口以便核验。","摘要：合见工软在 2026 IDAS 设计自动化产业峰会期间发布国内首款三维芯片物理设计工具 UniVista 3DIC Designer，宣称专为国产先进工艺节点打造，适配逻辑折叠与韬定律技术路线。","背景：据IT之家，UniVista 3DIC Designer聚焦2-die/3-die逻辑折叠和多裸片异构堆叠，支持从RTL或网表输入到三维架构设计的流程，并针对时序、功耗、面积和热分布进行协同优化。","Aioga 观察：Aioga 判断：该产品的公开信息突出原生三维布局、跨裸片协同与GPU并行加速等设计方向，但当前材料主要是厂商发布内容，工具实际性能、客户采用情况及商业化进展仍需更多证据验证。","影响与后续：可能影响：若相关能力经实际项目验证，国产三维芯片物理设计工具供给可能增加；但发布信息不足以证明其已全面解决大规模网表、热管理、布线和工艺适配问题，产业影响仍需观察。 后续观察：应关注UniVista 3DIC Designer的正式可用范围、适配工艺与封装条件、第三方或客户验证，以及在真实设计项目中的时序、功耗、面积和热分布表现。"]},"en":{"title":"Hejian Gongsoft Releases China’s First 3D Chip Physical Design Tool UniVista 3DIC Designer","summary":"During the 2026 IDAS Design Automation Industry Summit, Hejian Gongsoft released China’s first 3D chip physical design tool, UniVista 3DIC Designer, claiming it is specifically designed for domestic advanced process nodes and is compatible with logic folding and Tao’s Law technology paths.","category":"Industry","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Gongsoft Releases China’s First 3D Chip Physical Design Tool UniVista 3DIC Designer - Aioga AI News","description":"During the 2026 IDAS Design Automation Industry Summit, Hejian Gongsoft released China’s first 3D chip physical design tool, UniVista 3DIC Designer, claiming it is specifically des...","url":"https://www.aioga.com/en/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:07.692Z"},"ja":{"title":"何建公鸞は、中国初の3Dチップ物理設計ツールであるUniVista 3DIC Designerをリリースしました","summary":"2026年のIDAS設計自動化産業サミットにおいて、何建公鸞は中国初の3Dチップ物理設計ツールであるUniVista 3DIC Designerを発表し、先進的な国内プロセスノード向けに特別に設計され、論理折りたたみや陶律技術ルートに適応できると主張しました。","category":"業界動向","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"何建公鸞は、中国初の3Dチップ物理設計ツールであるUniVista 3DIC Designerをリリースしました - Aioga AIニュース","description":"2026年のIDAS設計自動化産業サミットにおいて、何建公鸞は中国初の3Dチップ物理設計ツールであるUniVista 3DIC Designerを発表し、先進的な国内プロセスノード向けに特別に設計され、論理折りたたみや陶律技術ルートに適応できると主張しました。","url":"https://www.aioga.com/ja/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:09.501Z"},"ko":{"title":"Hejian Gongsoft, 국내 최초 3D 칩 물리 설계 도구 UniVista 3DIC Designer 출시","summary":"Hejian Gongsoft는 2026 IDAS 설계 자동화 산업 정상 회의 기간 중 국내 최초의 3D 칩 물리 설계 도구 UniVista 3DIC Designer를 발표하며, 국내 고급 공정 노드용으로 설계되었으며 논리 접기 및 Tao 법칙 기술 경로에 적합하다고 주장했다.","category":"업계 동향","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Gongsoft, 국내 최초 3D 칩 물리 설계 도구 UniVista 3DIC Designer 출시 - Aioga AI 뉴스","description":"Hejian Gongsoft는 2026 IDAS 설계 자동화 산업 정상 회의 기간 중 국내 최초의 3D 칩 물리 설계 도구 UniVista 3DIC Designer를 발표하며, 국내 고급 공정 노드용으로 설계되었으며 논리 접기 및 Tao 법칙 기술 경로에 적합하다고 주장했다.","url":"https://www.aioga.com/ko/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:16.694Z"},"es":{"title":"Hejian Software lanza la primera herramienta de diseño físico de chips 3D doméstica, UniVista 3DIC Designer","summary":"Durante la Cumbre Industrial de Automatización de Diseño IDAS 2026, Hejian Software lanzó la primera herramienta de diseño físico de chips 3D doméstica, UniVista 3DIC Designer, declarando que está diseñada específicamente para nodos avanzados de fabricación nacionales y es compatible con rutas tecnológicas de plegado lógico y la ley de Tao.","category":"Industria","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software lanza la primera herramienta de diseño físico de chips 3D doméstica, UniVista 3DIC Designer - Aioga Noticias de IA","description":"Durante la Cumbre Industrial de Automatización de Diseño IDAS 2026, Hejian Software lanzó la primera herramienta de diseño físico de chips 3D doméstica, UniVista 3DIC Designer, dec...","url":"https://www.aioga.com/es/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:17.142Z"},"fr":{"title":"Hejian Software publie le premier outil chinois de conception physique de puce tridimensionnelle UniVista 3DIC Designer","summary":"Hejian Software a publié le premier outil chinois de conception physique de puce tridimensionnelle, UniVista 3DIC Designer, lors du sommet de l'industrie de l'automatisation de la conception IDAS 2026, affirmant qu’il est spécialement conçu pour les processus avancés nationaux, et qu’il est compatible avec la technologie de pliage logique et la route technologique de la loi de Tao.","category":"Industrie","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software publie le premier outil chinois de conception physique de puce tridimensionnelle UniVista 3DIC Designer - Aioga Actualités IA","description":"Hejian Software a publié le premier outil chinois de conception physique de puce tridimensionnelle, UniVista 3DIC Designer, lors du sommet de l'industrie de l'automatisation de la...","url":"https://www.aioga.com/fr/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:24.524Z"},"de":{"title":"Hejian Software veröffentlicht Chinas erstes 3D-IC-Physikdesign-Tool UniVista 3DIC Designer","summary":"Hejian Software veröffentlichte während des 2026 IDAS Design Automation Industry Summit Chinas erstes 3D-IC-Physikdesign-Tool UniVista 3DIC Designer und behauptet, es sei speziell für fortschrittliche inländische Fertigungstechnologien entwickelt worden und passe zur Logikfaltung und zum Tao-Gesetz-Technikpfad.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software veröffentlicht Chinas erstes 3D-IC-Physikdesign-Tool UniVista 3DIC Designer - Aioga KI-News","description":"Hejian Software veröffentlichte während des 2026 IDAS Design Automation Industry Summit Chinas erstes 3D-IC-Physikdesign-Tool UniVista 3DIC Designer und behauptet, es sei speziell...","url":"https://www.aioga.com/de/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:23.290Z"},"pt-BR":{"title":"Hejian Software lança primeira ferramenta doméstica de design físico de chip 3D, UniVista 3DIC Designer","summary":"Durante a Cúpula da Indústria de Automação de Design IDAS 2026, a Hejian Software lançou a primeira ferramenta nacional de design físico de chip 3D, UniVista 3DIC Designer, afirmando que foi desenvolvida para nós de processo avançado nacionais e é compatível com a técnica de dobramento lógico e a rota tecnológica da Lei de Tóu.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software lança primeira ferramenta doméstica de design físico de chip 3D, UniVista 3DIC Designer - Aioga Notícias de IA","description":"Durante a Cúpula da Indústria de Automação de Design IDAS 2026, a Hejian Software lançou a primeira ferramenta nacional de design físico de chip 3D, UniVista 3DIC Designer, afirman...","url":"https://www.aioga.com/pt-BR/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:31.621Z"},"ru":{"title":"Hejian Gongruan выпустил UniVista 3DIC Designer — первый в Китае инструмент для физического проектирования 3D-чипов","summary":"Во время саммита индустрии автоматизации проектирования IDAS 2026 года Хэцзянь Гунжуань представил первый в Китае инструмент физического проектирования 3D-чипов — UniVista 3DIC Designer, заявив, что он специально разработан для передовых отечественных процессных узлов и адаптирован к логическому складыванию и технологиям по закону Дао.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Gongruan выпустил UniVista 3DIC Designer — первый в Китае инструмент для физического проектирования 3D-чипов - Aioga Новости ИИ","description":"Во время саммита индустрии автоматизации проектирования IDAS 2026 года Хэцзянь Гунжуань представил первый в Китае инструмент физического проектирования 3D-чипов — UniVista 3DIC Des...","url":"https://www.aioga.com/ru/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:33.885Z"},"ar":{"title":"شركة Hejian Software تطلق أول أداة تصميم فيزيائي ثلاثية الأبعاد للرقائق في الصين UniVista 3DIC Designer","summary":"أطلقت شركة Hejian Software خلال قمة صناعة أتمتة التصميم IDAS 2026 أول أداة للتصميم الفيزيائي للرقائق ثلاثية الأبعاد UniVista 3DIC Designer في الصين، مؤكدة أنها مصممة خصيصًا لعقد عمليات التصنيع المتقدمة المحلية، ومتوافقة مع طي المنطق ومسار Tao Law التقني.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"شركة Hejian Software تطلق أول أداة تصميم فيزيائي ثلاثية الأبعاد للرقائق في الصين UniVista 3DIC Designer - Aioga أخبار الذكاء الاصطناعي","description":"أطلقت شركة Hejian Software خلال قمة صناعة أتمتة التصميم IDAS 2026 أول أداة للتصميم الفيزيائي للرقائق ثلاثية الأبعاد UniVista 3DIC Designer في الصين، مؤكدة أنها مصممة خصيصًا لعقد عم...","url":"https://www.aioga.com/ar/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:41.075Z"},"hi":{"title":"हेजियन गोंगरुआन ने यूनीविस्टा 3डीआईसी डिजाइनर, चीन का पहला 3डी चिप फिजिकल डिजाइन टूल जारी किया है","summary":"2026 आईडीएएस डिज़ाइन ऑटोमेशन इंडस्ट्री समिट के दौरान, हेजियन गोंगरुआन ने चीन का पहला 3डी चिप फिजिकल डिज़ाइन टूल, यूनीविस्टा 3डीआईसी डिज़ाइनर लॉन्च किया, जिसमें दावा किया गया है कि यह विशेष रूप से उन्नत घरेलू प्रोसेस नोड्स के लिए डिज़ाइन किया गया है और लॉजिक फोल्डिंग और ताओ लॉ टेक्नोलॉजी मार्गों के अनुकूल है।","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"हेजियन गोंगरुआन ने यूनीविस्टा 3डीआईसी डिजाइनर, चीन का पहला 3डी चिप फिजिकल डिजाइन टूल जारी किया है - Aioga AI समाचार","description":"2026 आईडीएएस डिज़ाइन ऑटोमेशन इंडस्ट्री समिट के दौरान, हेजियन गोंगरुआन ने चीन का पहला 3डी चिप फिजिकल डिज़ाइन टूल, यूनीविस्टा 3डीआईसी डिज़ाइनर लॉन्च किया, जिसमें दावा किया गया है कि...","url":"https://www.aioga.com/hi/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:42.944Z"},"it":{"title":"Hejian Software lancia il primo strumento domestico per progettazione fisica di chip 3D, UniVista 3DIC Designer","summary":"Durante il 2026 IDAS Design Automation Industry Summit, Hejian Software ha lanciato il primo strumento cinese per progettazione fisica di chip 3D, UniVista 3DIC Designer, dichiarando che è stato progettato per le avanzate tecnologie nazionali, compatibile con logica pieghevole e tecnologie basate sulla legge di Tao.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software lancia il primo strumento domestico per progettazione fisica di chip 3D, UniVista 3DIC Designer - Aioga Notizie IA","description":"Durante il 2026 IDAS Design Automation Industry Summit, Hejian Software ha lanciato il primo strumento cinese per progettazione fisica di chip 3D, UniVista 3DIC Designer, dichiaran...","url":"https://www.aioga.com/it/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:50.824Z"},"nl":{"title":"Hejian Software lanceert China's eerste 3D-chipfysiek ontwerp-tool UniVista 3DIC Designer","summary":"Tijdens de 2026 IDAS Design Automation Industry Summit lanceerde Hejian Software China's eerste 3D-chip fysieke ontwerp-tool UniVista 3DIC Designer, die speciaal is ontwikkeld voor geavanceerde binnenlandse procestechnologieën en compatibel is met logische folding en Tao-regel technologiepaden.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software lanceert China's eerste 3D-chipfysiek ontwerp-tool UniVista 3DIC Designer - Aioga AI-nieuws","description":"Tijdens de 2026 IDAS Design Automation Industry Summit lanceerde Hejian Software China's eerste 3D-chip fysieke ontwerp-tool UniVista 3DIC Designer, die speciaal is ontwikkeld voor...","url":"https://www.aioga.com/nl/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:49.302Z"},"tr":{"title":"Hejian Software, ülkenin ilk 3D çip fizik tasarım aracı UniVista 3DIC Designer’ı yayınladı","summary":"Hejian Software, 2026 IDAS Tasarım Otomasyonu Sanayi Zirvesi sırasında, ülkenin ilk 3D çip fizik tasarım aracı UniVista 3DIC Designer’ı piyasaya sürdü ve cihazın yerli ileri teknoloji düğümleri için özel tasarlandığını, mantıksal katlamayı ve Tao Yasası (韬定律) teknoloji yolunu desteklediğini açıkladı.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software, ülkenin ilk 3D çip fizik tasarım aracı UniVista 3DIC Designer’ı yayınladı - Aioga AI Haberleri","description":"Hejian Software, 2026 IDAS Tasarım Otomasyonu Sanayi Zirvesi sırasında, ülkenin ilk 3D çip fizik tasarım aracı UniVista 3DIC Designer’ı piyasaya sürdü ve cihazın yerli ileri teknol...","url":"https://www.aioga.com/tr/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:58.793Z"},"vi":{"title":"Héjian Soft ra mắt công cụ thiết kế vật lý chip 3D đầu tiên trong nước UniVista 3DIC Designer","summary":"Héjian Soft trong hội nghị thượng đỉnh ngành tự động hóa thiết kế IDAS 2026 phát hành công cụ thiết kế vật lý chip 3D đầu tiên trong nước, UniVista 3DIC Designer, tuyên bố được tạo riêng cho các node công nghệ tiên tiến trong nước, tương thích với kỹ thuật gấp logic và lộ trình công nghệ của Đạo luật Tao.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Héjian Soft ra mắt công cụ thiết kế vật lý chip 3D đầu tiên trong nước UniVista 3DIC Designer - Tin tức AI Aioga","description":"Héjian Soft trong hội nghị thượng đỉnh ngành tự động hóa thiết kế IDAS 2026 phát hành công cụ thiết kế vật lý chip 3D đầu tiên trong nước, UniVista 3DIC Designer, tuyên bố được tạo...","url":"https://www.aioga.com/vi/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:43:58.256Z"},"id":{"title":"Hejian Industrial Software Merilis Alat Desain Fisik Chip 3D Pertama di Dalam Negeri, UniVista 3DIC Designer","summary":"Hejian Industrial Software merilis alat desain fisik chip 3D pertama di dalam negeri, UniVista 3DIC Designer, selama KTT Industri Otomasi Desain IDAS 2026, mengklaim bahwa alat ini khusus dibuat untuk node proses canggih buatan dalam negeri, dan mendukung jalur teknologi lipatan logika dan hukum Tao.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Industrial Software Merilis Alat Desain Fisik Chip 3D Pertama di Dalam Negeri, UniVista 3DIC Designer - Berita AI Aioga","description":"Hejian Industrial Software merilis alat desain fisik chip 3D pertama di dalam negeri, UniVista 3DIC Designer, selama KTT Industri Otomasi Desain IDAS 2026, mengklaim bahwa alat ini...","url":"https://www.aioga.com/id/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:44:06.030Z"},"th":{"title":"Hejian Software เปิดตัวเครื่องมือออกแบบชิปสามมิติเชิงกายภาพ UniVista 3DIC Designer รุ่นแรกของจีน","summary":"Hejian Software เปิดตัวเครื่องมือออกแบบชิปสามมิติเชิงกายภาพรุ่นแรกของจีน UniVista 3DIC Designer ระหว่างงาน 2026 IDAS Design Automation Industry Summit อ้างว่าออกแบบมาสำหรับโหนดกระบวนการขั้นสูงในประเทศ รองรับเทคนิค Logic Folding และ Tao's Law","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Software เปิดตัวเครื่องมือออกแบบชิปสามมิติเชิงกายภาพ UniVista 3DIC Designer รุ่นแรกของจีน - ข่าว AI Aioga","description":"Hejian Software เปิดตัวเครื่องมือออกแบบชิปสามมิติเชิงกายภาพรุ่นแรกของจีน UniVista 3DIC Designer ระหว่างงาน 2026 IDAS Design Automation Industry Summit อ้างว่าออกแบบมาสำหรับโหนดกระบ...","url":"https://www.aioga.com/th/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:44:06.872Z"},"pl":{"title":"Hejian Gongruan wypuścił UniVista 3DIC Designer, pierwsze chińskie narzędzie do fizycznego projektowania układów 3D","summary":"Podczas Szczytu Przemysłu Automatyzacji Projektowania IDAS w 2026 roku, Hejian Gongruan wprowadził pierwsze w Chinach narzędzie do fizycznego projektowania 3D na chipach, UniVista 3DIC Designer, twierdząc, że jest ono specjalnie zaprojektowane dla zaawansowanych węzłów procesów krajowych i przystosowane do ścieżek technologii logicznego składania oraz Tao Law.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Hejian Gongruan wypuścił UniVista 3DIC Designer, pierwsze chińskie narzędzie do fizycznego projektowania układów 3D - Aioga Wiadomości AI","description":"Podczas Szczytu Przemysłu Automatyzacji Projektowania IDAS w 2026 roku, Hejian Gongruan wprowadził pierwsze w Chinach narzędzie do fizycznego projektowania 3D na chipach, UniVista...","url":"https://www.aioga.com/pl/news/cmtjpusa201z1ro4dviqu3utw/","contentTranslated":true,"sourceHash":"a489037705b9e890","translatedAt":"2026-09-02T06:44:16.026Z"}},"evidenceTier":"verified-news","reviewStatus":"automated-ingest","indexable":true,"editorialCover":""}}