{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-09-28T06:03:00.468Z","headline":"高通与亚马逊达成合作，共同开发 AI 定制芯片与 1.6T 光互连方案","description":"高通宣布与亚马逊达成跨多代合作，为大规模 AI 数据中心共同打造可规模化的定制芯片，并基于 SerDes 和光学 DSP 技术开发最高 1.6T 速率的光互连方案。","url":"https://www.aioga.com/news/cmtsqjp8c01s7rokay6dey0mw/","mainEntityOfPage":"https://www.aioga.com/news/cmtsqjp8c01s7rokay6dey0mw/","datePublished":"2026-09-08T13:15:57.000Z","dateModified":"2026-09-08T13:15:57.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://www.ithome.com/0/999/925.htm","https://aihot.news/items/cmtsqjp8c01s7rokay6dey0mw"],"canonicalUrl":"https://www.aioga.com/news/cmtsqjp8c01s7rokay6dey0mw/","directAnswer":{"@type":"Answer","text":"Aioga 编辑摘要：高通宣布与亚马逊达成跨多代合作，为大规模 AI 数据中心共同打造可规模化的定制芯片，并基于 SerDes 和光学 DSP 技术开发最高 1.6T 速率的光互连方案。 Aioga 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推理展开合作。此外，两家公司还将共同开发最高支持 1.6T 速率的光互连解决方案，以及面向未来的下一代相关技术。","随着 AI 工作负载呈指数级增长，计算、存储、网络、内存带宽以及高能效基础设施的需求正以前所未有的速度提升。此次合作将结合亚马逊全面、安全且具有成本性能优势的 AI 基础设施，以及高通技术在低功耗处理、芯片设计和系统级集成领域的技术优势。","高通技术和亚马逊还将共同开发高性能光互连解决方案，以满足 AI 基础设施不断扩大的规模和带宽需求。双方的合作将利用高通的 SerDes 高速串行器 / 解串器技术和光学 DSP 技术。","作为扩大合作的一部分，高通技术计划进一步加大对 AWS AI 基础设施的使用，包括 Amazon Bedrock，并将其应用于电子设计自动化（EDA）工作负载，以缩短芯片设计周期。","高通公司总裁兼 CEO 克里斯蒂亚诺 · 阿蒙表示：“随着 AI 需求不断加速增长，数据中心基础设施需要在计算和互连两个方面同时取得进步，以实现更高性能和更高效率。高通很高兴与 AWS 围绕定制芯片和连接解决方案展开合作，将我们在先进处理和高能效计算领域数十年的技术积累应用其中，提供突破性的性能，并推动下一代 AI 基础设施的发展。”","AWS 副总裁 Prasad Kalyanaraman 表示：“与高通技术的这项合作建立在双方长期合作的坚实基础之上，也体现了我们共同推动技术边界的承诺。通过在定制芯片和先进连接技术领域开展合作，我们将为客户提供性能更强、效率更高、成本效益更出色的基础设施。”","此外，SEC 文件显示，高通公司和其子公司高通技术公司及其部分关联公司与亚马逊数据服务公司及其部分关联公司达成一项战略合作。高通已向亚马逊的关联公司签发一份认股权证，赋予权证持有人以每股 161.26 美元 （IT之家注：现汇率约合 1,085 元人民币） 的行权价，购买合计最多 25,000,000 股公司普通股（以下简称“权证股份”）的权利。","该权证允许以无现金方式行使，有效期至 2036 年 9 月 3 日。相关付款总额最高可达 600 亿美元 （现汇率约合 4,037.06 亿元人民币） ，其中基于初始采购承诺，3,750,000 股已于权证签发时归属。"],"articleImages":[{"sourceUrl":"https://img.ithome.com/newsuploadfiles/2026/9/143cf272-2680-4d4e-a69f-ec367ae47db8.jpg?x-bce-process=image/format,f_auto","alt":"","afterParagraph":0,"url":"/media/articles/cmtsqjp8c01s7rokay6dey0mw/0b5ab8da6350ad66.webp"}],"mediaStatus":"ok","articleBodyZh":["高通与亚马逊达成合作，共同开发 AI 定制芯片与 1.6T 光互连方案 这条更新来自 ithome.com，发布时间为 2026-09-08，Aioga 保留原文入口以便核验。","摘要：高通宣布与亚马逊达成跨多代合作，为大规模 AI 数据中心共同打造可规模化的定制芯片，并基于 SerDes 和光学 DSP 技术开发最高 1.6T 速率的光互连方案。","背景：背景分析：公司与行业类动态需要放在竞争格局、商业化路径、资本信号和监管环境中观察，单条公告不能代表最终结果。","Aioga 观察：Aioga 判断：这条动态更适合作为行业观察信号，当前信息足以建立线索，但不足以推导长期结论。","影响与后续：影响分析：对相关团队而言，短期应先核对来源、可用范围和实际成本，再判断是否值得接入或跟进。 后续观察：继续观察官方文件、合作落地、收入或用户信号、竞品动作和监管后续。"],"translationStatus":"","bodyOrigin":"source-page","editorial":{"summary":"Aioga 编辑摘要：高通宣布与亚马逊达成跨多代合作，为大规模 AI 数据中心共同打造可规模化的定制芯片，并基于 SerDes 和光学 DSP 技术开发最高 1.6T 速率的光互连方案。 Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","background":"背景分析：公司与行业类动态需要放在竞争格局、商业化路径、资本信号和监管环境中观察，单条公告不能代表最终结果。","viewpoint":"Aioga 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AIニュース","description":"クアルコムは、アマゾンと多世代にわたる協力を発表し、大規模AIデータセンター向けのスケーラブルなカスタムチップを共同で開発し、SerDesおよび光DSP技術に基づく最大1.6Tの高速化光インターコネクトソリューションを開発します。","url":"https://www.aioga.com/ja/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:21:58.958Z"},"ko":{"title":"퀄컴은 아마존과 협력하여 맞춤형 AI 칩과 1.6T 광 인터커넥트 솔루션을 공동 개발했습니다","summary":"퀄컴은 아마존과 다세대 협력을 통해 대규모 AI 데이터 센터용 확장 가능한 맞춤형 칩을 공동 개발하고, SerDes와 광 DSP 기술을 기반으로 최대 1.6T 속도의 광 인터커넥트 솔루션을 개발한다고 발표했습니다.","category":"업계 동향","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"퀄컴은 아마존과 협력하여 맞춤형 AI 칩과 1.6T 광 인터커넥트 솔루션을 공동 개발했습니다 - Aioga AI 뉴스","description":"퀄컴은 아마존과 다세대 협력을 통해 대규모 AI 데이터 센터용 확장 가능한 맞춤형 칩을 공동 개발하고, SerDes와 광 DSP 기술을 기반으로 최대 1.6T 속도의 광 인터커넥트 솔루션을 개발한다고 발표했습니다.","url":"https://www.aioga.com/ko/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:08.192Z"},"es":{"title":"Qualcomm se ha asociado con Amazon para desarrollar conjuntamente chips de IA personalizados y soluciones de interconexión óptica de 1,6T","summary":"Qualcomm anunció una colaboración multigeneracional con Amazon para construir conjuntamente chips personalizados escalables para centros de datos de IA a gran escala, y desarrollar soluciones de interconexión óptica con velocidades de hasta 1,6T basadas en tecnologías SerDes y DSP ópticas.","category":"Industria","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm se ha asociado con Amazon para desarrollar conjuntamente chips de IA personalizados y soluciones de interconexión óptica de 1,6T - Aioga Noticias de IA","description":"Qualcomm anunció una colaboración multigeneracional con Amazon para construir conjuntamente chips personalizados escalables para centros de datos de IA a gran escala, y 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chips de IA personalizados e soluções de interconexão óptica 1.6T - Aioga Notícias de IA","description":"A Qualcomm anunciou uma colaboração multigeracional com a Amazon para construir conjuntamente chips personalizados escaláveis para data centers de IA em grande escala e desenvolver...","url":"https://www.aioga.com/pt-BR/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:27.257Z"},"ru":{"title":"Qualcomm сотрудничает с Amazon для совместной разработки индивидуальных AI-чипов и решений для оптических соединений 1.6T","summary":"Qualcomm объявила о многопоколенческом сотрудничестве с Amazon для совместного создания масштабируемых кастомных чипов для крупных дата-центров на базе ИИ, а также для разработки оптических решений для соединения со скоростью до 1,6T на базе SerDes и оптических DSP-технологий.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm сотрудничает с Amazon для совместной разработки индивидуальных AI-чипов и решений для оптических соединений 1.6T - Aioga Новости ИИ","description":"Qualcomm объявила о многопоколенческом сотрудничестве с Amazon для совместного создания масштабируемых кастомных чипов для крупных дата-центров на базе ИИ, а также для разработки о...","url":"https://www.aioga.com/ru/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:27.591Z"},"ar":{"title":"تعاونت كوالكوم مع أمازون لتطوير شرائح ذكاء اصطناعي مخصصة وحلول اتصال بصري بسرعة 1.6 طن","summary":"أعلنت كوالكوم عن تعاون متعدد الأجيال مع أمازون لبناء شرائح مخصصة قابلة للتوسع لمراكز بيانات الذكاء الاصطناعي واسعة النطاق، وتطوير حلول ربط بصري بسرعات تصل إلى 1.6 طن استنادا إلى تقنيات SerDes وDSP البصري.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"تعاونت كوالكوم مع أمازون لتطوير شرائح ذكاء اصطناعي مخصصة وحلول اتصال بصري بسرعة 1.6 طن - Aioga أخبار الذكاء الاصطناعي","description":"أعلنت كوالكوم عن تعاون متعدد الأجيال مع أمازون لبناء شرائح مخصصة قابلة للتوسع لمراكز بيانات الذكاء الاصطناعي واسعة النطاق، وتطوير حلول ربط بصري بسرعات تصل إلى 1.6 طن استنادا إلى تق...","url":"https://www.aioga.com/ar/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:36.650Z"},"hi":{"title":"क्वालकॉम ने संयुक्त रूप से कस्टम एआई चिप्स और 1.6T ऑप्टिकल इंटरकनेक्ट समाधान विकसित करने के लिए अमेज़ॅन के साथ साझेदारी की है","summary":"क्वालकॉम ने बड़े पैमाने पर एआई डेटा केंद्रों के लिए संयुक्त रूप से स्केलेबल कस्टम चिप्स बनाने और सर्डेस और ऑप्टिकल डीएसपी प्रौद्योगिकियों के आधार पर 1.6T तक की गति के साथ ऑप्टिकल इंटरकनेक्ट समाधान विकसित करने के लिए अमेज़ॅन के साथ एक बहु-पीढ़ी के सहयोग की घोषणा की।","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"क्वालकॉम ने संयुक्त रूप से कस्टम एआई चिप्स और 1.6T ऑप्टिकल इंटरकनेक्ट समाधान विकसित करने के लिए अमेज़ॅन के साथ साझेदारी की है - Aioga AI समाचार","description":"क्वालकॉम ने बड़े पैमाने पर एआई डेटा केंद्रों के लिए संयुक्त रूप से स्केलेबल कस्टम चिप्स बनाने और सर्डेस और ऑप्टिकल डीएसपी प्रौद्योगिकियों के आधार पर 1.6T तक की गति के साथ ऑप्टिकल इ...","url":"https://www.aioga.com/hi/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:36.825Z"},"it":{"title":"Qualcomm ha stretto una partnership con Amazon per sviluppare congiuntamente chip AI personalizzati e soluzioni di interconnessione ottica da 1,6T","summary":"Qualcomm ha annunciato una collaborazione multigenerazionale con Amazon per costruire congiuntamente chip personalizzati scalabili per data center AI su larga scala e sviluppare soluzioni di interconnessione ottica con velocità fino a 1,6T basate su tecnologie SerDes e DSP ottiche.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm ha stretto una partnership con Amazon per sviluppare congiuntamente chip AI personalizzati e soluzioni di interconnessione ottica da 1,6T - Aioga Notizie IA","description":"Qualcomm ha annunciato una collaborazione multigenerazionale con Amazon per costruire congiuntamente chip personalizzati scalabili per data center AI su larga scala e sviluppare so...","url":"https://www.aioga.com/it/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:46.099Z"},"nl":{"title":"Qualcomm werkt samen met Amazon om gezamenlijk op maat gemaakte AI-chips en 1,6T optische interconnectoplossingen te ontwikkelen","summary":"Qualcomm kondigde een meergenerationele samenwerking met Amazon aan om gezamenlijk schaalbare, op maat gemaakte chips te bouwen voor grootschalige AI-datacenters en optische interconnectieoplossingen te ontwikkelen met snelheden tot 1,6T gebaseerd op SerDes en optische DSP-technologieën.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm werkt samen met Amazon om gezamenlijk op maat gemaakte AI-chips en 1,6T optische interconnectoplossingen te ontwikkelen - Aioga AI-nieuws","description":"Qualcomm kondigde een meergenerationele samenwerking met Amazon aan om gezamenlijk schaalbare, op maat gemaakte chips te bouwen voor grootschalige AI-datacenters en optische interc...","url":"https://www.aioga.com/nl/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:46.319Z"},"tr":{"title":"Qualcomm, Amazon ile ortak olarak özel yapay zeka çipleri ve 1.6T optik bağlantı çözümleri geliştirmek üzere ortaklık kurdu","summary":"Qualcomm, büyük ölçekli yapay zeka veri merkezleri için ölçeklenebilir özel çipler üretmek ve SerDes ile optik DSP teknolojileri temelinde 1.6T'ye kadar hızlara sahip optik bağlantı çözümleri geliştirmek üzere Amazon ile çok kuşaklı bir iş birliği yaptığını duyurdu.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm, Amazon ile ortak olarak özel yapay zeka çipleri ve 1.6T optik bağlantı çözümleri geliştirmek üzere ortaklık kurdu - Aioga AI Haberleri","description":"Qualcomm, büyük ölçekli yapay zeka veri merkezleri için ölçeklenebilir özel çipler üretmek ve SerDes ile optik DSP teknolojileri temelinde 1.6T'ye kadar hızlara sahip optik bağlant...","url":"https://www.aioga.com/tr/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:55.706Z"},"vi":{"title":"Qualcomm đã hợp tác với Amazon để cùng phát triển chip AI tùy chỉnh và các giải pháp kết nối quang 1.6T","summary":"Qualcomm đã công bố hợp tác đa thế hệ với Amazon để cùng xây dựng các chip tùy chỉnh có khả năng mở rộng cho các trung tâm dữ liệu AI quy mô lớn, đồng thời phát triển các giải pháp kết nối quang học với tốc độ lên đến 1.6T dựa trên công nghệ SerDes và DSP quang học.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm đã hợp tác với Amazon để cùng phát triển chip AI tùy chỉnh và các giải pháp kết nối quang 1.6T - Tin tức AI Aioga","description":"Qualcomm đã công bố hợp tác đa thế hệ với Amazon để cùng xây dựng các chip tùy chỉnh có khả năng mở rộng cho các trung tâm dữ liệu AI quy mô lớn, đồng thời phát triển các giải pháp...","url":"https://www.aioga.com/vi/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:22:55.714Z"},"id":{"title":"Qualcomm telah bermitra dengan Amazon untuk bersama-sama mengembangkan chip AI khusus dan solusi interkoneksi optik 1.6T","summary":"Qualcomm mengumumkan kolaborasi multi-generasi dengan Amazon untuk bersama-sama membangun chip kustom yang dapat diskalakan untuk pusat data AI skala besar, serta mengembangkan solusi interkoneksi optik dengan kecepatan hingga 1,6T berdasarkan teknologi SerDes dan DSP optik.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm telah bermitra dengan Amazon untuk bersama-sama mengembangkan chip AI khusus dan solusi interkoneksi optik 1.6T - Berita AI Aioga","description":"Qualcomm mengumumkan kolaborasi multi-generasi dengan Amazon untuk bersama-sama membangun chip kustom yang dapat diskalakan untuk pusat data AI skala besar, serta mengembangkan sol...","url":"https://www.aioga.com/id/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:23:05.028Z"},"th":{"title":"Qualcomm ได้ร่วมมือกับ Amazon เพื่อพัฒนาชิป AI แบบกําหนดเองและโซลูชันการเชื่อมต่อด้วยแสง 1.6T ร่วมกัน","summary":"Qualcomm ประกาศความร่วมมือหลายเจเนอเรชันกับ Amazon เพื่อสร้างชิปแบบกําหนดเองที่สามารถขยายขนาดได้สําหรับศูนย์ข้อมูล AI ขนาดใหญ่ และพัฒนาโซลูชันการเชื่อมต่อแบบออปติคัลที่มีความเร็วสูงสุดถึง 1.6T โดยใช้เทคโนโลยี SerDes และ optical DSP","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm ได้ร่วมมือกับ Amazon เพื่อพัฒนาชิป AI แบบกําหนดเองและโซลูชันการเชื่อมต่อด้วยแสง 1.6T ร่วมกัน - ข่าว AI Aioga","description":"Qualcomm ประกาศความร่วมมือหลายเจเนอเรชันกับ Amazon เพื่อสร้างชิปแบบกําหนดเองที่สามารถขยายขนาดได้สําหรับศูนย์ข้อมูล AI ขนาดใหญ่ และพัฒนาโซลูชันการเชื่อมต่อแบบออปติคัลที่มีความเร็วสู...","url":"https://www.aioga.com/th/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:23:04.529Z"},"pl":{"title":"Qualcomm nawiązał współpracę z Amazonem, aby wspólnie opracować niestandardowe układy AI oraz rozwiązania do połączeń optycznych 1,6T","summary":"Qualcomm ogłosił wielopokoleniową współpracę z Amazonem w celu wspólnej budowy skalowalnych, niestandardowych układów scalonych dla dużych centrów danych AI oraz opracowania rozwiązań połączeń optycznych o prędkościach do 1,6T, opartych na technologiach SerDes i optycznych DSP.","category":"行业动态","source":"IT之家（RSS）","aggregationSource":"IT之家（RSS）","pageTitle":"Qualcomm nawiązał współpracę z Amazonem, aby wspólnie opracować niestandardowe układy AI oraz rozwiązania do połączeń optycznych 1,6T - Aioga Wiadomości AI","description":"Qualcomm ogłosił wielopokoleniową współpracę z Amazonem w celu wspólnej budowy skalowalnych, niestandardowych układów scalonych dla dużych centrów danych AI oraz opracowania rozwią...","url":"https://www.aioga.com/pl/news/cmtsqjp8c01s7rokay6dey0mw/","contentTranslated":true,"sourceHash":"7dd6096d35c60e7c","translatedAt":"2026-09-08T14:23:14.680Z"}},"evidenceTier":"verified-news","reviewStatus":"automated-ingest","indexable":true,"editorialCover":""}}