{"@context":"https://schema.org","@type":"NewsArticle","generatedAt":"2026-09-28T06:03:00.468Z","headline":"ASML 锁定 TSMC、三星、Intel 采用 High-NA EUV，华为推动中国 DUV 去依赖","description":"据 Bloomberg 报道，三星计划 2028 年起将 ASML High-NA EUV 用于量产，TSMC 计划 2030 年，Intel 已在运行，单台机器成本高达 4 亿美元；四家公司还计划将光掩膜从六英寸转向十二英寸，ASML 技术负责人称可提升 High-NA 产能 40%，TSMC 与 ASML 计划 2031 年建测试线、2033 年投产。","url":"https://www.aioga.com/news/cmtstpplu04zrrokatldmtyok/","mainEntityOfPage":"https://www.aioga.com/news/cmtstpplu04zrrokatldmtyok/","datePublished":"2026-09-08T15:11:59.000Z","dateModified":"2026-09-08T15:11:59.000Z","inLanguage":"zh-CN","publisher":{"@type":"NewsMediaOrganization","name":"Aioga","url":"https://www.aioga.com"},"citation":["https://the-decoder.com/asml-locks-in-tsmc-samsung-and-intel-while-huawei-races-to-break-its-grip","https://aihot.news/items/cmtstpplu04zrrokatldmtyok"],"canonicalUrl":"https://www.aioga.com/news/cmtstpplu04zrrokatldmtyok/","directAnswer":{"@type":"Answer","text":"Aioga 编辑摘要：据 Bloomberg 报道，三星计划 2028 年起将 ASML High-NA EUV 用于量产，TSMC 计划 2030 年，Intel 已在运行，单台机器成本高达 4 亿美元； Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","url":"https://www.aioga.com/news/cmtstpplu04zrrokatldmtyok/","dateCreated":"2026-09-08T15:11:59.000Z","author":{"@type":"Organization","@id":"https://www.aioga.com/authors/aioga-editorial/#editorial-team","name":"Aioga Editorial Team","url":"https://www.aioga.com/authors/aioga-editorial/"}},"evidence":[{"@type":"CreativeWork","name":"the-decoder.com source article","url":"https://the-decoder.com/asml-locks-in-tsmc-samsung-and-intel-while-huawei-races-to-break-its-grip","datePublished":"2026-09-08T15:11:59.000Z","provider":{"@type":"Organization","name":"the-decoder.com","url":"https://the-decoder.com/asml-locks-in-tsmc-samsung-and-intel-while-huawei-races-to-break-its-grip"}},{"@type":"CreativeWork","name":"AIHot archive record","url":"https://aihot.news/items/cmtstpplu04zrrokatldmtyok","datePublished":"2026-09-08T15:11:59.000Z","provider":{"@type":"Organization","name":"AIHot","url":"https://aihot.news/items/cmtstpplu04zrrokatldmtyok"}}],"aggregationSource":"The Decoder：AI News（RSS）","originalPublisher":{"name":"the-decoder.com","url":"https://the-decoder.com/asml-locks-in-tsmc-samsung-and-intel-while-huawei-races-to-break-its-grip"},"geoDeepAnswer":null,"article":{"id":"cmtstpplu04zrrokatldmtyok","slug":"cmtstpplu04zrrokatldmtyok","url":"https://www.aioga.com/news/cmtstpplu04zrrokatldmtyok/","title":"ASML 锁定 TSMC、三星、Intel 采用 High-NA EUV，华为推动中国 DUV 去依赖","title_en":"","summary":"据 Bloomberg 报道，三星计划 2028 年起将 ASML High-NA EUV 用于量产，TSMC 计划 2030 年，Intel 已在运行，单台机器成本高达 4 亿美元；四家公司还计划将光掩膜从六英寸转向十二英寸，ASML 技术负责人称可提升 High-NA 产能 40%，TSMC 与 ASML 计划 2031 年建测试线、2033 年投产。","source":"The Decoder：AI News（RSS）","sourceUrl":"https://the-decoder.com/asml-locks-in-tsmc-samsung-and-intel-while-huawei-races-to-break-its-grip","aiHotUrl":"https://aihot.news/items/cmtstpplu04zrrokatldmtyok","publishedAt":"2026-09-08T15:11:59.000Z","category":"行业动态","score":58,"selected":false,"articleBody":["EUV lithography is one of the most critical bottlenecks in building the most advanced AI chips. As ASML lines up its biggest customers behind its latest tech, China is trying to break its dependence on the Dutch company under Huawei's lead.","ASML has won commitments from the leading chipmakers to adopt its newest production tech, according to a report from Bloomberg：https://www.bloomberg.com/news/articles/2026-09-08/asml-tsmc-samsung-intel-back-12-inch-masks-for-ai-chips. Samsung plans to use the Dutch company's High-NA EUV lithography machines：https://the-decoder.com/chipmakers-prepare-for-the-angstrom-age-with-successful-tests-of-next-gen-lithography-machines/ for high-volume manufacturing starting in 2028, and TSMC in 2030. Both join Intel, which already has the machines running. A single unit costs up to $400 million.","ASML is the world's only maker of EUV lithography, the machines needed to build the most powerful AI accelerators. The company brought the simpler Low-NA version to market in 2019 and has since worked with customers to roll out the more complex High-NA systems.","The deal hinges on a small but critical shift in technology. The four companies plan to move their photomasks from today's six-inch standard to twelve inches. A photomask is a kind of stencil that holds a chip's circuit pattern. In lithography, light passes through this mask onto a silicon wafer coated with light-sensitive material, transferring the pattern onto the wafer, where transistors and circuit paths are then formed.","The bigger the mask, the more area you can image in a single exposure. Because the six-inch limit capped the size of a single chip, manufacturers had to stack chips vertically and connect them in complex ways, which drove up cost and complexity.","The switch has long been seen as complicated and expensive. But the coordinated push could raise the throughput of High-NA machines by 40 percent and simplify the design process, according to ASML technology chief Marco Pieters, who called it a huge opportunity. TSMC and ASML plan to build a test line for twelve-inch masks by 2031, with production use on High-NA tools set for 2033.","TSMC had been cautious until now, arguing that the productivity gains didn't yet justify the higher costs. Now the company is reversing course. That matters for ASML, since TSMC accounts for about 16 percent of its revenue. Together with Samsung and Intel, the three biggest customers are on board. Samsung is one of the largest memory makers and plans to use High NA for memory chips starting in 2028, chips whose prices are climbing sharply right now because of demand from AI data centers.","Meanwhile, Huawei is pushing to strip foreign technology out of China's semiconductor supply chain and work around Western export controls that cover ASML's valuable technology, according to a report from the Financial Times：https://www.ft.com/content/36333a53-4063-4aad-8df9-8d2f9d0048a3. The company is investing across the entire lithography chain and helping broker deals with leading fabs like SMIC.","China isn't focused on the most advanced EUV technology, but on DUV. The abbreviation stands for Deep Ultraviolet, with a wavelength of 193 nanometers, while EUV works at a much shorter 13.5 nanometers. The shorter wavelength allows finer structures and therefore the most advanced chips. DUV is the older, more mature technology and is used for most chips made worldwide. With so-called multi-patterning, where a pattern is built up over several exposure steps, it can also produce more advanced semiconductors, though at greater effort and cost than EUV.","At the center of Huawei's effort is Yuliangsheng, a Shanghai equipment maker that helped develop China's first advanced DUV machine, according to the FT. The company was spun out of SiCarrier, which the FT says has close ties to Huawei, a claim Huawei denies. The machine is being tested by SMIC and on Huawei's own production lines, so far for less complex semiconductors. Yuliangsheng aims to produce twelve DUV machines by the end of the year, but remains far behind ASML.","Bernstein analyst Lin Qingyuan said Huawei plays a project management role in China's DUV push, and that a DUV prototype alone isn't enough. You need thousands of suppliers and customers working together, plus a central orchestrating force.","The biggest bottlenecks remain projection lenses and light sources. Yuliangsheng uses lenses from Zeiss, according to the FT. The company said it sells its optics only to ASML. But insiders point to the secondary market. Huawei's venture capital arm Habo is at the same time backing Zeiss rivals like Fujian Zhiqi Photonics and light-source developer Beijing RSLaser to become more independent here too.","Stay in the loop on AI. Clear, useful, no fluff.","Follow The Decoder for AI news, background stories and expert analyses.","The Decoder：https://the-decoder.com/"],"articleImages":[{"sourceUrl":"https://the-decoder.com/wp-content/uploads/2024/08/asml_highna_cleanroom_veldhoven_067.jpg","alt":"Image description","afterParagraph":0,"url":"/media/articles/cmtstpplu04zrrokatldmtyok/99e48e3b7acb1377.jpg"}],"mediaStatus":"ok","articleBodyZh":["EUV光刻是构建最先进AI芯片时最关键的瓶颈之一。随着ASML将最大客户集中在最新技术上，中国正努力摆脱对华为领导下的荷兰公司的依赖。","据彭博社报道，ASML已获得领先芯片制造商的承诺，采用其最新的量产技术：https：//www.bloomberg.com/news/articles/2026-09-08/asml-tsmc-samsung-back-12-inch-masks-for-ai-chips。三星计划从2028年开始使用这家荷兰公司的High-NA EUV光刻机：https：//the-decoder.com/chipmakers-prepare-for-the-angstrom-age-with-successful-tests-of-next-gen-lithography-machines/，台积电则于2030年投入生产。两者都加入英特尔，英特尔已拥有这些机器运行。单台成本高达4亿美元。","ASML是全球唯一生产极紫外光刻技术的制造商，这些设备是构建最强大AI加速器所需的设备。该公司于2019年推出了更简单的低自然形功版本，此后与客户合作推广更复杂的高自然非和系统。","该交易依赖于技术上的一个小而关键的转变。这四家公司计划将光罩从现有的六英寸标准提升到十二英寸。光罩是一种模板，用于保存芯片的电路图案。在光刻技术中，光线穿过该掩膜，覆盖有感光材料的硅晶圆，将图案转移到晶圆上，晶体管和电路路径由此形成。","遮罩越大，单次曝光中能拍摄的面积就越大。由于6英寸限制限制了单个芯片的尺寸，制造商不得不垂直堆叠芯片并以复杂方式连接，这增加了成本和复杂度。","这一转变长期以来被视为复杂且昂贵。但ASML技术主管Marco Pieters称，协调推进可使高NA机器的吞吐量提升40%，简化设计流程，他称这是一个巨大的机遇。台积电和ASML计划在2031年前开发12英寸口罩测试线，高NA工具的量产预计于2033年。","台积电直到现在一直保持谨慎，认为生产率的提升尚不足以支撑更高的成本。现在公司正在改变方向。这对ASML很重要，因为台积电约占其收入的16%。与三星和英特尔一起，这三大客户都已经参与其中。三星是最大的存储芯片制造商之一，计划从2028年开始在存储芯片上使用高NA技术，而这些芯片的价格目前因AI数据中心的需求正迅速上涨。","与此同时，据《金融时报》报道，华为正在推动从中国半导体供应链中剔除外国技术，并绕开涵盖ASML重要技术的西方出口管制：https://www.ft.com/content/36333a53-4063-4aad-8df9-8d2f9d0048a3。该公司正在整个光刻链条上进行投资，并协助与像中芯国际这样的领先晶圆厂达成交易。","中国并未专注于最先进的EUV技术，而是关注DUV。DUV是深紫外（Deep Ultraviolet）的缩写，波长为193纳米，而EUV的波长则只有13.5纳米。较短的波长可以制造更精细的结构，从而生产最先进的芯片。DUV是一种较为成熟的老技术，适用于全球大多数芯片的生产。通过所谓的多重曝光技术，即通过多个曝光步骤叠加图案，也可以制造更先进的半导体，但相较EUV需要付出更大的努力和成本。","据《金融时报》报道，华为努力的核心是上海的设备制造商宇量盛，该公司帮助开发了中国第一台先进的DUV设备。据称，宇量盛由SiCarrier分拆而出，《金融时报》表示SiCarrier与华为关系密切，而华为对此予以否认。这台设备正在中芯国际和华为自有生产线进行测试，目前应用于较为简单的半导体。宇量盛计划在年底前生产十二台DUV设备，但仍远落后于ASML。","伯恩斯坦分析师林清远表示，华为在中国DUV发展中扮演项目管理角色，而仅有DUV原型设备是不够的。你需要成千上万的供应商和客户协同工作，并且有一个中央协调力量。","最大瓶颈仍然是投影镜头和光源。根据《金融时报》的报道，裕量升使用蔡司的镜头。公司表示，它只向ASML出售光学产品。但内部人士指出存在二级市场。华为的风险投资部门弥博同时也支持蔡司的竞争对手，如福建智启光电和光源开发商北京锐视激光，使其在这方面也能更加独立。","保持人工智能最新动态。清晰、有用，无废话。","关注《解码器》获取AI新闻、背景故事和专家分析。","解码器：https://the-decoder.com/"],"translationStatus":"translated","bodyOrigin":"source-page","editorial":{"summary":"Aioga 编辑摘要：据 Bloomberg 报道，三星计划 2028 年起将 ASML High-NA EUV 用于量产，TSMC 计划 2030 年，Intel 已在运行，单台机器成本高达 4 亿美元； Aioga 将其归入「行业动态」方向，重点关注它对真实使用和行业竞争的影响。","background":"背景分析：公司与行业类动态需要放在竞争格局、商业化路径、资本信号和监管环境中观察，单条公告不能代表最终结果。","viewpoint":"Aioga 判断：这条动态更适合作为行业观察信号，当前信息足以建立线索，但不足以推导长期结论。","implications":"影响分析：对相关团队而言，短期应先核对来源、可用范围和实际成本，再判断是否值得接入或跟进。","nextStep":"后续观察：继续观察官方文件、合作落地、收入或用户信号、竞品动作和监管后续。","evidenceRefs":["title","summary","articleBody"],"confidence":"medium","status":"published","aiGenerated":false,"autoApproved":true,"generatedBy":"rule-safe-fallback","generatedAt":"2026-09-28T06:19:15.358Z","sourceHash":"67e71338d60af7c2","validation":{"passed":true,"mode":"rule-safe-fallback","checks":["schema","length","source-attribution","no-html"]}},"tags":["行业动态","The Decoder：AI News（RSS）"],"translations":{"zh-CN":{"title":"ASML 锁定 TSMC、三星、Intel 采用 High-NA EUV，华为推动中国 DUV 去依赖","summary":"据 Bloomberg 报道，三星计划 2028 年起将 ASML High-NA EUV 用于量产，TSMC 计划 2030 年，Intel 已在运行，单台机器成本高达 4 亿美元；四家公司还计划将光掩膜从六英寸转向十二英寸，ASML 技术负责人称可提升 High-NA 产能 40%，TSMC 与 ASML 计划 2031 年建测试线、2033 年投产。","category":"行业动态","source":"the-decoder.com","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML 锁定 TSMC、三星、Intel 采用 High-NA EUV，华为推动中国 DUV 去依赖 - Aioga AI资讯","description":"据 Bloomberg 报道，三星计划 2028 年起将 ASML High-NA EUV 用于量产，TSMC 计划 2030 年，Intel 已在运行，单台机器成本高达 4 亿美元；四家公司还计划将光掩膜从六英寸转向十二英寸，ASML 技术负责人称可提升 High-NA 产能 40%，TSMC 与 ASML 计划 2031 年建测试线、2033 年投产。","url":"https://www.aioga.com/news/cmtstpplu04zrrokatldmtyok/","articleBody":["EUV光刻是构建最先进AI芯片时最关键的瓶颈之一。随着ASML将最大客户集中在最新技术上，中国正努力摆脱对华为领导下的荷兰公司的依赖。","据彭博社报道，ASML已获得领先芯片制造商的承诺，采用其最新的量产技术：https：//www.bloomberg.com/news/articles/2026-09-08/asml-tsmc-samsung-back-12-inch-masks-for-ai-chips。三星计划从2028年开始使用这家荷兰公司的High-NA EUV光刻机：https：//the-decoder.com/chipmakers-prepare-for-the-angstrom-age-with-successful-tests-of-next-gen-lithography-machines/，台积电则于2030年投入生产。两者都加入英特尔，英特尔已拥有这些机器运行。单台成本高达4亿美元。","ASML是全球唯一生产极紫外光刻技术的制造商，这些设备是构建最强大AI加速器所需的设备。该公司于2019年推出了更简单的低自然形功版本，此后与客户合作推广更复杂的高自然非和系统。","该交易依赖于技术上的一个小而关键的转变。这四家公司计划将光罩从现有的六英寸标准提升到十二英寸。光罩是一种模板，用于保存芯片的电路图案。在光刻技术中，光线穿过该掩膜，覆盖有感光材料的硅晶圆，将图案转移到晶圆上，晶体管和电路路径由此形成。","遮罩越大，单次曝光中能拍摄的面积就越大。由于6英寸限制限制了单个芯片的尺寸，制造商不得不垂直堆叠芯片并以复杂方式连接，这增加了成本和复杂度。","这一转变长期以来被视为复杂且昂贵。但ASML技术主管Marco Pieters称，协调推进可使高NA机器的吞吐量提升40%，简化设计流程，他称这是一个巨大的机遇。台积电和ASML计划在2031年前开发12英寸口罩测试线，高NA工具的量产预计于2033年。","台积电直到现在一直保持谨慎，认为生产率的提升尚不足以支撑更高的成本。现在公司正在改变方向。这对ASML很重要，因为台积电约占其收入的16%。与三星和英特尔一起，这三大客户都已经参与其中。三星是最大的存储芯片制造商之一，计划从2028年开始在存储芯片上使用高NA技术，而这些芯片的价格目前因AI数据中心的需求正迅速上涨。","与此同时，据《金融时报》报道，华为正在推动从中国半导体供应链中剔除外国技术，并绕开涵盖ASML重要技术的西方出口管制：https://www.ft.com/content/36333a53-4063-4aad-8df9-8d2f9d0048a3。该公司正在整个光刻链条上进行投资，并协助与像中芯国际这样的领先晶圆厂达成交易。","中国并未专注于最先进的EUV技术，而是关注DUV。DUV是深紫外（Deep Ultraviolet）的缩写，波长为193纳米，而EUV的波长则只有13.5纳米。较短的波长可以制造更精细的结构，从而生产最先进的芯片。DUV是一种较为成熟的老技术，适用于全球大多数芯片的生产。通过所谓的多重曝光技术，即通过多个曝光步骤叠加图案，也可以制造更先进的半导体，但相较EUV需要付出更大的努力和成本。","据《金融时报》报道，华为努力的核心是上海的设备制造商宇量盛，该公司帮助开发了中国第一台先进的DUV设备。据称，宇量盛由SiCarrier分拆而出，《金融时报》表示SiCarrier与华为关系密切，而华为对此予以否认。这台设备正在中芯国际和华为自有生产线进行测试，目前应用于较为简单的半导体。宇量盛计划在年底前生产十二台DUV设备，但仍远落后于ASML。","伯恩斯坦分析师林清远表示，华为在中国DUV发展中扮演项目管理角色，而仅有DUV原型设备是不够的。你需要成千上万的供应商和客户协同工作，并且有一个中央协调力量。","最大瓶颈仍然是投影镜头和光源。根据《金融时报》的报道，裕量升使用蔡司的镜头。公司表示，它只向ASML出售光学产品。但内部人士指出存在二级市场。华为的风险投资部门弥博同时也支持蔡司的竞争对手，如福建智启光电和光源开发商北京锐视激光，使其在这方面也能更加独立。","保持人工智能最新动态。清晰、有用，无废话。","关注《解码器》获取AI新闻、背景故事和专家分析。","解码器：https://the-decoder.com/"]},"en":{"title":"ASML has locked TSMC, Samsung, and Intel into adoption of High-NA EUV, while Huawei is pushing for China's DUV to reduce dependence","summary":"According to Bloomberg, Samsung plans to start mass production of ASML High-NA EUV starting in 2028, while TSMC plans to have Intel operating by 2030, with a unit costing as much as $400 million; Four companies also plan to upgrade photomasks from six inches to twelve inches. ASML's technical lead claims High-NA capacity could increase by 40%. TSMC and ASML plan to build a test line in 2031 and start production in 2033.","category":"Industry","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML has locked TSMC, Samsung, and Intel into adoption of High-NA EUV, while Huawei is pushing for China's DUV to reduce dependence - Aioga AI News","description":"According to Bloomberg, Samsung plans to start mass production of ASML High-NA EUV starting in 2028, while TSMC plans to have Intel operating by 2030, with a unit costing as much a...","url":"https://www.aioga.com/en/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:01:32.653Z"},"ja":{"title":"ASMLはTSMC、サムスン、インテルに高NA EUVの採用を強制し、一方ファーウェイは依存を減らすために中国のDUV導入を推進しています","summary":"ブルームバーグによると、サムスンは2028年からASMLハイNA EUVの量産を開始する計画であり、TSMCは2030年までにインテルの稼働を計画しており、1ユニットのコストは最大4億ドルに達する予定です。また、4社はフォトマスクを6インチから12インチにアップグレードする計画です。ASMLの技術リーダーは、ハイNAの生産能力が40%増加する可能性があると主張しています。TSMCとASMLは2031年にテストラインを構築し、2033年に生産を開始する計画です。","category":"業界動向","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASMLはTSMC、サムスン、インテルに高NA EUVの採用を強制し、一方ファーウェイは依存を減らすために中国のDUV導入を推進しています - Aioga AIニュース","description":"ブルームバーグによると、サムスンは2028年からASMLハイNA EUVの量産を開始する計画であり、TSMCは2030年までにインテルの稼働を計画しており、1ユニットのコストは最大4億ドルに達する予定です。また、4社はフォトマスクを6インチから12インチにアップグレードする計画です。ASMLの技術リーダーは、ハイNAの生産能力が40%増加する可能性があると主...","url":"https://www.aioga.com/ja/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:01:33.471Z"},"ko":{"title":"ASML은 TSMC, 삼성, 인텔을 고자연 EUV 도입에 묶었고, 화웨이는 중국의 DUV를 추진해 의존도를 줄이려 하고 있다","summary":"블룸버그에 따르면, 삼성은 2028년부터 ASML 하이-NA EUV의 대량 생산을 시작할 계획이며, TSMC는 2030년까지 인텔을 운영할 계획이며, 한 대는 최대 4억 달러에 달할 예정입니다; 4개 회사는 포토마스크를 6인치에서 12인치로 업그레이드할 계획입니다. ASML의 기술 리더는 하이-NA 용량이 40% 증가할 수 있다고 주장합니다. TSMC와 ASML은 2031년에 테스트 라인을 구축하고 2033년에 생산을 시작할 계획입니다.","category":"업계 동향","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML은 TSMC, 삼성, 인텔을 고자연 EUV 도입에 묶었고, 화웨이는 중국의 DUV를 추진해 의존도를 줄이려 하고 있다 - Aioga AI 뉴스","description":"블룸버그에 따르면, 삼성은 2028년부터 ASML 하이-NA EUV의 대량 생산을 시작할 계획이며, TSMC는 2030년까지 인텔을 운영할 계획이며, 한 대는 최대 4억 달러에 달할 예정입니다; 4개 회사는 포토마스크를 6인치에서 12인치로 업그레이드할 계획입니다. ASML의 기술 리더는 하이-NA 용량이 40% 증가할...","url":"https://www.aioga.com/ko/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:01:42.649Z"},"es":{"title":"ASML ha obligado a TSMC, Samsung e Intel a adoptar el EUV de alta NA, mientras que Huawei impulsa el DUV de China para reducir la dependencia","summary":"Según Bloomberg, Samsung planea iniciar la producción en masa de ASML High-NA EUV a partir de 2028, mientras que TSMC planea tener Intel operativa para 2030, con un coste unitario de hasta 400 millones de dólares; Cuatro empresas también planean actualizar las fotomáscaras de seis pulgadas a doce pulgadas. El líder técnico de ASML afirma que la capacidad de alta NA podría aumentar un 40%. TSMC y ASML planean construir una línea de pruebas en 2031 y comenzar la producción en 2033.","category":"Industria","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML ha obligado a TSMC, Samsung e Intel a adoptar el EUV de alta NA, mientras que Huawei impulsa el DUV de China para reducir la dependencia - Aioga Noticias de IA","description":"Según Bloomberg, Samsung planea iniciar la producción en masa de ASML High-NA EUV a partir de 2028, mientras que TSMC planea tener Intel operativa para 2030, con un coste unitario...","url":"https://www.aioga.com/es/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:01:42.547Z"},"fr":{"title":"ASML a verrouillé TSMC, Samsung et Intel dans l’adoption de l’EUV à haute NA, tandis que Huawei pousse pour le DUV chinois afin de réduire la dépendance","summary":"Selon Bloomberg, Samsung prévoit de commencer la production de masse d’ASML High-NA EUV à partir de 2028, tandis que TSMC prévoit d’avoir Intel opérationnel d’ici 2030, avec un coût unitaire pouvant atteindre 400 millions de dollars ; Quatre entreprises prévoient également de mettre à niveau les photomasques de six pouces à douze pouces. Le lead technique d’ASML affirme que la capacité à haute énergie d’atomie sanitaire pourrait augmenter de 40 %. TSMC et ASML prévoient de construire une ligne d’essai en 2031 et de commencer la production en 2033.","category":"Industrie","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML a verrouillé TSMC, Samsung et Intel dans l’adoption de l’EUV à haute NA, tandis que Huawei pousse pour le DUV chinois afin de réduire la dépendance - Aioga Actualités IA","description":"Selon Bloomberg, Samsung prévoit de commencer la production de masse d’ASML High-NA EUV à partir de 2028, tandis que TSMC prévoit d’avoir Intel opérationnel d’ici 2030, avec un coû...","url":"https://www.aioga.com/fr/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:01:51.856Z"},"de":{"title":"ASML hat TSMC, Samsung und Intel an die Einführung von High-NA-EUV gebunden, während Huawei darauf drängt, Chinas DUV zu verringern, um die Abhängigkeit zu verringern","summary":"Laut Bloomberg plant Samsung, ab 2028 mit der Massenproduktion von ASML High-NA EUV zu beginnen, während TSMC plant, Intel bis 2030 in Betrieb zu nehmen, mit einer Einheit von bis zu 400 Millionen US-Dollar; Vier Unternehmen planen außerdem, die Fotomasken von sechs Zoll auf zwölf Zoll aufzurüsten. Der technische Leiter von ASML behauptet, dass die High-NA-Kapazität um 40 % steigen könnte. TSMC und ASML planen, 2031 eine Testlinie zu bauen und die Produktion 2033 aufzunehmen.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML hat TSMC, Samsung und Intel an die Einführung von High-NA-EUV gebunden, während Huawei darauf drängt, Chinas DUV zu verringern, um die Abhängigkeit zu verringern - Aioga KI-News","description":"Laut Bloomberg plant Samsung, ab 2028 mit der Massenproduktion von ASML High-NA EUV zu beginnen, während TSMC plant, Intel bis 2030 in Betrieb zu nehmen, mit einer Einheit von bis...","url":"https://www.aioga.com/de/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:01:52.098Z"},"pt-BR":{"title":"A ASML trancou TSMC, Samsung e Intel na adoção do EUV de alta NA, enquanto a Huawei está pressionando para que o DUV da China reduza a dependência","summary":"Segundo a Bloomberg, a Samsung planeja iniciar a produção em massa do ASML High-NA EUV a partir de 2028, enquanto a TSMC planeja ter a Intel operando até 2030, com uma unidade que custará até US$ 400 milhões; Quatro empresas também planejam atualizar as fotomáscaras de seis polegadas para doze polegadas. A liderança técnica da ASML afirma que a capacidade de alta NA pode aumentar 40%. TSMC e ASML planejam construir uma linha de testes em 2031 e iniciar a produção em 2033.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"A ASML trancou TSMC, Samsung e Intel na adoção do EUV de alta NA, enquanto a Huawei está pressionando para que o DUV da China reduza a dependência - Aioga Notícias de IA","description":"Segundo a Bloomberg, a Samsung planeja iniciar a produção em massa do ASML High-NA EUV a partir de 2028, enquanto a TSMC planeja ter a Intel operando até 2030, com uma unidade que...","url":"https://www.aioga.com/pt-BR/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:01.260Z"},"ru":{"title":"ASML обеспечила TSMC, Samsung и Intel внедрением High-NA EUV, в то время как Huawei настаивает на использовании китайского DUV для снижения зависимости","summary":"По данным Bloomberg, Samsung планирует начать массовое производство ASML High-NA EUV начиная с 2028 года, а TSMC планирует запустить Intel к 2030 году, стоимостью устройства составят до 400 миллионов долларов; Четыре компании также планируют модернизировать фотомаски с шести до двенадцати дюймов. Технический руководитель ASML утверждает, что мощность High-NA может увеличиться на 40%. TSMC и ASML планируют построить тестовую линию в 2031 году и начать производство в 2033 году.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML обеспечила TSMC, Samsung и Intel внедрением High-NA EUV, в то время как Huawei настаивает на использовании китайского DUV для снижения зависимости - Aioga Новости ИИ","description":"По данным Bloomberg, Samsung планирует начать массовое производство ASML High-NA EUV начиная с 2028 года, а TSMC планирует запустить Intel к 2030 году, стоимостью устройства состав...","url":"https://www.aioga.com/ru/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:01.420Z"},"ar":{"title":"قامت ASML بتأمين TSMC وسامسونج وإنتل في تبني EUV عالي الNA، بينما تدفع هواوي نحو تقليل الاعتماد على DUV الصينية","summary":"وفقا لبلومبرغ، تخطط سامسونج لبدء الإنتاج الضخم لجهاز ASML عالي الNA EUV بدءا من عام 2028، بينما تخطط TSMC لتشغيل إنتل بحلول عام 2030، بتكلفة وحدة تصل إلى 400 مليون دولار؛ كما تخطط أربع شركات لترقية أقنعة الضوء من ست بوصات إلى اثني عشر بوصة. يدعي قائد ASML الفني أن سعة High-NA قد تزداد بنسبة 40٪. تخطط TSMC وASML لبناء خط اختبار في 2031 وبدء الإنتاج في 2033.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"قامت ASML بتأمين TSMC وسامسونج وإنتل في تبني EUV عالي الNA، بينما تدفع هواوي نحو تقليل الاعتماد على DUV الصينية - Aioga أخبار الذكاء الاصطناعي","description":"وفقا لبلومبرغ، تخطط سامسونج لبدء الإنتاج الضخم لجهاز ASML عالي الNA EUV بدءا من عام 2028، بينما تخطط TSMC لتشغيل إنتل بحلول عام 2030، بتكلفة وحدة تصل إلى 400 مليون دولار؛ كما تخطط...","url":"https://www.aioga.com/ar/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:10.534Z"},"hi":{"title":"ASML ने TSMC, Samsung, और Intel को हाई-NA EUV को अपनाने में बंद कर दिया है, जबकि हुआवेई निर्भरता कम करने के लिए चीन के DUV पर जोर दे रहा है","summary":"ब्लूमबर्ग के अनुसार, सैमसंग ने 2028 में शुरू होने वाले एएसएमएल हाई-एनए ईयूवी का बड़े पैमाने पर उत्पादन शुरू करने की योजना बनाई है, जबकि टीएसएमसी ने 2030 तक इंटेल को संचालित करने की योजना बनाई है, जिसकी लागत $ 400 मिलियन तक है; चार कंपनियां फोटोमास्क को छह इंच से बारह इंच तक अपग्रेड करने की भी योजना बना रही हैं। एएसएमएल की तकनीकी लीड का दावा है कि हाई-एनए क्षमता 40% तक बढ़ सकती है। टीएसएमसी और एएसएमएल ने 2031 में एक परीक्षण लाइन बनाने और 2033 में उत्पादन शुरू करने की योजना बनाई है।","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML ने TSMC, Samsung, और Intel को हाई-NA EUV को अपनाने में बंद कर दिया है, जबकि हुआवेई निर्भरता कम करने के लिए चीन के DUV पर जोर दे रहा है - Aioga AI समाचार","description":"ब्लूमबर्ग के अनुसार, सैमसंग ने 2028 में शुरू होने वाले एएसएमएल हाई-एनए ईयूवी का बड़े पैमाने पर उत्पादन शुरू करने की योजना बनाई है, जबकि टीएसएमसी ने 2030 तक इंटेल को संचालित करने की...","url":"https://www.aioga.com/hi/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:10.781Z"},"it":{"title":"ASML ha vincolato TSMC, Samsung e Intel all'adozione di EUV ad alta NA, mentre Huawei spinge per il DUV cinese per ridurre la dipendenza","summary":"Secondo Bloomberg, Samsung prevede di iniziare la produzione di massa di ASML High-NA EUV a partire dal 2028, mentre TSMC prevede di avere Intel operativa entro il 2030, con un'unità che costa fino a 400 milioni di dollari; Quattro aziende prevedono inoltre di aggiornare le fotomaschere da sei pollici a dodici pollici. Il lead tecnico di ASML afferma che la capacità ad alta potenza di NA potrebbe aumentare del 40%. TSMC e ASML prevedono di costruire una linea di test nel 2031 e iniziare la produzione nel 2033.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML ha vincolato TSMC, Samsung e Intel all'adozione di EUV ad alta NA, mentre Huawei spinge per il DUV cinese per ridurre la dipendenza - Aioga Notizie IA","description":"Secondo Bloomberg, Samsung prevede di iniziare la produzione di massa di ASML High-NA EUV a partire dal 2028, mentre TSMC prevede di avere Intel operativa entro il 2030, con un'uni...","url":"https://www.aioga.com/it/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:20.131Z"},"nl":{"title":"ASML heeft TSMC, Samsung en Intel vastgezet in de adoptie van High-NA EUV, terwijl Huawei aandringt op het verminderen van de afhankelijkheid van China's DUV","summary":"Volgens Bloomberg is het de bedoeling dat Samsung vanaf 2028 met massaproductie van ASML High-NA EUV begint, terwijl TSMC van plan is om Intel in 2030 operationeel te laten werken, met een eenheid die tot wel 400 miljoen dollar kost; Vier bedrijven zijn ook van plan fotomaskers te upgraden van zes inch naar twaalf inch. De technische leider van ASML beweert dat de capaciteit van High-NA met 40% kan toenemen. TSMC en ASML zijn van plan in 2031 een testlijn te bouwen en in 2033 met de productie te beginnen.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML heeft TSMC, Samsung en Intel vastgezet in de adoptie van High-NA EUV, terwijl Huawei aandringt op het verminderen van de afhankelijkheid van China's DUV - Aioga AI-nieuws","description":"Volgens Bloomberg is het de bedoeling dat Samsung vanaf 2028 met massaproductie van ASML High-NA EUV begint, terwijl TSMC van plan is om Intel in 2030 operationeel te laten werken,...","url":"https://www.aioga.com/nl/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:19.929Z"},"tr":{"title":"ASML, TSMC, Samsung ve Intel'i Yüksek NA EUV'yi benimsemeye kilitledi, Huawei ise bağımlılığı azaltmak için Çin'in DUV'sini talep ediyor","summary":"Bloomberg'e göre, Samsung 2028'den itibaren ASML High-NA EUV'nin seri üretimine başlamayı planlarken, TSMC Intel'i 2030'a kadar işletmeye başlatmayı ve bir birimin maliyeti 400 milyon dolara kadar çıkacak; Dört şirket ayrıca fotomaskeleri altı inçten on iki inçeye yükseltmeyi planlıyor. ASML'nin teknik lideri, High-NA kapasitesinin %40 artabileceğini iddia ediyor. TSMC ve ASML 2031'de bir test hattı inşa etmeyi ve 2033'te üretime başlamayı planlıyor.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML, TSMC, Samsung ve Intel'i Yüksek NA EUV'yi benimsemeye kilitledi, Huawei ise bağımlılığı azaltmak için Çin'in DUV'sini talep ediyor - Aioga AI Haberleri","description":"Bloomberg'e göre, Samsung 2028'den itibaren ASML High-NA EUV'nin seri üretimine başlamayı planlarken, TSMC Intel'i 2030'a kadar işletmeye başlatmayı ve bir birimin maliyeti 400 mil...","url":"https://www.aioga.com/tr/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:29.879Z"},"vi":{"title":"ASML đã khóa TSMC, Samsung và Intel áp dụng High-NA EUV, trong khi Huawei đang thúc đẩy DUV của Trung Quốc để giảm sự phụ thuộc","summary":"Theo Bloomberg, Samsung dự định bắt đầu sản xuất hàng loạt ASML High-NA EUV bắt đầu từ năm 2028, trong khi TSMC dự kiến Intel sẽ vận hành vào năm 2030, với chi phí lên tới 400 triệu USD; Bốn công ty cũng dự định nâng cấp mặt nạ quang từ 6 inch lên 12 inch. Trưởng nhóm kỹ thuật của ASML cho biết công suất High-NA có thể tăng 40%. TSMC và ASML dự kiến xây dựng dây chuyền thử nghiệm vào năm 2031 và bắt đầu sản xuất vào năm 2033.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML đã khóa TSMC, Samsung và Intel áp dụng High-NA EUV, trong khi Huawei đang thúc đẩy DUV của Trung Quốc để giảm sự phụ thuộc - Tin tức AI Aioga","description":"Theo Bloomberg, Samsung dự định bắt đầu sản xuất hàng loạt ASML High-NA EUV bắt đầu từ năm 2028, trong khi TSMC dự kiến Intel sẽ vận hành vào năm 2030, với chi phí lên tới 400 triệ...","url":"https://www.aioga.com/vi/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:29.414Z"},"id":{"title":"ASML telah mengunci TSMC, Samsung, dan Intel untuk mengadopsi EUV High-NA, sementara Huawei mendorong DUV China untuk mengurangi ketergantungan","summary":"Menurut Bloomberg, Samsung berencana memulai produksi massal ASML High-NA EUV mulai tahun 2028, sementara TSMC berencana agar Intel beroperasi pada tahun 2030, dengan unit senilai hingga $400 juta; Empat perusahaan juga berencana meningkatkan photomask dari enam inci menjadi dua belas inci. Pimpinan teknis ASML mengklaim kapasitas High-NA bisa meningkat sebesar 40%. TSMC dan ASML berencana membangun lini uji coba pada tahun 2031 dan memulai produksi pada tahun 2033.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML telah mengunci TSMC, Samsung, dan Intel untuk mengadopsi EUV High-NA, sementara Huawei mendorong DUV China untuk mengurangi ketergantungan - Berita AI Aioga","description":"Menurut Bloomberg, Samsung berencana memulai produksi massal ASML High-NA EUV mulai tahun 2028, sementara TSMC berencana agar Intel beroperasi pada tahun 2030, dengan unit senilai...","url":"https://www.aioga.com/id/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:38.835Z"},"th":{"title":"ASML ได้ล็อก TSMC, Samsung และ Intel ให้ใช้ High-NA EUV ขณะที่ Huawei กําลังผลักดันให้จีนใช้ DUV เพื่อลดการพึ่งพา","summary":"ตามรายงานของ Bloomberg Samsung มีแผนจะเริ่มผลิต ASML High-NA EUV จํานวนมากในปี 2028 ขณะที่ TSMC วางแผนให้ Intel ดําเนินงานภายในปี 2030 โดยมีราคาถึง 400 ล้านดอลลาร์;สี่บริษัทยังวางแผนจะอัปเกรดโฟโตมาสก์จาก 6 นิ้วเป็น 12 นิ้วผู้นําทางเทคนิคของ ASML ระบุว่าความจุของ High-NA อาจเพิ่มขึ้น 40%TSMC และ ASML วางแผนสร้างสายทดสอบในปี 2031 และเริ่มผลิตในปี 2033","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML ได้ล็อก TSMC, Samsung และ Intel ให้ใช้ High-NA EUV ขณะที่ Huawei กําลังผลักดันให้จีนใช้ DUV เพื่อลดการพึ่งพา - ข่าว AI Aioga","description":"ตามรายงานของ Bloomberg Samsung มีแผนจะเริ่มผลิต ASML High-NA EUV จํานวนมากในปี 2028 ขณะที่ TSMC วางแผนให้ Intel ดําเนินงานภายในปี 2030 โดยมีราคาถึง 400 ล้านดอลลาร์;สี่บริษัทยังวางแ...","url":"https://www.aioga.com/th/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:39.027Z"},"pl":{"title":"ASML zobowiązało TSMC, Samsunga i Intela do przyjęcia High-NA EUV, podczas gdy Huawei naciska na chińskie DUV, aby zmniejszyć zależność","summary":"Według Bloomberga, Samsung planuje rozpocząć masową produkcję ASML High-NA EUV od 2028 roku, natomiast TSMC planuje uruchomić Intel do 2030 roku, a jednostka kosztuje nawet 400 milionów dolarów; Cztery firmy planują również modernizację fotomasek z sześciu cali do dwunastu cali. Techniczna przewaga ASML twierdzi, że moce High-NA mogą wzrosnąć o 40%. TSMC i ASML planują zbudować linię testową w 2031 roku i rozpocząć produkcję w 2033 roku.","category":"行业动态","source":"The Decoder：AI News（RSS）","aggregationSource":"The Decoder：AI News（RSS）","pageTitle":"ASML zobowiązało TSMC, Samsunga i Intela do przyjęcia High-NA EUV, podczas gdy Huawei naciska na chińskie DUV, aby zmniejszyć zależność - Aioga Wiadomości AI","description":"Według Bloomberga, Samsung planuje rozpocząć masową produkcję ASML High-NA EUV od 2028 roku, natomiast TSMC planuje uruchomić Intel do 2030 roku, a jednostka kosztuje nawet 400 mil...","url":"https://www.aioga.com/pl/news/cmtstpplu04zrrokatldmtyok/","contentTranslated":true,"sourceHash":"561c8ea72bd426c4","translatedAt":"2026-09-08T16:02:48.043Z"}},"evidenceTier":"verified-news","reviewStatus":"automated-ingest","indexable":true,"editorialCover":""}}