Dongfang Suanxin will debut the world's first software-defined near-memory computing 3D AI chip DF1000 at WAIC 2026 and receive the 2026 SAIL Award. The ch...
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Dongfang Suanxin will debut the world's first software-defined near-memory computing 3D AI chip
DF1000 at WAIC 2026 and receive the 2026 SAIL Award. The chip is based on a fully domestic supply chain and uses 3D hybrid bonded wafer-level stacking. It achieves 520 TFLOPS@BF16 computing power under a 14nm process. Through software-defined chip technology, it enables decoupling and dynamic reconfiguration of hardware and software, aiming to provide a domestic computing foundation for the AI industry.
Original Article Excerpt
IT之家:https://www.ithome.com/ 7 月 18 日消息,2026 世界人工智能大会(WAIC 2026)今天在上海举行。东方算芯在会上首次展出全球首颗软件定义近存计算 3D AI 芯片 ——DF1000, 并荣获 2026 SAIL 奖(卓越人工智能引领者奖) 。
据介绍,DF1000 依托全国产供应链打造, 通过空间并行与时分复用设计提升硬件利用率 , 算力可达 520 TFLOPS 。采用 3D 混合键合技术实现晶圆级堆叠,有效提升访存带宽,降低供应链依赖,拥有自主编程框架和软件生态,可为 AI 产业提供稳定的国产算力底座。
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Dongfang Suanxin will debut the world's first software-defined near-memory computing 3D AI chip DF1000 at WAIC 2026 and receive the 2026 SAIL Award. The ch...
IT之家(RSS)2026-07-18T02:39:54.000Z
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