LG Electronics is cooperating with South Korean chip design companies to build a multi-layer AIoT chip platform open to local fabless companies, aiming to...
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LG Electronics is cooperating with South Korean chip design companies to build a multi-layer AIoT
chip platform open to local fabless companies, aiming to reduce development costs and integrate with its AI models and software to form a complete AI home appliance stack. The chips are divided into three tiers: high-end computing power above 30 TOPS, supporting GenAI, emotional intent inference, and 3D gesture recognition; mid-range 10 TOPS, targeting real-time environment-aware home appliances; entry-level 1.5 TOPS, supporting wake words and energy consumption optimization.
Original Article Excerpt
IT之家:https://www.ithome.com/ 8 月 6 日消息,韩媒 ETNEWS 当地时间 4 日报道称, LG 电子正与该国芯片设计企业合作构建一套多层的 AIoT 芯片体系 ,以满足 LG 电子旗下品类众多、型号繁杂的智能家电产品矩阵的智能化的需求。
报道指出,LG 电子 希望打造一个向韩国 Fabless 企业开放的 AIoT 芯片平台 ,以降低特定芯片开发的时间和金钱成本。这些芯片将与 LG 电子的人工智能模型、软件、服务一道构建完整的 AI 家电堆栈。
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LG Electronics is cooperating with South Korean chip design companies to build a multi-layer AIoT chip platform open to local fabless companies, aiming to...
IT之家(RSS)2026-08-06T02:54:38.000Z
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